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LS0145I05-S-V1 1.45 inch TFT-LCD Module 172x320 262K Colors 4-Wire SPI (Serial Peripheral Interface)

LS0145I05-S-V1 1.45 inch TFT-LCD Module 172x320 262K Colors

Product Keywords: 1.45″ LCD Module, COG+FPC+B/L, 172(RGB)×320 Resolution, 262K Colors, Transmissive a-Si TFT-LCD, IPS, SPI Interface (4-line), 3 Chip-White LED Parallel (60mA), -20°C to +70°C Operation, Revision 1.0 (2026-07-08).

1. Executive Summary & Product Positioning

The LS0145I05-S-V1 is a 1.45-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module developed by 立信(万安)智显科技有限公司 (Lesson Smart Display Technology Co., Ltd). The panel size is 1.45 inch and the resolution is 172(RGB)*320, the panel can display up to 262k colors. This module is a COG (Chip-on-Glass) + FPC + B/L (Backlight) construction. The product specification was first released on 2026-07-07.

Product Positioning: This 1.45-inch module is well-suited for a wide range of applications requiring a compact, high-quality display with a wide viewing angle and a simple SPI interface. It is ideal for wearable devices, portable instruments, smart home controllers, and other embedded display systems.

2. Detailed Product Overview & Architecture

The module's architecture is designed for robust performance and easy integration. The primary components include:

  • TFT-LCD Panel: 1.45-inch diagonal, a-Si TFT active matrix, transmissive, IPS (In-Plane Switching). Resolution is 172(RGB) × 320 pixels.
  • Driver Circuit: The module integrates a driver IC, communicating via a 4-Wire SPI (Serial Peripheral Interface).
  • Backlight Unit (B/L): A white LED backlight with 3 Chip-White LEDs configured in parallel. The typical driving condition is IF=60mA, Vf=3V (TYP).
  • Mechanical Construction: COG (Chip-on-Glass) + FPC + B/L. The LCM module size is 19.39×36.28×1.88 mm (H×V×D).
  • Interface: The module communicates via a 10-pin FPC connector. The display interface is 4-Wire SPI (Serial Peripheral Interface).
  • Display Mode: Transmissive, IPS.
  • Viewing Direction: Full viewing angle (IPS).
  • RoHS: All materials are compliant with RoHS standards.

3. Exhaustive Technical Specifications

3.1 General & Mechanical Specifications

Item Specification
Display Size (Diagonal) 1.45 inches
Resolution (Dots) 172(RGB) × 320
Display Technology Active Matrix TFT, Transmissive, a-Si, IPS
Module Construction COG+FPC+B/L
Color Depth 262K Colors
Input Data Interface 4-Wire SPI (Serial)
Driver IC Integrated (ST7789P3 series compatible)
Module Size (H×V×D) 19.39 × 36.28 × 1.88 mm
Active Area (H×V) 17.39 × 32.35 mm
Display Mode Transmissive, IPS
Viewing Direction Full (IPS)
Backlight Type 3 Chip-White LEDs, Parallel
Operating Temperature -20°C to +70°C
Storage Temperature -30°C to +80°C
Environmental Compliance RoHS

3.2 Absolute Maximum Ratings

Stress beyond those listed may cause permanent damage to the device.

Item Symbol Min Max Unit Remark
Supply voltage VDD -0.3 4.6 V Derived
Storage temperature TSTR -30 80 °C -

3.3 Electrical Characteristics

3.3.1 Recommended DC Characteristics

Condition: VDDI=1.65 to 3.3V, VDD=2.4 to 3.3V, AGND=DGND=0V, Ta=25℃.

Item Symbol Min Typ Max Unit Remark
Supply voltage VDD 2.4 2.8 3.3 V Note1
Input Voltage (L level) VIL 0 --- 0.3*IOVCC V Note1
Input Voltage (H level) VIH 0.7*IOVCC --- IOVCC V Note1

3.3.2 Backlight LED Characteristics

The backlight consists of 3 Chip-White LEDs in parallel. The typical driving condition is IF=60mA, Vf=3V (TYP).

