LS0283I03-MPR-V1 2.83 Inch TFT-LCD Module 480x640 16.7M Colors
1. Executive Summary & Product Positioning
The LS0283I03-MPR-V1 is a 2.83-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module developed by 立信（万安）智显科技有限公司 (Lesson Smart Display Technology Co., Ltd). The panel size is 2.83 inch and the resolution is 480(RGB)*640, the panel can display up to 16.7M colors. This module is a COG (Chip-on-Glass) + FPC + B/L (Backlight) construction. The product specification was first released on 2025-04-27 (Revision 1.0).
Product Positioning: This 2.83-inch module is well-suited for a wide range of applications requiring a compact, high-quality display with a higher resolution and a choice between 18-bit RGB and MIPI interfaces. It is ideal for handheld devices, portable instruments, smart home controllers, and other embedded display systems.
2. Detailed Product Overview & Architecture
The module's architecture is designed for robust performance and easy integration. The primary components include:
- TFT-LCD Panel: 2.83-inch diagonal, a-Si TFT active matrix, transmissive, IPS (In-Plane Switching). Resolution is 480(RGB) × 640 pixels.
- Driver Circuit: The module integrates the ST7701SN driver IC, supporting two data interface modes: 18BIT RGB and MIPI DSI (1-lane or 2-lane).
- Backlight Unit (B/L): A white LED backlight with 4 Chip-White LEDs configured in parallel. The typical driving condition is IF=80mA, Vf=3V (TYP).
- Mechanical Construction: COG (Chip-on-Glass) + FPC + B/L.
- Display Mode: Transmissive, IPS.
- Viewing Direction: Free (IPS).
- RoHS: All materials are compliant with RoHS standards.
3. Exhaustive Technical Specifications
3.1 General & Mechanical Specifications
| Item | Specification |
| Display Size (Diagonal) | 2.83 inches |
| Resolution (Dots) | 480(RGB) × 640 |
| Display Technology | Active Matrix TFT, Transmissive, a-Si, IPS |
| Module Construction | COG+FPC+B/L |
| Color Depth | 16.7M Colors (24-bit) |
| Input Data Interface | 18BIT RGB / MIPI (1-lane or 2-lane DSI) |
| Driver IC | ST7701SN |
| Display Mode | Transmissive, IPS |
| Viewing Direction | Free (IPS, 85° all directions) |
| Backlight Type | 4 Chip-White LEDs, Parallel |
| Operating Temperature | -20°C to +70°C |
| Storage Temperature | -30°C to +80°C |
| Environmental Compliance | RoHS |
3.2 Absolute Maximum Ratings
Stress beyond those listed may cause permanent damage to the device.
| Item | Symbol | Min | Max | Unit |
|---|---|---|---|---|
| Supply voltage | VCC | -0.5 | 4.6 | V |
| Supply voltage | IOVCC | -0.5 | 4.6 | V |
| Operating temperature | TOPR | -20 | 70 | °C |
| Storage temperature | TSTR | -30 | 80 | °C |
3.3 Electrical Characteristics
3.3.1 Recommended DC Characteristics
Condition: VDDI=1.65 to 3.3V, VCC=2.5 to 3.6V, AGND=DGND=0V, Ta=25℃.
| Item | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Supply voltage | VCC | 2.5 | 2.8 | 3.6 | V |
| Interface Supply voltage | IOVCC | 1.65 | 2.8 | 3.3 | V |
| Input Voltage (L level) | VIL | VSS | -- | 0.3*IOVCC | V |
| Input Voltage (H level) | VIH | 0.7*IOVCC | -- | IOVCC | V |
3.3.2 Backlight LED Characteristics
The backlight consists of 4 Chip-White LEDs in parallel. The typical driving condition is IF=80mA, Vf=3V (TYP).
| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Forward Voltage | Vf | 2.8 | 3.0 | 3.2 | V |
| Forward Current (Total) | IF | -- | 80 | -- | mA |
3.4 Interface Pin Assignment (40-Pin FPC)
The module communicates via a 40-pin FPC connector. The interface can be configured for either 18BIT RGB or MIPI DSI mode. The following tables describe the pinout for both configurations.
