News

LS024I46-S-V1 2.4 inch TFT-LCD Module 240x320 262K Colors 4-Wire Serial Peripheral Interface

LS024I46-S-V1 2.4 inch TFT-LCD Module 240x320 262K Colors

Product Keywords: 2.4″ LCD Module, COG+FPC+B/L, 240(RGB)×320 Resolution, 262K Colors, Transmissive a-Si TFT-LCD, IPS, 4-SPI Interface, -10°C to +70°C Operation, AQL 0.65/1.5 Inspection.

1. Executive Summary & Product Positioning

The LS024I46-S-V1 is a 2.4-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module developed by 立信(万安)智显科技有限公司 (Lesson Smart Display Technology Co., Ltd). The panel size is 2.4 inch and the resolution is 240(RGB)*320, the panel can display up to 262k colors. This module is a COG (Chip-on-Glass) + FPC + B/L (Backlight) construction. The product specification was first released on 2026-07-06.

Product Positioning: This 2.4-inch module is well-suited for a wide range of applications requiring a compact, high-quality display with a wide viewing angle and a simple 4-wire SPI interface. It is ideal for handheld devices, portable instruments, smart home controllers, and other embedded display systems.

2. Detailed Product Overview & Architecture

The module's architecture is designed for robust performance and easy integration. The primary components include:

  • TFT-LCD Panel: 2.4-inch diagonal, a-Si TFT active matrix, transmissive, IPS (In-Plane Switching). Resolution is 240(RGB) × 320 pixels.
  • Driver Circuit: The module communicates via a 4-SPI (4-Wire Serial Peripheral Interface).
  • Backlight Unit (B/L): A white LED backlight with 4 Chip-White LEDs configured in parallel. The typical driving condition is IF=80mA, Vf=2.8~3.2V.
  • Mechanical Construction: COG (Chip-on-Glass) + FPC + B/L. The LCM module dimensions are 42.72 × 58.5 × 2.20 mm (H×V×D).
  • Interface: The module communicates via an 18-pin FPC connector. The display interface is 4-Wire SPI (Serial Peripheral Interface).
  • Display Mode: Transmissive, IPS.
  • Viewing Direction: Full viewing angle (IPS).
  • RoHS: All materials are compliant with RoHS standards.

3. Exhaustive Technical Specifications

3.1 General & Mechanical Specifications

Item Specification
Display Size (Diagonal) 2.4 inches
Resolution (Dots) 240(RGB) × 320
Display Technology Active Matrix TFT, Transmissive, a-Si, IPS
Module Construction COG+FPC+B/L
Color Depth 262K Colors
Input Data Interface 4-Wire SPI
Module Size (H×V×D) 42.72 × 58.5 × 2.20 mm
Active Area (H×V) 36.72 × 48.96 mm
Display Mode Transmissive, IPS
Backlight Type 4 Chip-White LEDs, Parallel
Operating Temperature -10°C to +70°C
Storage Temperature -20°C to +80°C
Environmental Compliance RoHS

3.2 Absolute Maximum Ratings

Stress beyond those listed may cause permanent damage to the device.

Item Symbol Min Max Unit Remark
Supply voltage VCC -0.3 4.6 V Note1 Note2
Supply voltage IOVCC -0.3 4.0 V Note1 Note2
Operating temperature TOPR -10 70 °C Note1 Note2
Storage temperature TSTR -20 80 °C Note1 Note2

3.3 Electrical Characteristics

3.3.1 Recommended DC Characteristics

Condition: Ta=25°C.

Item Symbol Min Typ Max Unit Remark
Supply voltage VCC 2.4 2.8 3.3 V Note1
Supply voltage IOVCC 1.65 1.8 3.3 V Note1
Input Voltage (L level) VIL 0 --- 0.3*IOVCC V Note1
Input Voltage (H level) VIH 0.7*IOVCC --- IOVCC V Note1

3.3.2 Backlight LED Characteristics

The backlight consists of 4 Chip-White LEDs in parallel. The typical driving condition is IF=80mA, Vf=2.8~3.2V.

Parameter Symbol Min Typ Max Unit
Forward Voltage Vf 2.8 - 3.2 V
Forward Current (Total) IF - 80 - mA

3.4 Interface Pin Assignment (18-Pin FPC)

The module communicates via an 18-pin FPC connector. The interface is 4-Wire SPI.

