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LS080I15-MP-V1: 8.0-Inch TFT LCD Module, 800×1280 Resolution, COG+FPC+B/L, 4-Lane MIPI Interface, 16.7M Colors

LS080I15-MP-V1: 8.0-Inch TFT LCD Module, 800×1280 Resolution, COG+FPC+B/L, 4-Lane MIPI Interface, 16.7M Colors

Product Subtitle / Keywords

8.0 Inch Display, 800(RGB)×1280 Resolution, Transmissive Active Matrix TFT-LCD Module, MIPI Input Data, COG+FPC+B/L, Display Colors 16.7M, Module Outline 114.6 × 184.104 × 2.48 mm, Active Area 107.64 × 172.224 mm, Backlight Dual Core LED, IF=140mA, VF=16.8V-19.2V, Lesson Smart Display Technology Co., Ltd

1. Executive Summary & Product Positioning

The LS080I15-MP-V1, developed by Lesson Smart Display Technology Co., Ltd. (立信(万安)智显科技有限公司), is an 8.0-inch TFT-LCD (Thin Film Transistor Liquid Crystal Display) module composed of a TFT-LCD panel, a driver circuit, and a backlight unit.

This product specification (Revision 1.0) serves as the definitive technical document, defining its general description (including an 800(RGB)*1280 resolution and 16.7M color display), outline dimensions, backlight electrical characteristics, and interface pin connections (MIPI 4-data lane interface).

The document provides the core parameters necessary for system integration into embedded display applications requiring an 8.0-inch screen with a standard MIPI interface. The unequivocal recommendation for engineers is to strictly adhere to the electrical specifications, MIPI interface timing, and mechanical tolerances described herein to ensure reliable performance and compatibility.

2. Detailed Product Overview & Architecture

  • Core Technology: TFT-LCD module composed of a TFT-LCD panel, a driver circuit, and a backlight unit.
  • Display Type: Transmissive Active Matrix TFT.
  • Display Format: Graphic 800(RGB) × 1280 pixel array.
  • Module Construction: COG+FPC+B/L (Chip-On-Glass + Flexible Printed Circuit + Backlight).
  • Interface Type: MIPI Input Data (MIPI DSI – 4 data lanes).
  • Display Colors: Up to 16.7M colors.
  • Backlight: Dual Core LED (2 sets of LEDs), IF = 140 mA total.

3. Exhaustive Technical Specifications

3.1 Mechanical & Physical Specifications

Parameter Specification Unit
Module Model LS080I15-MP-V1 -
LCD Size (Diagonal) 8.0 inch
Resolution 800(RGB) × 1280 Pixels
Display Type Transmissive Active Matrix TFT -
Module Type COG+FPC+B/L -
Interface Type MIPI Input Data -
Display Colors 16.7M -
Module Outline (W × H × T) 114.6 × 184.104 × 2.48 mm
Active Area (W × H) 107.64 × 172.224 mm
Pixel Pitch 44.85 × 134.55 µm
Backlight Dual Core LED (2 sets) -
Backlight Current (IF total) 140 mA
Backlight Voltage (VF total) 16.8 ~ 19.2 V
Supplier 立信(万安)智显科技有限公司 (Lesson Smart Display Technology Co.,Ltd) -
Document Revision Revision 1.0 -

3.2 Electrical & Interface Specifications

3.2.1 Interface Type

The module utilizes a MIPI (Mobile Industry Processor Interface) DSI interface. The specification indicates "MIPI-4DATA-" in the outline drawing notes, confirming a 4-data lane MIPI DSI configuration.

3.2.2 Backlight Characteristics

Parameter Condition Value Unit
Total Forward Current (IF total) For Dual Core LED Backlight 140 mA
Total Forward Voltage (VF total) At IF = 140 mA 16.8 ~ 19.2 V

3.2.3 MIPI D-PHY Low Power Transmitter Characteristics

The specification includes a reference table for the Low Power Transmitter (LP-TX) characteristics typical for MIPI D-PHY signaling.