3.4.1 RGB Interface Mode Pin Description
| PIN NO. | Symbol | I/O | Description |
|---|---|---|---|
| 1 | LEDA | P | Power for LED backlight anode (Anode) |
| 2 | LEDK | P | Power for LED backlight cathode (Cathode) |
| 3 | VCC(3.3V) | P | Power supply |
| 4-13 | GND | P | Ground |
| 14 | VSYNC | I | Vertical sync signal input |
| 15 | HSYNC | I | Horizontal sync signal input |
| 16 | DOTCLK | I | Data clock input |
| 17 | DE(ENABLE) | I | Data enable input |
| 18-22 | B0-B4 | I | Blue data bits (0-4) |
| 23-28 | G0-G5 | I | Green data bits (0-5) |
| 29-33 | R0-R4 | I | Red data bits (0-4) |
| 34 | RESET | I | Reset signal pin |
| 35 | CS | I | Serial communication chip select |
| 36 | SCL | I | Serial command clock input |
| 37 | SDA | I/O | Serial command data input |
| 38 | GND | P | Ground |
| 39 | VCC | P | Power setting |
| 40 | GND | P | Ground |
3.4.2 MIPI Interface Mode Pin Description
| PIN NO. | Symbol | I/O | Description |
|---|---|---|---|
| 1 | LEDA | P | Power for LED backlight anode |
| 2 | LEDK | P | Power for LED backlight cathode |
| 3 | VCC(3.3V) | P | Power |
| 4 | GND | P | Ground |
| 5 | DSI-D0N | I | DSI Data lane 0 (Negative) |
| 6 | DSI-D0P | I | DSI Data lane 0 (Positive) |
| 7 | GND | P | Ground |
| 8 | DSI-CLK N | I | DSI Clock (Negative) |
| 9 | DSI-CLK P | I | DSI Clock (Positive) |
| 10 | GND | P | Ground |
| 11 | DSI-D1N | I | DSI Data lane 1 (Negative) |
| 12 | DSI-D1P | I | DSI Data lane 1 (Positive) |
| 13-33 | GND | P | Ground |
| 34 | RESET | I | Reset signal pin |
| 35 | CS | I | Serial communication chip select |
| 36 | SCL | I | Serial command clock input |
| 37 | SDA | I/O | Serial command data input |
| 38 | IOVCC | P | I/O power supply |
| 39 | GND | P | Ground |
| 40 | IOVCC | P | I/O power supply |
3.5 Interface Timing Characteristics
3.5.1 Reset Input Timing
The reset pin (RESX) has specific timing requirements for proper initialization.
Condition: VDDI=1.8, VDD=2.8, AGND=DGND=0V, Ta=25 ℃.
- A reset pulse shorter than 5µs is rejected (Reset Rejected).
- A reset pulse longer than 9µs initiates a reset.
- It is necessary to wait 5msec after releasing RESX before sending commands.
- Sleep Out command cannot be sent for 120msec after reset.
- During the resetting period, the display will be blanked.
- Spike rejection: Positive spikes less than 20ns width will be rejected.
3.5.2 3-Line Serial Interface Timing (for commands)
The module communicates via a 3-line serial interface for commands in both RGB and MIPI modes.
Condition: VDD=1.8, VDD=2.8, AGND=DGND=0V, Ta=25℃.
3.5.3 18/16 Bits RGB Interface Timing
Timing parameters for RGB interface are defined in the specification.
3.5.4 MIPI Interface Timing
The module supports MIPI DSI interface with both High Speed and Low Power modes. The following tables provide key timing parameters.
Condition: VDDI=1.8, VDD=2.8, AGND=DGND=0V, Ta=25 ℃.
MIPI High Speed Mode Timing
| Signal | Symbol | Parameter | MIN | MAX | Unit |
|---|---|---|---|---|---|
| DSI-CLK+/- | 2xUIINSTA | Double UI instantaneous | 2.5 | 25 | ns |
| DSI-CLK+/- | UIINSTA | UI instantaneous halfs | 1.25 | 12.5 | ns |
| DSI-Dn+/- | tDS | Data to clock setup time | 0.15 | - | UI |
| DSI-Dn+/- | tDH | Data to clock hold time | 0.15 | - | UI |
MIPI Low Power Mode Timing
| Signal | Symbol | Parameter | MIN | MAX | Unit |
|---|---|---|---|---|---|
| DSI-D0+/- | TLPXM | Length of LP state period (MPU to Module) | 50 | 75 | ns |
MIPI DSI Bursts Mode (LP to HS / HS to LP) Timing
| Signal | Symbol | Parameter | MIN | MAX | Unit |
|---|---|---|---|---|---|
| DSI-Dn+/- | THS-PREPARE | Time to drive LP-00 to prepare for HS transmission | 40+4 UI | 85+6 UI | ns |
| DSI-Dn+/- | THS-PREPARE + THS-ZERO | THS-PREPARE + time to drive HS-0 before the sync sequence | 140+10UI | - | ns |
| DSI-CLK+/- | TCLK-PREPARE | Time to drive LP-00 to prepare for HS transmission | 38 | 95 | ns |
3.6 Electro-Optical Characteristics
Measuring Condition: Ta=25°C, dark room.
| Item | Symbol | Condition | Min. | Typ. | Max. | Unit | Remark |
|---|---|---|---|---|---|---|---|
| Response time | Tr+Tf | θx = θy =0 | -- | 35 | -- | ms | Note 1 |
| Contrast Ratio | CR | θx = θy =0 | 1000 | 1200 | -- | - | Note 2 |
| Transmittance | T% | θx = θy =0 | 4.3 | 5.0 | -- | % | - |
| Viewing angle (IPS) | θT, θB, θL, θR | CR > 10 | 80 | 85 | -- | Deg. | Note 3 |
3.7 Inspection Standards
The specification defines detailed inspection criteria for visual and electrical defects. Key points include:
- Visual Inspection: The LCM is inspected with the naked eye at an angle of 45 degrees, from 30cm distance, under a 30W light source.
