LSC031I01-MP-V1 (ST7102): 3.1-inch TFT LCD Module, 480×800, MIPI Interface, 16.7M Colors, Transmissive IPS
Product Subtitle / Keywords
3.1 Inch Display, 480(RGB)×800 Resolution, Transmissive a-Si TFT-LCD Module, COG+FPC+B/L+LENS Module Type, MIPI Interface (1 Lane DSI), 16.7M Colors (24-bit), Main LCD Driver: ST7102, IPS Display Mode, Module Outline: 43.48(W) × 82.18(H) × TBD(D) mm (Approx.), Active Area: 40.32(W) × 67.2(H) mm (Approx.), Operating Temp: -20°C ~ +70°C, Storage Temp: -30°C ~ +80°C, Backlight: 6 Chip-White LED (Parallel), Vf=18V (Typ.), If=20mA, View Direction: IPS (ALL), Display Mode: Transmissive, with Cover Lens (LENS), RoHS Compliant, Product Revision 1.0, AQL Inspection Standard: GB/T 2828-2003, Class II
1. Executive Summary And Product Positioning
The LSC031I01-MP-V1 is a 3.1-inch diagonal transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module, manufactured by Lesson (Wanan) Smart Display Technology Co., Ltd. This comprehensive module is a complete, ready-to-use visual interface solution, integrating a TFT-LCD panel, a driver circuit, a backlight unit (B/L), and a cover lens (LENS) into a compact and robust package. The product specification (Revision 1.0, dated 2026-02-05) serves as the definitive technical document for this module.
This module is characterized by its high-resolution display in a 3.1-inch form factor. It features a resolution of 480(RGB)×800 pixels and is capable of displaying up to 16.7M colors, which corresponds to 24-bit color depth (8-bit per primary color Red, Green, Blue). This ensures smooth color gradients and detailed imagery suitable for advanced graphical user interfaces. The module includes a cover glass (LENS) for surface protection and aesthetic integration, with specific material and strength requirements defined in the specification.
The unequivocal recommendation for engineers is to strictly adhere to the absolute maximum ratings, electrical specifications, and interface timing described herein to ensure reliable performance and compatibility within the intended application. Failure to operate within these limits can lead to permanent damage, degraded optical performance, or reduced product lifespan. The manufacturer has provided key recommendations for mechanical integration, including VA area clearance and TP placement.
2. Detailed Product Overview And Architecture
The LSC031I01-MP-V1 is engineered for devices that demand a crisp, vibrant display in a compact form factor, such as handheld instruments, smart home devices, and portable terminals. Its architecture is built around several key technologies and design choices:
- Core Technology: Transmissive type a-Si TFT-LCD with IPS (In-Plane Switching) display mode. This technology offers superior color reproduction and wide viewing angles (specified as "ALL" direction). As a transmissive display, it requires a backlight to be visible.
- Module Type: COG (Chip-On-Glass) + FPC (Flexible Printed Circuit) + B/L (Backlight) + LENS (Cover Glass). The driver IC (ST7102) is directly mounted onto the LCD glass (COG), minimizing size and interconnect complexity. The FPC provides a flexible connection to the host system. The module includes a strengthened cover glass (LENS) for surface protection and visual quality. The LENS has specific requirements including oil-ink thickness ≤12µm, insulation resistance >100000Ω, CS≥4500px (strength), DOL≥9µm (depth of layer), and surface hardness ≥6H. It also specifies a CG material thickness of 0.7mm and a 5.64g steel ball drop test at 320M center point with 3 drops without breakage.
- Display Format: Graphic 480(RGB)×800 Dot-matrix. This is a high-resolution WVGA portrait resolution, ideal for applications requiring a vertical display area with fine detail. The RGB stripe arrangement provides full color mixing for each pixel.
- Display Characteristics: Capable of displaying up to 16.7M colors. This refers to 8-bit color depth per primary color (R, G, B), allowing the module to generate 16,777,216 distinct colors for the most realistic and smooth color reproduction. The transmittance of the finished glass area is ≥85%.
- Interface Type: The module utilizes a MIPI-DSI (Mobile Industry Processor Interface - Display Serial Interface) for high-speed data transfer. The interface uses differential data and clock lines (D0P/D0N, CLKP/CLKN), which is standard for modern application processors. The pinout includes one data lane (D0+/-) and one clock lane (CK+/-).
- Main LCD Driver IC: The module integrates the ST7102 driver IC. This specific IC is designed to drive the TFT matrix and handle the MIPI interface commands.
- Backlight Unit: The module utilizes a white LED backlight comprised of 6 chips connected in parallel (并联). The specified driving condition is IF=20mA and Vf (Typ.)=18V.
