LS050I16-MP-V1: 5.0-Inch Round TFT LCD Module, 1080×1080 Resolution, 16.7M Colors, MIPI Interface, 50-Pin, HX8399C Driver

LS050I16-MP-V1: 5.0-Inch Round TFT LCD Module, 1080×1080 Resolution, 16.7M Colors, MIPI Interface, 50-Pin, HX8399C Driver

Product Subtitle / Keywords

5.0 Inch Round Display, 1080(H)×1080(V) Resolution, Transmissive TFT-LCD, LTPS TFT, MIPI-DSI Interface (4 Data Lanes), COG+FPC+B/L, 16.7M Colors, 50-Pin, HX8399C Driver, ADS (Full Viewing Angle), 70% NTSC (Typ.), -20°C~60°C Operating Temperature, 2019.09.16

1. Executive Summary & Product Positioning

The LS050I16-MP-V1, developed by Lixin (Wan'an) Intelligent Display Technology Co., Ltd. (立信(万安)智显科技有限公司), is a 5.0-inch round color active matrix TFT-LCD panel using LTPS TFTs (Low Temperature Poly-Silicon Thin Film Transistors) as active switching devices.

This product specification (Preliminary, Pre.0, 2019.9.16) serves as the definitive technical document, defining its structural composition (COG+FPC+B/L), general specifications, absolute maximum ratings, electrical characteristics, complete MIPI-DSI interface connection (50-pin), signal timing, power on/off sequence, optical specifications, mechanical characteristics, reliability tests, and handling cautions. It delivers a unique FHD (1080×1080) resolution on a circular active area with 16.7M-color display capability, driven by the HX8399C controller.

The document provides the core parameters necessary for system integration into specialized embedded display applications requiring a high-resolution round display with a high-speed serial interface. The unequivocal recommendation for engineers is to strictly adhere to the electrical specifications, interface timing, and mechanical tolerances described herein to ensure reliable performance and compatibility.

2. Detailed Product Overview & Architecture

  • Core Technology: Color active matrix TFT-LCD Panel using LTPS TFT's (Thin Film Transistors) as an active switching devices. This model is composed of a TFT-LCD Panel, a driving circuit and a back light system.
  • Display Mode: Transmissive type display operating in the Normally Black mode.
  • Display Format: Graphic 1080(H) × 1080(V) pixel array.
  • Display Characteristics: Capable of displaying up to 16.7 million colors. Each pixel is divided into Red, Green, Blue dots which are arranged in 1pixel 2 domain.
  • Module Construction: COG (Chip-On-Glass) + FPC (Flexible Printed Circuit) + B/L (Backlight Unit).
  • Input Data: MIPI-DSI differential signal.
  • Viewing Direction (Human Eye): U/D/L/R free viewing direction (ADS - Advanced Super Dimension Switch, full viewing angle).
  • Drive IC: HX8399C.
  • Connector Part Number: DF40C-50DP-0.4V(51), HIrose (50-pin).
  • Approval Status: ☑ Preliminary specification (as per cover page).

3. Exhaustive Technical Specifications

3.1 Mechanical & Physical Specifications

Panel Size (Diagonal) 5.0 inch (Round)
Active Area (AA) 127.008 (H) × 127.008 (V) mm (circle)
Number of Pixels / Resolution 1080(H) RGB × 1080(V) pixels
Pixel Pitch 0.1176 (H) × 0.1176 (V) mm
Pixel Arrangement 1pixel 2domain
Dimensional Outline 136.531 (H) × 132.208 (V) × 1.98 (D) mm (Typ.)
Panel Size (LCD Part) 129.808(H) × 133.258(V) mm
CF Size 129.808(H) × 130.908(V) mm
Glass Thickness 0.2t Glass (Single)
Color Gamut (NTSC) 70% (Typ.), 65% (Min.)
Color Coordinates Wx:0.306, Wy:0.318
Product Application Industrial Control Products (工控产品)

3.2 Electrical & Interface Specifications

3.2.1 Absolute Maximum Ratings

Parameter Symbol Min. Max. Unit
Logic Power Supply Voltage IOVCC -0.3 +3.6 V
Analog Positive Power Supply VSP -0.3 +6.6 V
Analog Negative Power Supply VSN 0 -6.6 V
Back-light Power Supply Voltage VLED - 37.2 (Typ.) / 38.4 (Max.) V
Back-light LED Current ILED - 20 mA
Operating Temperature TOT -20 60 °C
Storage Temperature TST -30 75 °C

3.2.2 Interface Connection (50-pin Connector)

The module uses a 50-pin connector (DF40C-50DP-0.4V(51), HIrose). The interface includes:

  • MIPI-DSI Interface: Uses 4 data lanes and 1 clock lane for high-speed serial data transmission. The block diagram shows MIPI-DSI differential signal input.
  • Power Supply: Requires IOVCC (1.8V) for logic, VSP (+5V) and VSN (-5V) for analog power.
  • Backlight: Dedicated LEDA (Anode) and LEDK (Cathode) pins. Backlight uses 6 chip white LEDs. Drive condition: VF=37.2V (Typ.), IF=20mA.
  • Control: RESET pin for hardware reset.
  • Ground: Multiple GND pins for signal and power return.

