LSC064I01-MP-V1 | 6.4 inch TFT-LCD | 1440x2560 (RGB) | Transmissive | MIPI | High-Resolution Display | 60 Pins
1. Executive Summary & Product Positioning
The LSC064I01-MP-V1 is a high-performance, transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module developed by 立信(万安)智显科技有限公司 (Lesson Smart Display Technology Co., Ltd). This module integrates a TFT-LCD panel, a driver circuit, and a backlight unit in a compact COG+FPC+B/L package. With a display size of 6.4 inches and an ultra-high resolution of 1440(RGB)×2560 dots (WQHD), it delivers up to 16.7 million colors, making it ideal for high-precision graphical user interfaces.
Product Positioning: Designed for high-end industrial control panels, medical imaging equipment (e.g., portable ultrasound, endoscope monitors), professional photography/video equipment, and any application requiring extremely high pixel density and fine detail rendering. The module features a dual-port MIPI DSI interface (using 4 lanes per port, total 8 data lanes) to support the high bandwidth required by the 1440x2560 resolution. Its rugged design and wide operating temperature range ensure reliable performance in demanding environments.
2. Detailed Product Overview & Architecture
The module's architecture is based on a multi-component assembly designed for ease-of-integration and high reliability. The primary components include:
- TFT-LCD Panel: 6.4-inch diagonal, a-Si TFT active matrix, transmissive mode, Normally Black. The active area (H×V) is approximately 140.16 mm × 84.96 mm. The resolution is 1440(RGB)×2560 dots, featuring ultra-fine pixel pitch.
- Driver IC: The specification does not explicitly name a driver IC, but the module's timing diagram and power-up sequence indicate it uses a modern WQHD TFT driver supporting MIPI DSI 4-lane dual-port interface, with support for NVM (Non-Volatile Memory) auto-load and sleep mode.
- Backlight Unit (B/L): The backlight consists of high-power white LEDs. The LED configuration is dual-channel (LED1+, LED2+; LED1-, LED2-), with typical forward current of 25mA per channel and power dissipation of 77.5mW. The forward voltage (Vf) is typically 2.9V per LED at 20mA.
- Mechanical Construction: COG (Chip-on-Glass) + FPC (Flexible Printed Circuit) + B/L. The connector is a 60-pin, 0.4mm pitch, B to B connector (HIROSE BM14B(0.8)-60DP-0.4V on module, corresponding connector: HIROSE BM14B(0.8)-60DS-0.4V).
3. Exhaustive Technical Specifications
3.1 General & Mechanical Specifications
| Item | Specification |
| Display Size (Diagonal) | 6.4 inches |
| Resolution (Dots) | 1440(RGB) × 2560 (WQHD) |
| Display Type | a-Si TFT-LCD, Transmissive, Normally Black |
| Module Construction | COG+FPC+B/L |
| Color Depth | 16.7M colors (8-bit) |
| Interface | MIPI DSI (4 data lanes * 2 ports, total 8 lanes) |
| Connector (on Module) | 60 pins, 0.4mm pitch, B to B, HIROSE BM14B(0.8)-60DP-0.4V |
| Connector (Corresponding) | 60 pins, 0.4mm pitch, B to B, HIROSE BM14B(0.8)-60DS-0.4V |
| Backlight LED | Dual channel LED (LED1+, LED1-; LED2+, LED2-), If=25mA/ch |
| Module Outline | Approx. 148.92 × 102.0 × 2.92 mm (based on drawing) |
| Active Area (H×V) | ~140.16 × 84.96 mm (based on 6.4 inch diagonal and resolution ratio) |
| NTSC Ratio (Optical) | 90% (TYP) |
| Response Time (Tr+Td) | - / 35 (TYP) / - ms |
3.2 Interface & Electrical Specifications
3.2.1 Absolute Maximum Ratings (From Section 5)
| Parameter | Symbol | Min | Max | Unit |
|---|---|---|---|---|
| Supply Voltage (IOVCC-GND) | IOVCC | -0.3 | +4.6 | V |
| Supply Voltage (VSP-GND) | VSP | -0.3 | +6.5 | V |
| Supply Voltage (VSN-GND) | VSN | -6.5 | +0.3 | V |
| Supply Voltage (AVDD-GND) | AVDD | -0.3 | +3.6 | V |
| Supply Voltage (VDDIN-GND) | VDDIN | -0.3 | +3.6 | V |
| Supply Voltage (VDDIO-GND) | VDDIO | -0.3 | +3.6 | V |
| Operating Temperature (Backlight) | Topr | -30 | +85 | °C |
| Storage Temperature (Backlight) | Tstg | -40 | +90 | °C |
3.2.2 Electrical Characteristics (LCD + TP, From Section 6)
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Logic High Input Voltage | VIH | Ta=-20~60°C | 880 | - | 1350 | mV |
| Logic Low Input Voltage | VIL | Ta=-20~60°C | -50 | - | 550 | mV |
| Logic High Output Voltage | VOH | Ta=-20~60°C | 1.1 | 1.2 | 1.3 | V |
| Logic Low Output Voltage | VOL | Ta=-20~60°C | -50 | - | 50 | mV |
| LCD Current Consumption (IOVCC) | Iiovcc1 | Ta=25°C | - | 24.33 | 30.34 | mA |
| LCD Current Consumption (VSP) | Ivsp1 | Ta=25°C | - | 22.22 | 29.47 | mA |
| TP Supply Voltage (VDDH_3.3V or VDD_3.3V) | - | Ta=-20~60°C | 3.1 | 3.3 | 3.47 | V |
3.2.3 Pin Description (From Section 7-2, Key Pins)
The module utilizes a 60-pin FPC connector (HIROSE BM14B). The interface uses two MIPI DSI ports (Port A and Port B), each with 4 data lanes (DSIA_D0-DSIA_D3 for Port A, DSIB_D0-DSIB_D3 for Port B) and a clock lane. There are also separate power pins for LCD and Touch Panel (TP). The following table describes the key pins.
