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LS050I32-MP-V1 4.99 inch TFT-LCD Module 720x1280 16.7M Colors ILI9881C Driver IC MIPI (4-Lane) Interface Brightness is 270cd/m²

LS050I32-MP-V1 4.99 inch TFT-LCD Module 720x1280 16.7M Colors

Product Keywords: 4.99″ LCD Module, COG+FPC+B/L, 720(RGB)×1280 Resolution, 16.7M Colors, Transmissive a-Si TFT-LCD, IPS (All Viewing), MIPI Interface, ILI9881C Driver, 14 Chip-White LED (Parallel), 270cd/m², -20°C to +70°C Operation.

1. Executive Summary & Product Positioning

The LS050I32-MP-V1 is a 4.99-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module developed by 立信(万安)智显科技有限公司 (Lesson Smart Display Technology Co., Ltd). The panel size is 4.99 inch and the resolution is 720(RGB)*1280, the panel can display up to 16.7M colors. This module is a COG (Chip-on-Glass) + FPC + B/L (Backlight) construction.

Product Positioning: This 4.99-inch module is well-suited for a wide range of applications requiring a compact, high-resolution display with excellent color performance. It is ideal for portable devices, smart home controllers, and other embedded display systems.

2. Detailed Product Overview & Architecture

The module's architecture is designed for robust performance and easy integration. The primary components include:

  • TFT-LCD Panel: 4.99-inch diagonal, a-Si TFT active matrix, transmissive, IPS (In-Plane Switching) with ALL viewing direction. Resolution is 720(RGB) × 1280 pixels.
  • Driver Circuit: The module integrates the ILI9881C driver IC, communicating via a MIPI (4-Lane) Interface.
  • Backlight Unit (B/L): A white LED backlight with 14 Chip-White LEDs configured in parallel. The typical brightness is 270cd/m².
  • Mechanical Construction: COG (Chip-on-Glass) + FPC + B/L. The total module thickness is 1.73±0.2 mm.
  • Interface: The module communicates via a 32-pin FPC connector. The display interface is MIPI DSI (4-Lane).
  • Display Mode: Transmissive, IPS.
  • Viewing Direction: ALL (IPS).
  • RoHS: All materials are compliant with RoHS standards.

3. Exhaustive Technical Specifications

3.1 General & Mechanical Specifications

Item Specification
Display Size (Diagonal) 4.99 inches
Resolution (Dots) 720(RGB) × 1280
Display Technology Active Matrix TFT, Transmissive, a-Si, IPS
Module Construction COG+FPC+B/L
Color Depth 16.7M Colors
Input Data Interface MIPI (4-Lane)
Driver IC ILI9881C
LCM Outer Dimension (H×V) 65.3 × 134.5 mm (from drawing)
LCM Thickness 1.73 ± 0.2 mm (Typ)
Active Area (H×V) 62.1 × 113.5 mm (from drawing)
Display Mode Transmissive, IPS
Viewing Direction ALL (IPS)
Backlight Type 14 Chip-White LEDs, Parallel
Luminance (LCM) 270 cd/m² (Note 6)
Operating Temperature -20°C to +70°C
Storage Temperature -30°C to +80°C
Environmental Compliance RoHS

3.2 Absolute Maximum Ratings

Stress beyond those listed may cause permanent damage to the device.

Item Symbol Min Max Unit Remark
Supply voltage VCC -0.3 7.0 V Note1 Note2
Supply voltage IOVCC -0.3 3.8 V Note1 Note2
Operating temperature TOPR -20 70 °C Note1 Note2
Storage temperature TSTR -30 80 °C Note1 Note2

3.3 Electrical Characteristics

3.3.1 Recommended Operating Conditions

Condition: Ta=25°C.

Item Symbol Min Typ Max Unit Remark
Supply voltage VCC 2.5 2.8 6.6 V Note1
Supply voltage IOVCC 1.65 2.8 3.6 V Note1
Input Voltage (L level) VIL 0 --- 0.3*IOVCC V Note1
Input Voltage (H level) VIH 0.7*IOVCC --- IOVCC V Note1

3.4 Interface Pin Assignment (32-Pin FPC)

The module communicates via a 32-pin FPC connector. The interface is MIPI DSI (4-Lane). The pinout is as follows:

PIN NO. Symbol I/O Description
1 LEDA P Power for LED backlight anode
2 LEDA P Power for LED backlight anode
3 LEDA P Power for LED backlight anode
4 NC - Not connect
5 LEDK P Power for LED backlight cathode
6 LEDK P Power for LED backlight cathode
7 LEDK P Power for LED backlight cathode
8 LEDK P Power for LED backlight cathode
9 GND P Ground
10 GND P Ground
11 D2P I MIPI DSI differential data pair (Data lane 2)
12 D2N I MIPI DSI differential data pair (Data lane 2)
13 GND P Ground
14 D1P I MIPI DSI differential data pair (Data lane 1)
15 D1N I MIPI DSI differential data pair (Data lane 1)
16 GND P Ground
17 CLKP I MIPI DSI differential clock pair
18 CLKN I MIPI DSI differential clock pair
19 GND P Ground
20 D0P I MIPI DSI differential data pair (Data lane 0)
21 D0N I MIPI DSI differential data pair (Data lane 0)
22 GND P Ground
23 D3P I MIPI DSI differential data pair (Data lane 3)
24 D3N I MIPI DSI differential data pair (Data lane 3)
... ... ... ... (Refer to the complete drawing for pins 25-32)

Note: The complete pinout for pins 25-32 includes RESET, NC, TE, VDD, and additional GND and backlight pins. Refer to the official drawing for the full assignment.