Parameter Symbol Min Typ Max Unit
Forward Voltage Vf - 3 - V
Forward Current (Total) IF - 60 - mA

3.4 Interface Pin Assignment (10-Pin FPC)

The module communicates via a 10-pin FPC connector. The interface is a 4-Wire Serial SPI.

PIN NO. Symbol I/O Description
1 SDA I/O Serial data input/output PIN
2 SCL I Serial clock pin
3 RS I Command and Data select pin
4 RESET I Reset pin.
5 CS I Chip select pin
6 GND P Ground
7 VDD P power supply
8 LEDK P Power for LED backlight cathode
9 LEDA P Power for LED backlight anode
10 GND P Ground

3.5 Serial Interface Timing (4-line serial)

The module communicates via a 4-wire SPI interface. The timing parameters for this interface are as follows:

Condition: VDDI=1.65 to 3.3V, VDD=2.4 to 3.3V, AGND=DGND=0V, Ta=25℃.

Signal Symbol Parameter MIN MAX Unit
CSX TCSS Chip select setup time (write) 15 - ns
CSX TCSH Chip select hold time (write) 15 - ns
CSX TCHW Chip select "H" pulse width 40 - ns
SCL TSCYCW Serial clock cycle (Write) 30 - ns
SCL TSHW SCL "H" pulse width (Write) 15 - ns
SCL TSLW SCL "L" pulse width (Write) 15 - ns
D/CX TDCS D/CX setup time TBD - ns
SDA (DIN) TSDS Data setup time 10 - ns
SDA (DIN) TSDH Data hold time 10 - ns

Note: The rising time and falling time (Tr, Tf) of input signal are specified at 15 ns or less. Logic high and low levels are specified as 30% and 70% of VDDI for Input signals. Some parameters are marked as "TBD" (To Be Defined). For precise timing requirements, please refer to the full official datasheet or the driver IC specification.

3.6 Power On/Off Sequence

The power-on/off sequence ensures proper initialization and shutdown to prevent damage.

3.6.1 Power On Sequence

The specification shows two options for the power-on sequence. In both cases, VDD (2.4V~3.3V) and VDDI (1.65V~3.3V) must be applied first.

  • Option 1: Host sends initial settings, then SLPOUT (0x11) command, then DISP ON (0x29) command.
  • Option 2: Host sends only SLPOUT (0x11) and DISP ON (0x29) commands.

Timing requirements: tPWON ≥ 5ms, tRPWIRES ≥ 10ms, TRESETL ≥ 10us. After SLPOUT command, wait 120ms before sending DISP ON command.

3.6.2 Power Off Sequence

The power-down sequence is illustrated in the specification. Key points include:

  • To exit sleep mode, the SLPOUT command is sent. The power-down must then occur after a minimum delay.
  • When powering down in sleep-out mode, the RESX pin must be held low for a minimum of 120ms before power is removed.
  • When powering down in sleep-in mode, the minimum hold time for RESX is 0ms.
  • The rising and falling times for power signals (TrPW, TfPW) and CSX (TrPW-CSX, TfPW-CSX) have no limit (+/- no limit).

3.7 Electro-Optical Characteristics

Measuring Condition: Ta=25°C, dark room.

Item Symbol Condition Min. Typ. Max. Unit Remark
Response time Tr +Tf θx = θy =0 --- 30 40 ms Note 1
Contrast Ratio CR θx = θy =0 --- 1500 --- - Note 2
Transmittance T% θx = θy =0 4.25 5.0 --- % -
Color Chromaticity (White) W x θx = θy =0 --- 0.291 --- - -
Color Chromaticity (White) W y θx = θy =0 --- 0.314 --- - -
Viewing angle (IPS) θT, θB, θL, θR CR > 10 --- 85 --- Deg. Note 3

