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LSC0201I08-S-V1 (JD9853): 2.01-inch TFT LCD Module, 240×296, SPI Interface, 262k Colors, Transmissive

LSC0201I08-S-V1 (JD9853): 2.01-inch TFT LCD Module, 240×296, SPI Interface, 262k Colors, Transmissive

Product Subtitle / Keywords

2.01 Inch Display, 240(RGB)×296 Resolution, Transmissive a-Si TFT-LCD, COG+FPC+B/L Module Type, SPI Interface (4-Line), 262K Colors, Main LCD Driver: JD9853, Module Type: COG+FPC+B/L, Operating Temp: -10°C ~ +60°C, Storage Temp: -20°C ~ +70°C, Backlight: 4 Chip-White LED, Vf=2.8~3.2V, If=80mA, Viewing Direction: IPS, RoHS Compliant

1. Executive Summary And Product Positioning

The LSC0201I08-S-V1 is a 2.01-inch diagonal transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module, manufactured by Lesson (Wanan) Smart Display Technology Co., Ltd. This module integrates a TFT-LCD panel, a driver circuit, and a backlight unit (B/L) into a compact and reliable package, providing a high-quality visual output solution for a wide range of embedded applications. The product specification (Revision 1.0) serves as the definitive technical document for this module.

This module is characterized by its high-resolution display in a 2.01-inch form factor. It features a resolution of 240(RGB)×296 pixels and is capable of displaying up to 262k colors, which corresponds to 6-bit color depth per primary color (Red, Green, Blue). This ensures smooth color gradients and detailed imagery suitable for advanced graphical user interfaces.

The unequivocal recommendation for engineers is to strictly adhere to the absolute maximum ratings, electrical specifications, and interface timing described herein to ensure reliable performance and compatibility within the intended application. Failure to operate within these limits can lead to permanent damage, degraded optical performance, or reduced product lifespan.

2. Detailed Product Overview And Architecture

The LSC0201I08-S-V1 is engineered for devices that demand a clear, vibrant display in a moderately sized package, such as handheld instruments, smart home displays, and industrial control panels. Its architecture is built around several key technologies and design choices:

  • Core Technology: Transmissive type a-Si TFT-LCD. This widely adopted technology uses a thin layer of amorphous silicon to create transistors that actively control each pixel. As a transmissive display, it requires a backlight to be visible and offers excellent color saturation and contrast in typical indoor lighting conditions.
  • Module Type: COG (Chip-On-Glass) + FPC (Flexible Printed Circuit) + B/L (Backlight). This construction is a hallmark of compact displays. The driver IC is directly mounted onto the LCD glass (COG), minimizing interconnect complexity and module size. The FPC provides a flexible connection to the host system. The B/L is essential for making the display visible.
  • Display Format: Graphic 240(RGB)×296 Dot-matrix. This near-square resolution is well-suited for applications requiring a vertical or square display area, such as smartwatches, medical device interfaces, or compact IoT panels. The RGB stripe arrangement provides full color mixing for each pixel.
  • Display Characteristics: Capable of displaying up to 262k colors. This refers to 6-bit color depth per primary color (R, G, B), allowing the module to generate 262,144 distinct colors. This provides for realistic and smooth color gradients, typical for mid-to-high-end consumer and industrial displays.
  • Interface Type: The module utilizes a SPI (Serial Peripheral Interface). Specifically, it uses a 4-line serial interface, clock (SCL), data (SDA), chip select (CS) and data/command select (RS). This serial interface is common in microcontrollers and allows for a simple, pin-efficient connection.
  • Main LCD Driver IC: The module integrates the JD9853 driver IC. This specific IC is designed to drive the TFT matrix, generate the necessary supply voltages (via internal charge pumps), and handle the SPI interface commands for configuring the display, such as setting the display window, brightness, and sleep modes.
  • Backlight Unit: The module utilizes a white LED backlight comprised of 4 chips in parallel. The specified electrical characteristics are Vf=2.8~3.2V and If=80mA total. Engineers must provide a suitable current-limited power source for this backlight.
  • Special Features: High resolution 262K color capability, fast response time (Typ. 30ms), IPS (In-Plane Switching) technology for wide viewing angles (80/80/80/80 deg. min.), compact size, and compliant with the RoHS directive.
  • Approval Status: Approved Product Specification only (Revision 1.0).

3. Exhaustive Technical Specifications

3.1 Mechanical & General Specification

This section provides the physical dimensions and other key general parameters of the module, which are critical for mechanical design integration.

Parameter Specification Unit
Panel Size 2.01'' (Diagonal) Inch
Module Size (H×V×D) 35.73 × 43.37 × 3.68 mm
Active Area (H×V) 32.04 × 39.516 mm
Number of Dots 240(RGB) × 296 pixels
Display Type Active matrix TFT, Transmissive type -
Display Colors 262K colors
Module Type COG+FPC+B/L -
Main LCD Driver IC JD9853 -
Input Data SPI -
Viewing Direction (Grayscale Inversion) IPS -

3.2 Absolute Maximum Ratings

The absolute maximum ratings are stress limits. Operating the module at or beyond these values can result in irreversible damage. Functional operation should always be within the recommended operating conditions.