- Glass Defects: Dimensional non-conformance is a major defect.
- LCD Appearance Defects: Details on acceptable scratches, fibers, and polarizer defects.
- Electrical Criteria (Major Defects): No display, missing line, flicker, over current, voltage out of spec, pattern blur, etc.
- Dot Defects (Black/White dots): Defined by size and quantity (e.g., a dot < 0.15mm is disregarded; 2 dots between 0.15mm and 0.25mm are acceptable).
3.8 Design Notes from Documentation
- Mechanical Design Recommendations:
- Suggested housing visible area (shell opening) should be 0.3mm smaller than the VAmds (Viewing Area) on each side.
- Suggested housing foam opening should be 0.6mm larger than the VAmds on each side.
- The edge of the Touch Panel (TP) must not contact any metal conductor.
- Tolerance of segments to edge of glass: ±0.2mm.
- B/L Driver: The backlight consists of 4 Chip-White LEDs in parallel (80mA total, Vf=2.8-3.2V). A constant current driver for the backlight is required.
- Interface: The module can be used in either 18BIT RGB or MIPI DSI (1 or 2 lane) mode. A 3-line serial interface is used for command configuration.
- Reset Timing: The reset pin (RESX) must pulse low for at least 10µs to initiate a reset.
- IPS Display: This module features IPS (In-Plane Switching) technology providing 85-degree wide viewing angles.
- RoHS: All materials are ROHS compliant.
4. Application Guidelines & Critical Notes
- Power Supply: The module requires VCC (2.8V typical) and IOVCC (2.8V typical) power supplies. Ensure the power supplies are stable and have low ripple. The absolute maximum rating for VCC is 4.6V and for IOVCC is 4.6V.
- Interface Selection: The host processor must be configured to use either the 18-bit RGB interface or the MIPI DSI interface (1 or 2 lane). The module does not have an automatic interface detection mechanism; interface selection may depend on the hardware configuration of the FPC or driver IC.
- Backlight Driver (External): A constant current driver is required to supply the backlight via the LEDA (Pin 1) and LEDK (Pin 2) pins. The required driving condition is 80mA total current at 3V typical forward voltage.
- Reset: Ensure the RESET pin (Pin 34) is driven low for at least 10µs during power-on. After releasing reset, wait for the specified 5ms before sending the first command. The Sleep Out command must wait for 120ms.
- Mechanical Mounting: Follow the mechanical design notes for the enclosure and foam opening to ensure proper fit and avoid damage to the TP and LCD.
- Operating Temperature: The module operates from -20°C to +70°C. Satisfactory display performance is only guaranteed within this range.
- Storage: Store the module in a clean environment, free from dust, moisture, and direct sunlight. Storage temperature range is -30°C to +80°C.
- Handling Precautions: Handle the module with care to avoid damage to the glass or FPC. Ground yourself to prevent electrostatic discharge (ESD).
- MIPI Interface Specifics: For MIPI mode, ensure the DSI clock and data lanes have proper differential impedance (100Ω) and that the lane setup time (tDS) and hold time (tDH) are met.
5. Conclusion & Design-In Support
The LS0283I03-MPR-V1 from Lesson Smart Display Technology is a high-resolution 2.83-inch IPS TFT-LCD module with a flexible interface (RGB or MIPI). It features a high contrast ratio (1200:1 typical), a wide IPS viewing angle (85° all directions), a fast 35ms response time, and a robust mechanical design. It is a reliable, high-quality display solution suitable for a wide variety of embedded display applications.
For successful design-in, engineers should:
- Obtain and review the complete, official Product Specification (Revision 1.0) for the full mechanical drawing and the driver IC (ST7701SN) datasheet for detailed initialization and timing parameters.
- Design a clean 2.8V power supply for the LCD. Design a backlight constant current driver circuit capable of delivering 80mA at up to 3.2V.
- Select and configure the appropriate interface (RGB or MIPI) on the host processor. If using MIPI, ensure proper PCB layout for high-speed differential signals.
- Follow the mechanical design guidelines for the enclosure and foam opening to ensure proper fit and avoid damage.
- Contact the manufacturer for evaluation modules, sample requests, and further technical support during the design-in phase.
This module is designed to provide a reliable and vibrant display solution for a wide array of applications.