3.8 Design Notes from Documentation

  • Mechanical Design Recommendations:
    • Suggested housing visible area (shell opening) should be 0.3mm smaller than the VAmds (Viewing Area) on each side. (Note 7)
    • Suggested housing foam opening should be 0.6mm larger than the VAmds on each side. (Note 8)
    • The edge of the Touch Panel (TP) must not contact any metal conductor. (Note 9)
  • B/L Driver: The backlight consists of 3 Chip-White LEDs in parallel (60mA total). A constant current driver for the backlight is required.
  • Interface: The module uses a 4-wire SPI interface for the LCD. The pinout includes Serial Clock (SCL), Serial Data (SDA), Data/Command select (RS), Chip Select (CS), and Reset.
  • Reset Timing: The reset pin (RESET) must be held low for at least 10μs to initiate a reset.
  • Power Sequence: The power-on sequence requires proper timing between VDD/VDDI ramping, RESET, and the SLPOUT/DISP ON commands. A 120ms delay is needed after SLPOUT before sending DISP ON.
  • ESD Protection: Silver paste (银浆点) is used for grounding. A yellow insulating tape (黄色绝缘胶纸) is placed on the back for insulation.
  • IPS Display: This module features IPS (In-Plane Switching) technology providing 85-degree wide viewing angles in all four directions.
  • RoHS: All materials are ROHS compliant.
  • General Tolerance: ±0.2mm for dimensions with decimal points.

4. Application Guidelines & Critical Notes

  • Power Supply: The module requires VDD (2.8V typical) power supply. Ensure the power supply is stable and has low ripple. The I/O voltage (VDDI) for the SPI interface is 1.65V~3.3V (typically 1.8V).
  • Interface: This module uses a standard 4-wire SPI protocol. The host processor must be configured for this protocol. The max SPI clock frequency should be calculated based on the minimum clock period of 30ns (Write).
  • Backlight Driver (External): A constant current driver is required to supply the backlight via the LEDA (Pin 9) and LEDK (Pin 8) pins. The required driving condition is 60mA total current at 3V typical forward voltage.
  • Reset: Ensure the RESET pin (Pin 4) is driven low for at least 10µs during power-on. After releasing reset, wait for the specified 5ms before sending the first command.
  • Power On/Off: Follow the specified power-on/off sequence strictly. Failure to do so may cause permanent damage. After sending SLPOUT command, wait 120ms before sending DISP ON.
  • Mechanical Mounting: Follow the mechanical design notes for the enclosure and foam opening to ensure proper fit and avoid damage to the glass and FPC.
  • Operating Temperature: The module operates from -20°C to +70°C. Satisfactory display performance is only guaranteed within this range.
  • Storage: Store the module in a clean environment, free from dust, moisture, and direct sunlight. Storage temperature range is -30°C to +80°C.
  • Handling Precautions: Handle the module with care to avoid damage to the glass or FPC. Ground yourself to prevent electrostatic discharge (ESD). The yellow insulating tape on the back should not be removed during installation.

5. Conclusion & Design-In Support

The LS0145I05-S-V1 from Lesson Smart Display Technology is a 1.45-inch IPS TFT-LCD module with a 4-wire SPI interface. It features a high contrast ratio (1500:1 typical), a full 85° viewing direction, a fast 30ms response time, and a robust mechanical design. It is a reliable, high-quality display solution suitable for a wide variety of embedded display applications.

For successful design-in, engineers should:

  • Obtain and review the complete, official Product Specification (Revision 1.0) for the full mechanical drawing and the driver IC datasheet for detailed initialization and timing parameters.
  • Design a clean 2.8V power supply for the LCD. Design a backlight constant current driver circuit capable of delivering 60mA at up to 3.3V.
  • Configure the host processor's SPI interface to match the timing specifications detailed in this datasheet. The minimum write cycle is 30ns.
  • Follow the power-on/off sequence carefully to ensure proper initialization and avoid damage.
  • Follow the mechanical design guidelines for the enclosure and foam opening to ensure proper fit and avoid damage.
  • Contact the manufacturer for evaluation modules, sample requests, and further technical support during the design-in phase.

This module is designed to provide a reliable and vibrant display solution for a wide array of applications.

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Eddie Chen
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