3.5 MIPI DSI Timing Requirements

The module supports a MIPI DSI interface with 4 data lanes. The document specifies the timing requirements for both Sync Pulse and Sync Event modes.

The key timing parameters for a horizontal line (H) are defined as:

Parameter Symbol Min. Typ. Max. Unit
H-Sync Pulse (HSA) HSA - - - Byte
H-Sync Back Porch (HBP) HBP - - - Byte
H Active Width HACT - - - Byte
H-Sync Front Porch (HFP) HFP - - - Byte

Note: Specific timing values for HSA, HBP, HACT, HFP, VSA, VBP, VACT, VFP must be obtained from the official datasheet or the driver IC (ILI9881C) documentation. The document indicates support for both Sync Pulse Mode and Sync Event Mode.

3.6 Mechanical Design Recommendations (from Documentation)

  • Enclosure: Suggested enclosure visible area (housing opening) is 0.3mm smaller than the module's Viewing Area (VAmds) on each side. (Note 8)
  • Foam/Sponge: Suggested housing foam opening should be 0.6mm larger than the VAmds on each side. (Note 9)
  • TP Clearance: The edge of the capacitive touch panel must not contact any metal conductor.

3.7 Design Notes from Documentation

  • B/L Driver: The backlight consists of 14 Chip-White LEDs in parallel. An external boost converter and constant current driver are required. The typical LCM brightness is 270 cd/m².
  • Mechanical: LCM outer dimensions are 65.3 × 134.5 mm (height × width). The total thickness is 1.73 ± 0.2 mm. General tolerance is ±0.2mm for dimensions with decimals and ±0.3mm for those without.
  • Interface: The display uses a 4-lane MIPI DSI interface. The connector is an AFE03-S31FMA-1H (31-pin?), though the pin description table lists 24 pins.
  • ESD Protection: A yellow insulating tape (黄色绝缘胶纸) and silver paste dot (银浆点) are used on the FPC for ESD protection and grounding.
  • RoHS: All materials are ROHS compliant.
  • Connector: The FPC integrates a connector: AFE03-S31FMA-1H.
  • IPS Display: This module features IPS (In-Plane Switching) technology providing ALL viewing direction.

4. Application Guidelines & Critical Notes

  • Power Supply: The module requires VCC (2.8V typical) and IOVCC (2.8V typical) power supplies. Ensure the power supplies are stable and have low ripple.
  • Interface: This module uses a standard MIPI DSI (4-lane) interface. The host processor must be configured for this protocol.
  • Backlight Driver (External): An external boost converter and constant current driver are required for the 14 parallel white LEDs.
  • Reset: A hardware reset pin is available. Ensure the reset sequence adheres to the ILI9881C driver IC specifications.
  • Mechanical Mounting: Follow the mechanical design notes for the enclosure and foam opening to ensure proper fit and avoid damage.
  • Operating Temperature: The module operates from -20°C to +70°C. Satisfactory display performance is only guaranteed within this range.
  • Storage: Store the module in a clean environment, free from dust, moisture, and direct sunlight. Storage temperature range is -30°C to +80°C.
  • Handling Precautions: Handle the module with care to avoid damage to the glass or FPC. Ground yourself to prevent electrostatic discharge (ESD).

5. Conclusion & Design-In Support

The LS050I32-MP-V1 from Lesson Smart Display Technology is a 4.99-inch IPS TFT-LCD module with a 4-lane MIPI interface and a resolution of 720x1280 pixels. It features an IPS display for all-direction viewing and a robust mechanical design. It is a reliable, high-quality display solution suitable for a wide variety of industrial and consumer embedded display applications.

For successful design-in, engineers should:

  • Obtain and review the complete, official Product Specification (Revision 1.0) for the full mechanical drawing and the driver IC (ILI9881C) datasheet for detailed initialization and timing parameters.
  • Design a clean 2.8V power supply for the LCD. Design a backlight boost converter and constant current driver circuit.
  • Configure the host processor's MIPI DSI interface to match the timing specifications detailed in this datasheet.
  • Follow the mechanical design guidelines for the enclosure and foam opening to ensure proper fit and avoid damage.
  • Contact the manufacturer for evaluation modules, sample requests, and further technical support during the design-in phase.

This module is designed to provide a reliable and vibrant display solution for a wide array of applications.

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Eddie Chen
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