- Special Features: High resolution 16.7M color capability (8-bit), IPS technology for wide viewing angles (ALL), compact size (3.1 inch), MIPI 1-Lane interface for standard integration, cover glass (LENS) with high surface hardness (≥6H) and strength, silver adhesive points for grounding, electromagnetic film grounding points (at least 6 points), and compliant with the RoHS directive. The module includes a transparent hole for a camera (售方透明孔摄像头银浆点). The module also includes specific materials for structural assembly: conductive double-sided tape (T=0.05mm), yellow insulation paper (T=0.15mm), steel sheet reinforcement (T=0.2mm), and Japan Sumitomo foam (5230, T=0.3mm). The FPC has a specific bending sequence for shipping (弯折出货).
- Mechanical Integration Recommendations: The specification provides several key recommendations: 1) The case visual area should be smaller than the VAmds (Viewing Area) by more than 0.3mm per side. 2) The foam opening for the case should be larger than the VAmds by more than 0.6mm per side. 3) The Q TD edge should not contact any metal conductor.
- Approval Status: Approved Product Specification only (Revision 1.0).
3. Exhaustive Technical Specifications
3.1 General & Mechanical Specification
This section provides the physical dimensions and other key general parameters of the module. The module includes a cover glass (LENS) and specific structural elements for integration.
| Parameter | Specification | Unit |
|---|---|---|
| Panel Size | 3.1'' (Diagonal) | Inch |
| Module Outline (W×H) | 43.48 × 82.18 (Approx.) | mm |
| Active Area (H×V) | 40.32 × 67.2 (Approx.) - Calculated from VA | mm |
| Viewing Area (VA) | 40.92 × 67.88 (Approx.) | mm |
| Number of Dots | 480(RGB) × 800 | pixels |
| Display Type | Active matrix a-Si TFT, Transmissive, IPS | - |
| Display Colors | 16.7M (24-bit) | colors |
| Module Type | COG+FPC+B/L+LENS | - |
| Main LCD Driver IC | ST7102 | - |
| Display Mode | IPS / Transmissive | - |
| LENS Size (W×H) | 44.94 × 82.18 (Approx.) | mm |
| View Direction (Best Image) | IPS (ALL View Direction) | - |
| Interface | MIPI (1 Data Lane + 1 Clock Lane) | - |
| Backlight Type | White LED (6 chips in parallel) | - |
| LENS Material | CG (Cover Glass), 0.7mm thickness, No AF | - |
| LENS Surface Finish | Black silk-screen, surface hardness ≥6H | - |
3.2 Absolute Maximum Ratings
The absolute maximum ratings are stress limits. Operating the module at or beyond these values can result in irreversible damage.
| Parameter | Symbol | Min | Max | Unit |
|---|---|---|---|---|
| Supply voltage | IOVCC | -0.3 | 2.1 | V |
| Operating temperature | TOPR | -20 | 70 | °C |
| Storage temperature | TSTR | -30 | 80 | °C |
3.3 Electrical Characteristics
These are the recommended operating conditions for the module.
| Item | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Supply voltage | IOVCC | 1.65 | 1.8 | 1.95 | V |
| Input Voltage (L level) | VIL | VSS | - | 0.3*IOVCC | V |
| Input Voltage (H level) | VIH | 0.7*IOVCC | - | IOVCC | V |
3.4 Backlight Driving Conditions
The module uses a white LED backlight composed of 6 chips configured in parallel. The driving condition is: IF=20mA, Vf (Typ.)=18V. A constant current source is recommended for driving the backlight to ensure consistent brightness and longevity.
| Parameter | Symbol | Typ | Unit |
|---|---|---|---|
| Forward Voltage (LED String) | VF | 18.0 | V |
| Forward Current (LED String) | If | 20 | mA |
3.5 Interface Connection (17-Pin FPC)
The module uses a 17-pin FPC connector for the LCD and a separate connector for the CTP. The LCD interface includes power (VCC, IOVCC, GND), MIPI data and clock lanes (MIPI_D0+/-, MIPI_CK+/-), MIPI data (MIPI_D1+/-), control signals (RST, TE, FRST), backlight power (LEDA, LEDK), and CTP interface (CTP_RSTB, CTP_EINT, CTP_SDA, CTP_SCL).
| PIN NO. | Symbol | I/O | Description |
|---|---|---|---|
| 1 | MIPI_D0+ | I | MIPI DSI Data Lane 0 Positive Input |
| 2 | MIPI_D0- | I | MIPI DSI Data Lane 0 Negative Input |
| 3 | GND | P | Ground |
| 4 | MIPI_CK+ | I | MIPI DSI Clock Lane Positive Input |
| 5 | MIPI_CK- | I | MIPI DSI Clock Lane Negative Input |
| 6 | MIPI_D1+ | I | MIPI DSI Data Lane 1 Positive Input |
| 7 | MIPI_D1- | I | MIPI DSI Data Lane 1 Negative Input |
| 8 | GND | P | Ground |
| 9 | CTP_VCC (NC) | P | Not Connected |
| 10 | GND | P | Ground |
| 11 | VIO (1.8V) | P | I/O Power Supply (TOVCC) |
| 12 | VCC (2.8V) | P | Main Power Supply |
| 13 | GND | P | Ground |
| 14 | LCM_LEDA | P | Backlight Anode (LED+). |
| 15 | GND | P | Ground |
| 16 | LCM_TE (1.8V) | O | Tearing Effect Output |
| 17 | LCM_RSTB (1.8V) | I | Reset Signal (Active Low) |
| 18-22 | CTP_RSTB, CTP_EINT, FRST, SDA, SCL | I/O | CTP Interface Signals |
| 23 | GND | P | Ground |
| 24 | LCM_LEDK | P | Backlight Cathode (LED-). |
3.6 MIPI High-Speed Transmission Timing
The MIPI interface follows standard timing parameters for high-speed data transmission. The module uses one data lane (MIPI_D0+/-) and one clock lane (MIPI_CK+/-) with specific timing for LP and HS modes.