3.2.3 Signal Timing Specification

Vertical Timing:

Parameter Symbol Min. Typ. Max. Unit
Vertical cycle VP 534+8xNL - - Line
Vertical low pulse width VS 2 - Note(1) Line
Vertical front porch VFP 2 - - Line
Vertical back porch VBP 2 - Note(1) Line
Vertical active area VDISP - 528+8xNL - Line
Vertical Refresh rate VRR - 60 - Hz

Horizontal Timing:

Parameter Symbol Min. Typ. Max. Unit
HS cycle HP H_RES+66 - - DCK
HS low pulse width HS 25 - - DCK
Horizontal back porch HBP 25 - - DCK
Horizontal front porch HFP 16 - - DCK
Horizontal active area HDISP - H_RES - DCK

3.2.4 Power ON/OFF Sequence

The document specifies a detailed power on/off sequence diagram. Key timing requirements include:

  • IOVCC must be established before VSP/VSN.
  • RESET pulse must be applied after power stabilization.
  • MIPI signals must be provided after RESET release.
  • Backlight should be enabled after all other signals are stable.

3.2.5 Backlight Unit

LED Configuration 6 chip white LEDs
Drive Condition VF = 37.2V (Typ.), IF = 20mA
LED Life-time 30,000 hrs (estimated time to 50% degradation of initial luminous)

3.3 Optical & Electro-Optical Characteristics

The document provides detailed optical measurement conditions and definitions:

  • Contrast Ratio (CR): Defined as Luminance (white raster) / Luminance (black raster).
  • Surface Luminance: Measured at the center point across the LCD surface, 50cm from the surface, with all pixels displaying white.
  • Uniformity: Measured at 9 points (as shown in Figure 2). Uniformity = (Min Luminance of 9 points / Max Luminance of 9 points) × 100%.
  • Color Chromaticity: Calculated from spectral data measured with all pixels in red, green, blue, and white. Measurements at the center of the module.
  • Response Time: Electro-optical response time measurements as per Figure 3.

3.4 Reliability Test

ESD Test Contact = 4KV, Air = 8KV

3.5 Version Record

Preliminary specification, Pre.0, dated 2019.9.16.

4. Application Guidelines & Critical Notes

Intended Use

  • Industrial control panels and human-machine interfaces (HMIs) requiring a round display
  • Smart home devices, smart speakers, and IoT display nodes
  • Automotive dashboard displays and instrument clusters
  • Medical equipment and specialized instrumentation
  • Any application requiring a unique, high-resolution round display with a high-speed serial interface

Critical Design Considerations

  1. Unique Round Display: This is a 5.0-inch round display with a circular active area. The mechanical design must accommodate the circular shape and the specific outline dimensions (136.531 x 132.208 x 1.98 mm).
  2. Interface (MIPI-DSI with 4 Data Lanes): This module uses a MIPI-DSI interface with 4 data lanes and 1 clock lane. The host MCU must have a MIPI-DSI controller that supports at least 4 data lanes.
  3. Power Supply: Requires IOVCC (1.8V), VSP (+5V), and VSN (-5V). The backlight requires a constant-current LED driver connected to LEDA (Anode) and LEDK (Cathode), set to 20 mA at approximately 37.2V.
  4. Mechanical Integration: Module outline: 136.531 x 132.208 x 1.98 mm. FPC: 50-pin connector (DF40C-50DP-0.4V(51), HIrose).
  5. Temperature Limits: Operating Temperature: -20°C to +60°C. Storage Temperature: -30°C to +75°C.
  6. Handling Cautions: The ITO pad area is susceptible to corrosion. Do not contact with HCFC, soldering flux, chlorine, sulfur, saliva, or fingerprints. Handle FPC with care. Use ESD protection. Remove protective film slowly at approximately 30-degree angle. Avoid displaying fixed patterns for long periods to prevent image sticking.

Handling & Compliance

  • The module is RoHS Compliant.
  • Observe standard ESD precautions during handling and assembly.
  • The module contains fragile glass and a 50-pin FPC – handle with care.
  • Avoid bending the FPC sharply, especially near the connector interface.
  • Storage environment: Relative humidity should be kept below 60%RH. Avoid direct sunshine or high temperature/humidity for long periods.

5. Conclusion & Design-In Support

The LS050I16-MP-V1 specification details a unique 5.0-inch round display module with FHD resolution (1080×1080), MIPI interface, and HX8399C driver — an excellent choice for applications requiring a distinctive, high-resolution round display with a high-speed serial interface.

Key Strengths

  • Unique Round Form Factor: The 5.0-inch circular active area provides a distinctive visual appearance for specialized applications.
  • High Resolution (FHD 1080×1080): Provides sharp, detailed image quality on the round display.
  • MIPI Interface with 4 Data Lanes: Provides high bandwidth for smooth video and animation playback.
  • High Color Depth: 16.7M colors (24-bit true color) provides excellent color reproduction.
  • Wide Viewing Angle: ADS (Full Viewing Angle) ensures consistent image quality from any direction.
  • High Color Gamut: 70% NTSC (Typ.) provides vibrant color performance.
  • LTPS Technology: Uses LTPS TFTs for higher performance and lower power consumption.
  • Industrial Application: Designed for industrial control products with a wide operating temperature range.

Main Design Focus

  • The critical design task is properly implementing the MIPI-DSI interface with 4 data lanes to ensure reliable high-speed data transfer and accommodating the unique round mechanical form factor.
  • Supporting requirements: Provide stable IOVCC (1.8V), VSP (+5V), and VSN (-5V) power. Provide a constant-current backlight driver set to 20 mA at 37.2V. Mechanical integration — the module outline is 136.531 x 132.208 x 1.98 mm. FPC connector — verify the 50-pin HIrose DF40C-50DP-0.4V(51) connector.

This module is an excellent choice for industrial control panels, smart home devices, automotive displays, and any application requiring a unique, high-resolution round display with a high-speed MIPI interface.