LS068I01-MP-V1: 6.8-Inch a-Si TFT LCD Module, 480×1280 Resolution, 16.7M Colors, MIPI DSI Interface, IPS Display
Product Subtitle / Keywords
6.8 Inch Display, 480(RGB)×1280 Resolution, Transmissive a-Si TFT-LCD, MIPI DSI Interface (3/4 Data Lanes + 1 Clock Lane), COG+FPC+B/L, 16.7M Colors, IPS Display, 66.6mm × 180.9mm × 4.35mm Module Size, 60.22mm × 160.5888mm Active Area, -20°C~70°C Operating Temperature, -30°C~80°C Storage Temperature, LED Backlight (3串4并, Vf=8.8V~10.4V, If=120mA/140mA/160mA), FL7707 Driver IC
1. Executive Summary & Product Positioning
The LS068I01-MP-V1, developed by Lixin (Wan'an) Intelligent Display Technology Co., Ltd. (立信(万安)智显科技有限公司), is a 6.8-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module.
This product specification (Revision 1.0, Module Type: COG+FPC+B/L) serves as the definitive technical document, defining its structural composition (COG+FPC+B/L), general description, physical features, absolute maximum ratings, complete MIPI DSI interface timing, and mechanical specifications. It delivers a resolution of 480(RGB)×1280 with 16.7M-color display capability, featuring an IPS (In-Plane Switching) display type.
The document provides the core parameters necessary for system integration into embedded display applications requiring a standard resolution display with a high-speed serial interface. The unequivocal recommendation for engineers is to strictly adhere to the electrical specifications, interface timing, and mechanical tolerances described herein to ensure reliable performance and compatibility.
2. Detailed Product Overview & Architecture
- Core Technology: Transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module, which is composed of a TFT-LCD panel, a driver circuit and a backlight unit.
- Display Mode: Transmissive type, IPS (In-Plane Switching) technology.
- Display Format: Graphic 480(RGB)×1280 pixel array.
- Display Characteristics: Capable of displaying up to 16.7 million colors.
- Module Construction: COG (Chip-On-Glass) + FPC (Flexible Printed Circuit) + B/L (Backlight Unit).
- Interface Type: MIPI DSI (Supports 3 or 4 data lanes + 1 clock lane).
- Main LCD Driver: FL7707.
- Backlight LED: 3串4并 (3 series, 4 parallel) configuration.
- Approval Status: ☑ Approved Product Specification only (as per signature block).
3. Exhaustive Technical Specifications
3.1 Mechanical & Physical Specifications
| Panel Size (Diagonal) | 6.8 inch |
| Number of dots / Resolution | 480(RGB) × 1280 pixel |
| Display Type | 6.8\" TFT, a-Si TFT, Transmissive, IPS |
| Module Type | COG+FPC+B/L |
| Module Size (H×V×D) | 66.6 × 180.9 × 4.35 mm |
| Active Area (H×V) | 60.22 × 160.5888 mm |
| Display Colors | 16.7M |
| Driver IC | FL7707 |
| Backlight Type | LED (3串4并) |
Critical Mechanical Design Notes (from outline dimension drawing):
- The physical drawing provides detailed dimensions for the module, including main view, side view, and back view.
- Unit of measurement: mm.
- Drawing scale: Not to scale (NTS).
- Tolerance: ±0.2mm for dimensions with one decimal; ±0.3mm for dimensions without decimal; ±1/4° for angular dimensions.
- FPC insertion direction and bending diagram are provided.
- Notes from drawing:
- TP edge must not contact metal conductors.
- Chassis foam window should be larger than VAmds by 0.6mm or more per side.
- Suggested housing visible area should be smaller than VAmds by 0.3mm or more per side.
- RoHS compliance.
3.2 Electrical & Interface Specifications
3.2.1 Absolute Maximum Ratings
| Item | Symbol | Min | Max | Unit | Remark |
|---|---|---|---|---|---|
| Supply voltage | VCC | -0.3 | 6.6 | V | Note1 Note2 |
| Supply voltage | IOVCC | -0.3 | 5.5 | V | Note1 Note2 |
| Operating temperature | TOPR | -20 | 70 | °C | Note1 Note2 |
| Storage temperature | TSTR | -30 | 80 | °C | Note1 Note2 |
3.2.2 Backlight Drive Conditions
The backlight is configured as 3串4并 (3 series, 4 parallel). The drive conditions are as follows:
| Condition | Vf (Typ.) | If (Typ.) | Luminance (Typ.) |
|---|---|---|---|
| Condition 1 | 8.8V~10.4V | 160mA (恒定电流) | 600 cd/m² |
| Condition 2 | 8.8V~10.4V | 140mA (恒定电流) | 500 cd/m² |
| Condition 3 | 8.8V~10.4V | 120mA (恒定电流) | 400 cd/m² |
3.2.3 MIPI DSI Interface Characteristics
The specification includes detailed MIPI DSI timing parameters for High-Speed and Low-Power modes. The module supports 3 or 4 data lanes with 1 clock lane.