Parameter Description Min. Typ. Max. Unit
Thevenin output high level VOH 1.1 1.2 1.3 V
Thevenin output low level VOL -50 - 50 mV
Output impedance of LP-TX ZOLP 110 - - Ω

3.3 Mechanical Outline Details

The outline drawing provides critical physical measurements for integration:

  • LCD Outline: 110.74 ± 0.2 mm (width)
  • LCM Outline (W × H): 114.6 × 184.104 mm (including edge tape).
  • Viewing Area (VA): Not explicitly specified, but is larger than the Active Area.
  • Thickness Details:
    • Total LCM Thickness: 2.48 ± 0.2 mm.
    • Component Layer Thickness: 0.8 mm (LCD) + 0.13 mm (POL) + 0.1 mm (FPC + shielding tape) & other layers.
  • FPC: The FPC is bent at a 90° angle for shipping.
  • Connector: Pin connector with 37 pins (based on the pin table footprint, though the pin count appears to be 37 based on the diagram).
  • Steel Reinforcement: 0.2 mm steel plate on the back of the FPC connector area for structural support.
  • EA (银浆点): Silver paste point for grounding ESD protection is indicated.

4. Application Guidelines & Critical Notes

Intended Use

  • Embedded display applications requiring an 8.0-inch TFT screen with a standard MIPI DSI interface.
  • Tablets, portable devices, and industrial control panels requiring 800×1280 resolution.

Critical Design Considerations

  1. MIPI DSI Interface: The module requires a 4-lane MIPI DSI connection from the host processor. Ensure the host's MIPI DSI transmitter is configured for 4 lanes and meets the typical MIPI D-PHY electrical levels (VOH ≈ 1.2V, VOL < 50mV, output impedance ZOLP ≥ 110Ω).
  2. Backlight Driving (Dual Core): The module uses a Dual Core LED configuration (two sets of LED strings). The total current is IF = 140 mA and the total voltage is VF = 16.8V to 19.2V. Design a constant current LED driver that can handle this combined load. An example calculation from the back of the drawing suggests IF per core = 70 mA, VF total = 2 * (LED chip VF) depending on the series configuration.
  3. Mechanical Mounting:
    • The drawing notes that the FPC is shipped in a bent 90° position.
    • The module uses double-sided conductive tape (T=0.1mm) for ESD grounding and silver paste points for additional ground contact.
    • A T=0.2mm steel reinforcement plate is used on the back of the FPC connector area to provide rigidity.
  4. ESD Protection: Follow the silver paste point and conductive tape landing patterns carefully to ensure proper ESD grounding.
  5. Tolerance: Outline dimension tolerances are: ±0.2mm for 2 decimal places, ±0.3mm for single decimal places.

Handling & Compliance

  • The module is produced by Lesson Smart Display Technology Co., Ltd. and is likely ROHS compliant.
  • Observe standard ESD precautions during handling and assembly.
  • The module contains fragile glass and a precision FPC – handle with care.
  • Do not attempt to disassemble or modify the LCD module.
  • NC (No Connect) pins should remain open.

5. Conclusion & Design-In Support

The LS080I15-MP-V1 specification details a standard 8.0-inch TFT display module with an 800×1280 resolution, 4-lane MIPI DSI interface, dual-core LED backlight, and 16.7M color support — a suitable choice for a wide range of embedded display applications.

Key Strengths

  • Standard 8.0-inch Size: Fits many portable and embedded applications.
  • Good Resolution (800×1280): Provides clear and detailed images.
  • Standard 4-Lane MIPI Interface: Easy to integrate with modern processors.
  • Detailed Mechanical Drawing: Provides precise mounting and clearance information.
  • ESD Protection Features: Includes built-in grounding structures (silver paste, conductive tape).

Main Design Focus

  • The critical design task is configuring the host's MIPI DSI transmitter to operate in 4-lane mode and providing a stable constant current backlight driver capable of delivering 140 mA total at up to 19.2V.
  • Supporting requirements: Follow the mechanical outline drawing for precise mounting, pay careful attention to the ESD grounding lands (silver paste point, conductive tape area). Provide a stable power supply for the MIPI interface and logic.