PIN NO. Symbol I/O Description
1 GND P Ground
2 VCI P Power supply
3 IOVCC P Power supply
4 TE O Tearing effect signal is used to synchronize MCU to frame memory writing.
5 SDA I Serial data input/output PIN
6 DC I Command and Data select pin
7 SCL I Serial clock pin
8 CS I Chip select pin
9 RESET I Reset pin.
10 GND P Ground
11 LEDA P Power for LED backlight anode
12 LEDK P Power for LED backlight cathode
13 TP_SDA/NC - TP I2C data / Not connect
14 TP_INT/NC - TP interrupt / Not connect
15 TP_SCL/NC - TP I2C clock / Not connect
16 TP_VDD/NC - TP power / Not connect
17 TP_RESET/NC - TP reset / Not connect
18 TP_GND/NC - TP ground / Not connect

3.5 Serial Interface Timing (4-line serial)

The module communicates via a 4-wire SPI interface. The timing parameters for this interface are as follows:

Condition: VDDI=1.65 to 3.3V, VDD=2.4 to 3.3V, AGND=DGND=0V, Ta=25℃.

Signal Symbol Parameter MIN MAX Unit
CSX TCSS Chip select setup time (write) TBD - ns
CSX TCSH Chip select hold time (write) TBD - ns
CSX TCHW Chip select "H" pulse width TBD - ns
SCL TSCYCW Serial clock cycle (Write) TBD - ns
SCL TSHW SCL "H" pulse width (Write) TBD - ns
SCL TSLW SCL "L" pulse width (Write) TBD - ns
D/CX TDCS D/CX setup time TBD - ns
SDA (DIN) TSDS Data setup time TBD - ns

Note: The manufacturer has marked the timing parameters as "TBD" (To Be Determined/Defined). For precise timing requirements, please refer to the full official datasheet or contact the manufacturer for the driver IC specification.

3.6 Electro-Optical Characteristics

Measuring Condition: Ta=25°C, dark room, 15min warm-up time.

Item Symbol Condition Min. Typ. Max. Unit Remark
Response time Tr+Tf θx = θy =0 -- 35 40 ms Note 1
Contrast Ratio CR θx = θy =0 900 1200 -- - Note 2
Transmittance T% θx = θy =0 4 4.7 -- % Note 4.3
Color Chromaticity (White) W x θx = θy =0 -- 0.308 -- - Note 4.4
Color Chromaticity (White) W y θx = θy =0 -- 0.339 -- - Note 4.4
Viewing angle (IPS) θT, θB, θL, θR CR > 10 80 85 -- Deg. Note 3

3.7 Inspection Standards & Quality Control

The module is manufactured and inspected according to GB/T 2828-2003 (normal inspection, Class II).

  • AQL (Acceptable Quality Level): Major Defect: 0.65 | Minor Defect: 1.5
  • Inspection Criteria: Visual inspection at a distance of 30cm under normal lighting conditions with a 30W light source at a 45-degree angle.
  • Defect Classification:
    • Major Defects: Include missing display, line defects (missing line), flicker, overcurrent, voltage out of spec, pattern blur, Mura (ND filter 2% test), black/white dots greater than 0.3mm, missing line, and FPC copper screen peel.
    • Minor Defects: Include glass damage (non-pin-side), polarizer scratches/bubbles, FPC impurities, black tape defects, and silicon/tuffy glue issues.
  • Dot/Point Defect Criteria: As per the detailed specification table in the document, for example:
    • Polarizer bubbles: ψ ≤ 0.3mm (2 allowed), 0.3mm < ψ ≤ 0.5mm (1 allowed), ψ > 0.5mm (0 allowed).
    • Black/White dots (electrically active): ψ ≤ 0.15mm (disregard), 0.15mm < ψ ≤ 0.25mm (2 allowed), ψ > 0.3mm (0 allowed).