Item Symbol Min Max Unit Remark
Supply voltage (Logic) VCC -0.3 3.6 V Note1 Note2
Supply voltage (I/O) IOVCC -0.3 3.6 V Note1 Note2
Operating temperature TOPR -10 60 °C Note1 Note2
Storage temperature TSTR -20 70 °C Note1 Note2

Note1: These values are absolute maximum ratings. Exceeding these values may cause permanent damage to the device.

Note2: All voltages are referenced to GND.

3.3 Recommended Electrical Characteristics

These are the recommended operating conditions for the module. The module has two main power

supply inputs: VCC for the core logic and panel driver, and IOVCC for the I/O interface level. This split rail design allows for flexible integration with host microcontrollers that may operate at different voltage levels.
Item Symbol Min Typ Max Unit
Supply voltage (Logic) VCC 2.6 2.8 3.3 V
Supply voltage (I/O) IOVCC 1.65 2.8 3.3 V
Input Voltage (L level) VIL 0 - 0.3*IOVCC V
Input Voltage (H level) VIH 0.7*IOVCC - IOVCC V

3.4 Electro-Optical Characteristics

The electro-optical characteristics define the visual performance of the module. These values are typically measured under specific laboratory conditions (Ta=25°C, in a dark room) and may vary in real-world applications. The module offers excellent contrast and wide viewing angles.

Item Symbol Condition Min. Typ. Max. Unit
Response time Tr + Tf θx = θy =0 - 30 35 ms
Contrast Ratio CR θx = θy =0 800 1200 - -
Transmittance T% θx = θy =0 4.8 5.33 - %
Color Chromaticity (White) W x θx = θy =0 - 0.311 - -
Color Chromaticity (White) W y θx = θy =0 - 0.334 - -
Viewing angle (all directions) θT, θB, θL, θR CR > 10 80 85 - Deg.

3.5 Interface Connection (15-Pin SPI Interface)

The module uses a 15-pin FPC connector with a 4-line SPI interface. The pinout is critical for correct integration. The interface includes power, ground, clock (SCL), chip select (CS), data/command select (RS), serial data (SDA), reset (RESET), a tearing effect output (TE), and power pins for the LED backlight (LEDA, LEDK).

PIN NO. Symbol I/O Description
1 GND P Ground
2 RS I Data/command selection pin in 4-line serial interface
3 CS I Chip select input pin
4 SCL I Serial interface clock
5 NC - No Connection
6 NC - No Connection
7 NC - No Connection
8 SDA I/O Serial in/out signal in SPI interface
9 RESET I Reset signal to initialize the chip properly
10 VCI P Power supply
11 VCI P Power supply
12 LEDA P Power for LED backlight anode
13 LEDK P Power for LED backlight cathode
14 TE O Tearing effect output to synchronize MPU to frame writing
15 GND P Ground

4. Application Scenario

The LSC0201I08-S-V1 is a versatile and high-performance display module, making it an ideal choice for any embedded system that requires a compact, vibrant visual output and wide viewing angles. Its 2.01-inch diagonal size with a 240×296 resolution provides a crisp and detailed image for rich graphical content, text, and icons. The 262K color capability allows for visually appealing user interface.

Key application areas are numerous and diverse:

  • Industrial Control Panels: HMIs for machinery, process controllers, and automation equipment benefit from the clear display and wide temperature range (-10°C to +60°C).
  • Smart Home Devices: Thermostats, smart switches, and security system keypads can use this display for a modern, intuitive touch interface (if used with an external touch panel).
  • Medical Instruments: Handheld diagnostic devices, patient monitors, and drug infusion pumps can utilize the module for clear data presentation and menu navigation.
  • Handheld Instruments: Multimeters, signal generators, and other portable test equipment benefit from the readable display and compact size.
  • IoT Edge Terminals: Data loggers and local display nodes for smart agriculture, building management, and environmental monitoring.

The module's IPS technology ensures excellent image consistency when viewed from any angle, which is critical for devices that are used from different perspectives. The standard SPI interface makes it easy to interface with a broad range of microcontrollers. Designers must ensure their application's operating environment stays within the -10°C to 60°C range to guarantee optimal performance and reliability.

5. Handling Precautions And Compliance

The LCD panel is made of glass and is fragile. The polarizer surface is easily scratched. The module should be handled with care to avoid applying pressure on the display area, especially the back of the LCD. ESD (Electrostatic Discharge) protection is mandatory throughout handling, assembly, and testing. Use grounded wrist straps, conductive work surfaces, and anti-static packaging. The FPC is also delicate; avoid sharp bends at the connector interface.

The module should be stored in a clean, dry environment away from direct sunlight, high temperatures, and corrosive gases. The recommended storage temperature is -20°C to 70°C. It is strongly recommended to use the module within six months of manufacturing, and after one year of storage, the electrical and optical characteristics should be re-validated.

It is strongly recommended to read the full specification document (LSC0201I08-S-V1 Product Specification Revision 1.0) before integration and to test the module under application-specific conditions. The manufacturer disclaims liability for damages resulting from improper use, modification, or failure to follow these guidelines.

The product is compliant with the RoHS (Restriction of Hazardous Substances) directive. Proper waste disposal according to local regulations is recommended at the end of the product's lifecycle.

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Eddie Chen
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