This module is an excellent choice for applications requiring an 8.0-inch display with a standard MIPI interface and a bright, dual-core backlight.

LS080I15-MP-V1: 8.0-Inch TFT LCD Module, 800×1280 Resolution, COG+FPC+B/L, 4-Lane MIPI Interface, 16.7M Colors

Product Subtitle / Keywords

8.0 Inch Display, 800(RGB)×1280 Resolution, Transmissive Active Matrix TFT-LCD Module, MIPI Input Data, COG+FPC+B/L, Display Colors 16.7M, Module Outline 114.6 × 184.104 × 2.48 mm, Active Area 107.64 × 172.224 mm, Backlight Dual Core LED, IF=140mA, VF=16.8V-19.2V, Lesson Smart Display Technology Co., Ltd

1. Executive Summary & Product Positioning

The LS080I15-MP-V1, developed by Lesson Smart Display Technology Co., Ltd. (立信(万安)智显科技有限公司), is an 8.0-inch TFT-LCD (Thin Film Transistor Liquid Crystal Display) module composed of a TFT-LCD panel, a driver circuit, and a backlight unit.

This product specification (Revision 1.0) serves as the definitive technical document, defining its general description (including an 800(RGB)*1280 resolution and 16.7M color display), outline dimensions, backlight electrical characteristics, and interface pin connections (MIPI 4-data lane interface).

The document provides the core parameters necessary for system integration into embedded display applications requiring an 8.0-inch screen with a standard MIPI interface. The unequivocal recommendation for engineers is to strictly adhere to the electrical specifications, MIPI interface timing, and mechanical tolerances described herein to ensure reliable performance and compatibility.

2. Detailed Product Overview & Architecture

  • Core Technology: TFT-LCD module composed of a TFT-LCD panel, a driver circuit, and a backlight unit.
  • Display Type: Transmissive Active Matrix TFT.
  • Display Format: Graphic 800(RGB) × 1280 pixel array.
  • Module Construction: COG+FPC+B/L (Chip-On-Glass + Flexible Printed Circuit + Backlight).
  • Interface Type: MIPI Input Data (MIPI DSI – 4 data lanes).
  • Display Colors: Up to 16.7M colors.
  • Backlight: Dual Core LED (2 sets of LEDs), IF = 140 mA total.

3. Exhaustive Technical Specifications

3.1 Mechanical & Physical Specifications

Parameter Specification Unit
Module Model LS080I15-MP-V1 -
LCD Size (Diagonal) 8.0 inch
Resolution 800(RGB) × 1280 Pixels
Display Type Transmissive Active Matrix TFT -
Module Type COG+FPC+B/L -
Interface Type MIPI Input Data -
Display Colors 16.7M -
Module Outline (W × H × T) 114.6 × 184.104 × 2.48 mm
Active Area (W × H) 107.64 × 172.224 mm
Pixel Pitch 44.85 × 134.55 µm
Backlight Dual Core LED (2 sets) -
Backlight Current (IF total) 140 mA
Backlight Voltage (VF total) 16.8 ~ 19.2 V
Supplier 立信(万安)智显科技有限公司 (Lesson Smart Display Technology Co.,Ltd) -
Document Revision Revision 1.0 -

3.2 Electrical & Interface Specifications

3.2.1 Interface Type

The module utilizes a MIPI (Mobile Industry Processor Interface) DSI interface. The specification indicates "MIPI-4DATA-" in the outline drawing notes, confirming a 4-data lane MIPI DSI configuration.

3.2.2 Backlight Characteristics

Parameter Condition Value Unit
Total Forward Current (IF total) For Dual Core LED Backlight 140 mA
Total Forward Voltage (VF total) At IF = 140 mA 16.8 ~ 19.2 V

3.2.3 MIPI D-PHY Low Power Transmitter Characteristics

The specification includes a reference table for the Low Power Transmitter (LP-TX) characteristics typical for MIPI D-PHY signaling.