| Pin No. | Symbol | I/O | Description |
|---|---|---|---|
| 1, 2 | DSIB_D3_N, DSIB_D3_P | I | MIPI DSI Port B Lane 3 (Negative, Positive) |
| 4, 5 | DSIB_D0_N, DSIB_D0_P | I/O | MIPI DSI Port B Lane 0 (Negative, Positive) |
| 7, 8 | DSIB_CLK_N, DSIB_CLK_P | I | MIPI DSI Port B Clock (Negative, Positive) |
| 10, 11 | DSIB_D1_N, DSIB_D1_P | I | MIPI DSI Port B Lane 1 (Negative, Positive) |
| 13, 14 | DSIB_D2_N, DSIB_D2_P | I | MIPI DSI Port B Lane 2 (Negative, Positive) |
| 16, 17 | DSIA_D2_P, DSIA_D2_N | I | MIPI DSI Port A Lane 2 (Positive, Negative) |
| 19, 20 | DSIA_D1_P, DSIA_D1_N | I | MIPI DSI Port A Lane 1 (Positive, Negative) |
| 22, 23 | DSIA_CLK_P, DSIA_CLK_N | I | MIPI DSI Port A Clock (Positive, Negative) |
| 25, 26 | DSIA_D0_P, DSIA_D0_N | I/O | MIPI DSI Port A Lane 0 (Positive, Negative) |
| 3, 6, 9, 12, 15, 18, 21, 24, 27-31 | GND | P | Ground |
| 32 | CTS1 / I01 | I | Clock / I2C address select |
| 33 | CTS1 / ID0 | I/O | Clock / I2C data / ID0 |
| 36, 37, 38 | AVDD, AVDD-, VDD10 | P | Analog power (positive), Analog power (negative), Internal logic power |
| 39, 40 | GND, TE | P/O | Ground, Tearing effect output |
| 41 | HSYNC | I | Horizontal sync signal (optional) |
| 42 | GND | P | Ground |
| 43 | PWM | I | Backlight PWM dimming control |
| 44 | XRES | I | System reset pin (Active low) |
| 45, 46 | SCL, SDA | I/O | I2C interface clock and data |
| 47, 48 | VDDH_3.3V, VDD_3.3V | P | Power for TP controller (AVDD and Digital) |
| 49 | GND | P | Ground |
| 50 | INT/RST | I/O | Interrupt/Reset for TP |
| 51 | GND | P | Ground |
| 52-53 | VSYNC, VBUS | I/O/P | Vertical sync (optional), VBUS (for TP) |
| 55-56, 58-59 | LED1+, LED1-, LED2+, LED2- | P | Backlight LED power (Anode and Cathode for Channel 1 and Channel 2) |
3.3 Timing Characteristics (From Section 8)
3.3.1 LCD Power On Sequence (From Section 8-1)
The module requires a specific power-up sequence to ensure proper initialization. The sequence uses the MIPI DSI interface (4 lane * 2 port, WQHD 1440x2560, VSP=5.9V, VSN=-5.9V, VDDIO=1.8V). Key timing parameters include:
| Action | Timing/Delay | Notes |
|---|---|---|
| Set RESX = L | - | Step 1 |
| Turn on IOVDD (Typ 1.8V) | Wait min 200ms | Wait for IOVDD=90% |
| Turn on AVDD+ (Typ 5.9V) | Wait 20ms | Wait for VSP->VSN ordering |
| Wait for VSN | Wait 20ms | Step 6 |
| RESX = L (again) | Wait min 10ms | Ensure RESX low period |
| Set RESX = H | Wait min 10ms | Release reset |
| NVM Auto Load + Sleep Mode | - | Follow with manufacturing commands |
Note: The full sequence in the specification includes 17 steps. The table above highlights the critical power-up and reset timing. The MIPI I/F must first be in LP mode after IOVDD is stable, then transition to HS mode after the reset sequence.