3.2.3.1 High-Speed Mode - Clock Lane Timing
(VSS=0V, IOVCC=1.65V to 3.3V, VCI=2.5V to 3.3V, TA = -30 to 70°C)
| Signal | Item | Symbol | Min. | Max. | Unit |
|---|---|---|---|---|---|
| DSI_CP/DSI_CN | Double UI instantaneous | 2xUINST | 4LANE: 3.30 3LANE: 2.85 @VDDD=1.8V |
25 | ns |
| DSI_CP/DSI_CN | UI instantaneous | UINSTA UINSTB | 4LANE: 1.67 3LANE: 1.43 @VDDD=1.8V |
12.5 | ns |
| DP/DN | Data to clock setup time | TDS | 0.15xUI | - | ps |
| DP/DN | Data to clock hold time | TDH | 0.15xUI | - | ps |
| DSI_CP/DSI_CN | Differential rise time for clock | TDRTCLK | 150 | 0.3UI | ps |
| DSI_CP/DSI_CN | Differential fall time for clock | TDFTCLK | 150 | 0.3UI | ps |
| DP/DN | Differential rise time for data | TDRTDATA | 150 | 0.3UI | ps |
| DP/DN | Differential fall time for data | TDFTDATA | 150 | 0.3UI | ps |
3.2.3.2 Low Power Mode Characteristics
(VSS=0V, IOVCC=1.65V to 3.3V, VCI=2.3V to 3.3V, TA = -30 to 70°C)
| Signal | Item | Symbol | Min. | Max. | Unit |
|---|---|---|---|---|---|
| DSID_D0P/DSID_D0P | Length of LP-00/LP01/LP10/LP11 Host → Display module | TLPXM | 50 | - | ns |
| DSID_D0P/DSID_D0P | Length of LP-00/LP01/LP10/LP11 Display module →Host | TLPXD | 50 | - | ns |
| DSID_D0P/DSID_D0P | Time-out before the MPU start driver | TTA-SURE | TLPXD | 2xTLPXD | ns |
| DSID_D0P/DSID_D0P | Time to drive LP-00 by display module | TTA-GET | 5xTLPXD | - | ns |
| DSID_D0P/DSID_D0P | Time to drive LP-00 after turnaround request Host | TTAGO | 4xTLPXD | - | ns |
3.2.3.3 DSI Burst Mode Timing
The specification provides detailed timing for DSI bursts, including:
- THS-PREPARE: Time to drive LP-00 to prepare for HS transmission (40+4UI to 85+6UI ns)
- THS-TERM-EN: Time to enable data receiver line termination (35+4xUI ns max)
- THS-SKIP: Time-Out at Display Module to Ignore Transition Period of EoT (40 to 55+4xUI ns)
- THS-EXIT: Time to drive LP-11 after HS Burst (100 ns min)
- TCLK-POST: Time that the MCU shall continue sending HS clock after the last associated Data Lane has transitioned to LP mode (60+52xUI ns min)
- TCLK-TRAIL: Time to drive HS differential state after last payload clock bit of a HS transmission burst (60 ns min)
- TCLK-PREPARE: Time to drive LP-00 to prepare for HS transmission (38 to 95 ns)
- TCLK-TERM-EN: Time-out at Clock Lane Display Module to enable HS Termination (38 ns max)
- TCLK-PREPARE + TCLK-ZERO: Minimum lead HS-0 drive period before starting Clock (300 ns min)
- TCLK-PRE: Time that the HS clock shall be driven prior to any associated data Lane beginning the transition from LP to HS mode (8xUI)
3.2.4 Reset Input Timing
| Symbol | Parameter | Related Pins | Min. | Max. | Unit | Note |
|---|---|---|---|---|---|---|
| tRESW | Reset low pulse width | NRESET | 10 | - | μs | - |
| tREST | Reset complete time | - | - | 15 | ms | When reset applied during SLPIN mode |
| tREST | Reset complete time | - | - | 120 | ms | When reset applied during SLPOUT mode |
3.3 Inspection Criteria (Black tape & Mara tape)
The specification includes inspection criteria for black tape and mara tape defects:
| No. | Defect | Criteria | Judgment |
|---|---|---|---|
| 1 | FPC or H/S black tape shift (minor defect) | 1. shift spec: 1) glue to the polarize 2) IC bare 2. left-and-right spec: 1) exceed of FPC edge or H-S edge 2) IC bare |
Reject |
| 2 | No black tape (Major defect) | No black tape | Reject |
| 3 | Tape position mistake (minor defect) | Not by engineering drawing | Reject |
| 4 | Mara tape defect (minor defect) | Peel before pulling the protecting film. | Reject |
4. Application Guidelines & Critical Notes
Intended Use
- Smartphones and mobile devices
- Portable media players and handheld gaming consoles
- Industrial control panels and human-machine interfaces (HMIs)
- Any application requiring a standard resolution display with a MIPI interface and IPS technology
Critical Design Considerations
- Flexible MIPI Lane Configuration: This module supports 3 or 4 data lanes on the MIPI DSI interface. The host controller must be configured to match the desired lane count. The minimum UI instantaneous timing differs between 3-lane (1.43 ns) and 4-lane (1.67 ns) configurations.