Parameter Description Min. Typ. Max. Unit
Thevenin output high level VOH 1.1 1.2 1.3 V
Thevenin output low level VOL -50 - 50 mV
Output impedance of LP-TX ZOLP 110 - - Ω

3.3 Mechanical Outline Details

The outline drawing provides critical physical measurements for integration:

  • LCD Outline: 110.74 ± 0.2 mm (width)
  • LCM Outline (W × H): 114.6 × 184.104 mm (including edge tape).
  • Viewing Area (VA): Not explicitly specified, but is larger than the Active Area.
  • Thickness Details:
    • Total LCM Thickness: 2.48 ± 0.2 mm.
    • Component Layer Thickness: 0.8 mm (LCD) + 0.13 mm (POL) + 0.1 mm (FPC + shielding tape) & other layers.
  • FPC: The FPC is bent at a 90° angle for shipping.
  • Connector: Pin connector with 37 pins (based on the pin table footprint, though the pin count appears to be 37 based on the diagram).
  • Steel Reinforcement: 0.2 mm steel plate on the back of the FPC connector area for structural support.
  • EA (银浆点): Silver paste point for grounding ESD protection is indicated.

4. Application Guidelines & Critical Notes

Intended Use

  • Embedded display applications requiring an 8.0-inch TFT screen with a standard MIPI DSI interface.
  • Tablets, portable devices, and industrial control panels requiring 800×1280 resolution.

Critical Design Considerations

  1. MIPI DSI Interface: The module requires a 4-lane MIPI DSI connection from the host processor. Ensure the host's MIPI DSI transmitter is configured for 4 lanes and meets the typical MIPI D-PHY electrical levels (VOH ≈ 1.2V, VOL < 50mV, output impedance ZOLP ≥ 110Ω).
  2. Backlight Driving (Dual Core): The module uses a Dual Core LED configuration (two sets of LED strings). The total current is IF = 140 mA and the total voltage is VF = 16.8V to 19.2V. Design a constant current LED driver that can handle this combined load. An example calculation from the back of the drawing suggests IF per core = 70 mA, VF total = 2 * (LED chip VF) depending on the series configuration.
  3. Mechanical Mounting:
    • The drawing notes that the FPC is shipped in a bent 90° position.
    • The module uses double-sided conductive tape (T=0.1mm) for ESD grounding and silver paste points for additional ground contact.
    • A T=0.2mm steel reinforcement plate is used on the back of the FPC connector area to provide rigidity.
  4. ESD Protection: Follow the silver paste point and conductive tape landing patterns carefully to ensure proper ESD grounding.
  5. Tolerance: Outline dimension tolerances are: ±0.2mm for 2 decimal places, ±0.3mm for single decimal places.

Handling & Compliance

  • The module is produced by Lesson Smart Display Technology Co., Ltd. and is likely ROHS compliant.
  • Observe standard ESD precautions during handling and assembly.
  • The module contains fragile glass and a precision FPC – handle with care.
  • Do not attempt to disassemble or modify the LCD module.
  • NC (No Connect) pins should remain open.

5. Conclusion & Design-In Support

The LS080I15-MP-V1 specification details a standard 8.0-inch TFT display module with an 800×1280 resolution, 4-lane MIPI DSI interface, dual-core LED backlight, and 16.7M color support — a suitable choice for a wide range of embedded display applications.

Key Strengths

  • Standard 8.0-inch Size: Fits many portable and embedded applications.
  • Good Resolution (800×1280): Provides clear and detailed images.
  • Standard 4-Lane MIPI Interface: Easy to integrate with modern processors.
  • Detailed Mechanical Drawing: Provides precise mounting and clearance information.
  • ESD Protection Features: Includes built-in grounding structures (silver paste, conductive tape).

Main Design Focus

  • The critical design task is configuring the host's MIPI DSI transmitter to operate in 4-lane mode and providing a stable constant current backlight driver capable of delivering 140 mA total at up to 19.2V.
  • Supporting requirements: Follow the mechanical outline drawing for precise mounting, pay careful attention to the ESD grounding lands (silver paste point, conductive tape area). Provide a stable power supply for the MIPI interface and logic.

This module is an excellent choice for applications requiring an 8.0-inch display with a standard MIPI interface and a bright, dual-core backlight.

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Eddie Chen
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