3.8 Design Notes from Documentation

  • Mechanical Design Recommendations:
    • Suggested housing visible area (shell opening) should be 0.3mm smaller than the VAmds (IPS viewing area) on each side. (Note 7)
    • Suggested housing foam opening should be 0.6mm larger than the VAmds on each side. (Note 8)
    • The edge of the Touch Panel (TP) must not contact any metal conductor. (Note 9)
  • B/L Driver: The backlight consists of 4 Chip-White LEDs in parallel. An external current source or current limiting resistor is required. The typical driving condition is IF=80mA, Vf=2.8~3.2V.
  • Interface: The module uses a 4-wire SPI interface. The pinout includes dedicated TP (touch panel) pins (13-18) which are marked as "NC/TP", suggesting the module may support a future capacitive touch panel addition.
  • ESD Protection: Silver paste (银浆) is used for grounding. A yellow insulating tape (黄色绝缘胶纸) is placed on the back for safety.
  • IPS Display: This module features IPS (In-Plane Switching) technology providing wide viewing angles (85 degrees typical in all four directions).
  • RoHS: All materials are ROHS compliant.
  • Connector: The FPC has 18 pins. The document shows an "易撕贴手撕位" (easy-tear tape handle) for convenient handling.
  • General Tolerance: ±0.2mm for dimensions with decimal points, ±1/4° for angles.

4. Application Guidelines & Critical Notes

  • Power Supply: The module requires VCI (2.8V typical) and IOVCC (1.8V typical) power supplies. Ensure the power supplies are stable and have low ripple. The absolute maximum rating for VCC is 4.6V and for IOVCC is 4.0V.
  • Interface: This module uses a standard 4-wire SPI protocol. The host processor must be configured for this protocol.
  • Backlight Driver (External): A simple constant current source or current limiting resistor can be used to supply the backlight via the LEDA (Pin 11) and LEDK (Pin 12) pins. The required driving condition is 80mA total current at 2.8V~3.2V forward voltage.
  • Reset: A hardware reset pin (RESET, Pin 9) is provided. Ensure proper reset timing as per the specifications.
  • Mechanical Mounting: Follow the mechanical design notes for the enclosure and foam opening to ensure proper fit and avoid damage to the TP and LCD.
  • Operating Temperature: The module operates from -10°C to +70°C. Satisfactory display performance is only guaranteed within this range.
  • Storage: Store the module in a clean environment, free from dust, moisture, and direct sunlight. Storage temperature range is -20°C to +80°C.
  • Handling Precautions: Handle the module with care to avoid damage to the glass or FPC. Ground yourself to prevent electrostatic discharge (ESD). The yellow insulating tape on the back should not be removed during installation.

5. Conclusion & Design-In Support

The LS024I46-S-V1 from Lesson Smart Display Technology is a 2.4-inch IPS TFT-LCD module with a 4-wire SPI interface. It features an IPS display for wide viewing angles, a high contrast ratio (1200:1 typical), and a robust mechanical design with ESD protection. It is a reliable, high-quality display solution suitable for a wide variety of embedded display applications.

For successful design-in, engineers should:

  • Obtain and review the complete, official Product Specification (Revision 1.0) for the full mechanical drawing and the driver IC datasheet for detailed initialization and timing parameters. Note that the SPI timing in the spec is marked as "TBD".
  • Design a clean 2.8V/1.8V power supply for the LCD. Design a backlight constant current driver circuit capable of delivering 80mA at up to 3.2V.
  • Configure the host processor's SPI interface to match the timing specifications detailed in this datasheet and the driver IC datasheet.
  • Follow the mechanical design guidelines for the enclosure and foam opening to ensure proper fit and avoid damage.
  • Contact the manufacturer for evaluation modules, sample requests, and further technical support during the design-in phase.

This module is designed to provide a reliable and vibrant display solution for a wide array of applications.

Related Articles

Eddie Chen
WhatsApp: +852 4614 8012
+86 15019200406 (WeChat)
HongKong Office: RM NO 43 U-MALL 1/F YUE MAN CTR KWUN TONG KL HONGKONG
Shenzhen Office: Room 2301,2302, Galaxy Times Building,Dalang North Road,Longhua District, Shenzhen
Factory Address: Building 4,2020 Factory, Industrial Park Zone2, Wanan County, Ji'an City, Jiangxi Province
We use cookies

We use cookies on our website. Some of them are essential for the operation of the site, while others help us to improve this site and the user experience (tracking cookies). You can decide for yourself whether you want to allow cookies or not. Please note that if you reject them, you may not be able to use all the functionalities of the site.