| Parameter | Symbol | Min | Max | Unit |
|---|---|---|---|---|
| High-speed data transmission time | THS-SYNC | - | - | - |
| Data lane HS setup time | THS-SETUP | - | - | - |
| Data lane HS hold time | THS-HOLD | - | - | - |
| EoT time | TEOT | - | - | - |
3.7 Inspection Standards
The module is subject to inspection according to GB/T 2828-2003, normal inspection, Class II. The AQL (Acceptable Quality Level) for major and minor defects is defined in the specification. The inspection includes appearance defects (e.g., line defects, spot defects, scratches) and electrical performance defects.
| Defect Type | AQL | Standard |
|---|---|---|
| Major Defect | 0.65% | GB/T 2828-2003 |
| Minor Defect | 1.5% | GB/T 2828-2003 |
4. Application Scenario
The LSC031I01-MP-V1 is a high-performance, compact display module ideal for any embedded system that requires a vibrant, high-resolution display in a 3.1-inch form factor. Its 480×800 resolution provides a crisp and detailed image for rich graphical content and text. The 16.7M color capability allows for the most realistic and visually appealing user interface possible with an LCD. The inclusion of a cover glass (LENS) provides surface protection and allows for design flexibility.
Key application areas are numerous and diverse:
- Industrial Control Panels: HMIs for machinery, process controllers, and automation equipment benefit from the clear display, wide temperature range (-20°C to +70°C), and robust LENS.
- Handheld Instruments: Multimeters, signal generators, and other portable test equipment benefit from the readable display and compact size.
- Medical Instruments: Handheld diagnostic devices, patient monitors, and drug infusion pumps can utilize the module for clear data presentation and menu navigation.
- Smart Home Devices: Thermostats, smart switches, and security system keypads can use this display for a modern, intuitive interface.
- IoT Edge Terminals: Data loggers and local display nodes for smart agriculture, building management, and environmental monitoring.
The module's MIPI 2-Lane interface is standard for modern microcontrollers and application processors, simplifying integration. The IPS technology ensures excellent image consistency when viewed from any angle. The manufacturer's specific mechanical recommendations (VA clearance, foam opening, Q TD isolation) are critical for successful mechanical design integration. The high-surface-hardness LENS (≥6H) provides excellent scratch resistance.
5. Handling Precautions And Compliance
The LCD panel is made of glass and is fragile. The polarizer surface is easily scratched. The module should be handled with care to avoid applying pressure on the display area, especially the back of the LCD. ESD (Electrostatic Discharge) protection is mandatory throughout handling, assembly, and testing. Use grounded wrist straps, conductive work surfaces, and anti-static packaging. The module includes specific ESD protection features: silver adhesive points for grounding, electromagnetic film grounding points (at least 6 points), and conductive double-sided tape (T=0.05mm).
Important: The module is shipped with the FPC in a bent state (弯折出货). Follow the specific FPC bending sequence (FPC排线折弯顺序) provided in the specification: screen attached to FPC, FPC bent and fixed for shipping (屏幕贴到FPC上, FPC弯折固定出货). The FPC is delicate; avoid sharp bends at the connector interface. The module includes a cover glass (LENS) with specific strength requirements: 5.64g steel ball drop test at 320M center point with 3 drops without breakage. Do not apply excessive force to the LENS surface.
The module should be stored in a clean, dry environment away from direct sunlight, high temperatures, and corrosive gases. The recommended storage temperature is -30°C to 80°C. It is strongly recommended to use the module within six months of manufacturing, and after one year of storage, the electrical and optical characteristics should be re-validated.
It is strongly recommended to read the full specification document (LSC031I01-MP-V1 Product Specification Revision 1.0, dated 2026-02-05) before integration and to test the module under application-specific conditions. The manufacturer disclaims liability for damages resulting from improper use, modification, or failure to follow these guidelines.
The product is compliant with the RoHS (Restriction of Hazardous Substances) directive and halogen-free requirements. Proper waste disposal according to local regulations is recommended at the end of the product's lifecycle. The ink on the cover glass is an insulating ink with a thickness of ≤12µm and an insulation resistance >100000Ω.