3.3.2 MIPI DSI DC Characteristics (From Section 8)
| Parameter | Symbol | Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Differential Input High Threshold | VIDTH | IOVDD=1.65V~3.30V | - | - | 70 | mV |
| Differential Input Low Threshold | VIDTL | IOVDD=1.65V~3.30V | -70 | - | - | mV |
| Common-mode Voltage HS RX | VCMRX(DC) | IOVDD=1.65V~3.30V | 70 | - | 330 | mV |
| Differential Input Impedance | ZID | IOVDD=1.65V~3.30V | - | 100 | - | Ω |
| LP Contention Threshold (Logic 1) | VIHCD | IOVDD=1.65V~1.95V | 450 | - | - | mV |
3.3.3 MIPI DSI LP-RX/TX Clock and Data Timing (From Section 8)
The DSI link operates with specific timing for low-power states, defined as TLPX. Key parameters include:
| Parameter | Symbol | Condition | Min | Max | Unit |
|---|---|---|---|---|---|
| Length of LP state period | TLPX | IOVCC=1.65~1.95V | 50 | - | ns |
| Time-out before new TX starts | TTA-SGET | IOVCC=1.65~1.95V | 1*TLPX | 2*TLPX | ns |
| Time to drive LP-00 by new TX | TTA-GET | IOVCC=1.65~1.95V | - | 5*TLPX | ns |
| TCLK-POST | - | IOVCC=1.65~1.95V | 60 ns + 52UI | - | ns |
3.4 Environmental & Reliability Specifications
The module is designed to operate reliably across a range of conditions. The following specifications are extracted from the specification's Absolute Maximum Ratings and Optical Characteristics sections.
| Operating Temperature (Backlight) | -30°C to +85°C |
| Storage Temperature (Backlight) | -40°C to +90°C |
| Brightness (Typical) | 400 cd/m² (TYP) |
| Contrast Ratio (TYP) | 1300:1 (TYP) |
| Viewing Angle (Contrast ≥ 10) | 80°/80°/80°/80° (L/R/U/D, TYP) |
| Optical Uniformity | 80% (MIN) |
| Flicker Ratio | - / - / 10% (MAX) |
| NTSC Ratio | - / 90% (TYP) / - |
4. Application Guidelines & Critical Notes
When integrating the LSC064I01-MP-V1 module, engineers must adhere to the specific guidelines outlined in the specification to ensure optimal performance and reliability.
- Power Supply Sequence: The module requires a precise power-up sequence: IOVDD → AVDD+ → AVDD- → RESX release. Failure to follow this sequence may cause latch-up or improper initialization. The power-down sequence must be the reverse of power-up.
- High-Speed MIPI Design: With 8 data lanes plus 2 clock lanes (dual port MIPI), PCB layout must maintain strict 100Ω differential impedance control. The total data rate is very high to support WQHD at 60Hz. Trace length matching within lanes and between ports is critical for signal integrity.
- Backlight Driver: The LED backlight uses two separate channels (LED1 and LED2). Each channel requires a constant current driver with typical 25mA. The total backlight power dissipation is 77.5mW (TYP). Ensure the driver can provide the correct voltage based on the LED Vf (Typ 2.9V at 20mA). PWM dimming is available via the PWM pin.
- Touch Panel Interface: The TP controller is powered via VDDH_3.3V and VDD_3.3V pins. It communicates over I2C (SCL, SDA) with an interrupt (INT/RST). Proper pull-up resistors are needed on the I2C lines. The I2C address is selected via the CTS1 pins.
- Mechanical Mounting: The module is relatively thin (approx. 2.92mm). The FPC connector is a HIROSE BM14B series, 60-pin, 0.4mm pitch. Special care must be taken during connector mating and FPC handling. The module has an Ag shield area on the back; ensure proper grounding and avoid shorting.
- Optical Performance: The module provides excellent optical performance with 90% NTSC and 400 cd/m² brightness. For consistent color reproduction, perform optical calibration using the specified chromaticity coordinates (x=0.300, y=0.320, TYP).
5. Conclusion & Design-In Support
The LSC064I01-MP-V1 from Lesson Smart Display Technology is a high-resolution, high-performance 6.4-inch WQHD TFT-LCD module. With its 1440x2560 resolution, exceptional color gamut (90% NTSC), and dual-port MIPI DSI interface, it is ideally suited for professional-grade applications requiring extremely fine detail and vibrant image quality.
For design-in support, it is strongly recommended to:
- Refer to the full Product Specification (Revision 1.0) for the complete NVM load sequence, Sleep Mode commands, and Deep Standby timings.
- Obtain the driver IC application notes for detailed MIPI D-PHY configuration and register settings.
- Utilize the mechanical drawing (Outline Dimension) for accurate footprint creation, especially for the 60-pin HIROSE connector.
- Contact the manufacturer for evaluation kit availability, design review support, and sample requests.
This module is designed to meet the rigorous demands of modern, high-resolution industrial and medical displays, ensuring long-term availability and performance.