- Power Supply: Provide stable power supplies: VCC (-0.3V to 6.6V) and IOVCC (-0.3V to 5.5V). The backlight requires a constant-current LED driver with selectable current settings (120mA, 140mA, or 160mA) at approximately 8.8V~10.4V.
- Backlight Brightness Control: The backlight offers three brightness levels depending on the drive current: 400 cd/m² (120mA), 500 cd/m² (140mA), and 600 cd/m² (160mA). Choose the appropriate current setting for your application's brightness requirements.
- Mechanical Integration: Module outline: 66.6mm × 180.9mm × 4.35mm. Active area: 60.22mm × 160.5888mm. Pay attention to the FPC insertion direction and bending requirements.
- Temperature Limits: Operating Temperature: -20°C to +70°C. Storage Temperature: -30°C to +80°C.
- Reset Timing: The RESET pin requires a minimum low pulse width of 10μs. The complete reset time depends on the operation mode — up to 120ms during Sleep Out mode.
- ESD Protection: Observe standard ESD precautions during handling and assembly.
- Mechanical Design Notes: TP edge must not contact metal conductors. Chassis foam window should be larger than VAmds by 0.6mm or more per side. Suggested housing visible area should be smaller than VAmds by 0.3mm or more per side.
Handling & Compliance
- The module is RoHS compliant.
- Observe standard ESD precautions during handling and assembly.
- The module contains fragile glass and FPC – handle with care.
- Avoid bending the FPC sharply, especially near the connector interface.
- Do not attempt to disassemble or process the LCD module.
- NC terminals should be open. Do not connect anything.
- If the logic circuit power is off, do not apply the input signals.
5. Conclusion & Design-In Support
The LS068I01-MP-V1 specification details a standard 6.8-inch display module with a configurable MIPI DSI interface (3/4 data lanes) and IPS display technology — an excellent choice for applications requiring a reliable display with good viewing angles and flexible interface options.
Key Strengths
- IPS Display Technology: Offers superior viewing angles and color reproduction compared to standard TN panels.
- Configurable MIPI DSI Interface (3/4 Data Lanes): Offers flexibility to optimize pin count and bandwidth for various host controller capabilities.
- High Color Depth: 16.7M colors (24-bit true color) provides excellent color reproduction.
- Standard 6.8-inch Size: Suitable for a wide range of embedded and mobile applications.
- Wide Operating Temperature Range: -20°C to +70°C for operation and -30°C to +80°C for storage.
- Multiple Backlight Brightness Options: Three brightness levels (400/500/600 cd/m²) provide flexibility for different ambient light conditions.
- RoHS Compliant: Environmentally friendly design.
- FL7707 Driver IC: Reliable and well-supported driver IC for MIPI DSI interfaces.
Main Design Focus
- The critical design task is configuring the MIPI DSI interface on the host processor for the desired lane count (3 or 4 lanes) and selecting the appropriate backlight drive current for the required brightness.
- Supporting requirements: Provide stable VCC and IOVCC power supplies. Provide a constant-current backlight driver with selectable current (120mA/140mA/160mA) at 8.8V~10.4V. Ensure proper reset timing (min 10μs pulse, up to 120ms complete time). Mechanical integration — the module outline is 66.6mm × 180.9mm × 4.35mm.
This module is an excellent choice for mobile devices, portable applications, and any embedded system requiring a standard resolution IPS display with flexible MIPI interface configuration.
