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LSC070I29-MP-V1 7.0 Inch TFT-LCD Module 800x1280 16.7M Colors ILI9881C Driver IC COG+FPC+B/L+CTP

LSC070I29-MP-V1 7.0 Inch TFT-LCD Module 800x1280 16.7M Colors

Product Keywords: 7.0″ LCD Module, COG+FPC+B/L+CTP, 800(RGB)×1280 Resolution, 16.7M Colors, Transmissive a-Si TFT-LCD, IPS, MIPI DSI Interface (4-Lane), ILI9881C Driver IC, White LED Backlight, -20°C to +70°C Operation, Revision 1.0.

1. Executive Summary & Product Positioning

The LSC070I29-MP-V1 is a 7.0-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module with an integrated Capacitive Touch Panel (CTP), developed by 立信(万安)智显科技有限公司 (Lesson Smart Display Technology Co., Ltd). The module is composed of a TFT-LCD panel, a driver circuit, a backlight unit, and a CTP. The panel size is 7.0 inch and the resolution is 800(RGB)×1280, the panel can display up to 16.7M colors. This module features a COG (Chip-on-Glass) + FPC + B/L (Backlight) + CTP construction and is designed for a wide range of applications requiring a medium-to-large format, high-quality display with touch capability. [1](@index-ref?id=1)

Product Positioning: This 7.0-inch module is ideally suited for tablet devices, industrial terminals, medical equipment, smart home control panels, in-vehicle displays, and other embedded systems requiring a bright, vivid display with wide viewing angles and intuitive touch interaction.

2. Detailed Product Overview & Architecture

The module's architecture integrates the display and touch into a single, easy-to-integrate package. The primary components include:

  • TFT-LCD Panel: 7.0-inch diagonal, a-Si TFT active matrix, transmissive, IPS (In-Plane Switching). Resolution is 800(RGB) × 1280 pixels.
  • Driver Circuit: The module integrates the ILI9881C driver IC, communicating via MIPI DSI (Display Serial Interface) with up to 4 data lanes.
  • Backlight Unit (B/L): A white LED backlight configuration.
  • Capacitive Touch Panel (CTP): An integrated CTP.
  • Mechanical Construction: COG (Chip-on-Glass) + FPC + B/L + CTP.
  • Interface: The module communicates via a 31-pin FPC connector. The display interface is MIPI DSI (4-Lane).
  • Display Mode: Transmissive, IPS.
  • Viewing Direction: Free (IPS).
  • RoHS: All materials are compliant with RoHS standards.

3. Exhaustive Technical Specifications

3.1 General & Mechanical Specifications

Item Specification
Display Size (Diagonal) 7.0 inches
Resolution (Dots) 800(RGB) × 1280
Display Technology Active Matrix TFT, Transmissive, a-Si, IPS
Module Construction COG+FPC+B/L+CTP
Color Depth 16.7M Colors
Input Data Interface MIPI DSI (4-Lane)
Driver IC ILI9881C
Display Mode Transmissive, IPS
Viewing Direction Free (IPS)
Backlight Type White LED
Module Outline (H×V×D) 115.0 × 198.00 × 4.83 mm
Active Area (H×V) 94.2 × 150.72 mm
Operating Temperature -20°C to +70°C
Storage Temperature -30°C to +80°C
Environmental Compliance RoHS

3.2 Absolute Maximum Ratings

Stress beyond those listed may cause permanent damage to the device.

Item Symbol Min Max Unit
Supply voltage VCC -0.3 3.6 V
Supply voltage IOVCC -0.3 3.6 V
Operating temperature TOPR -20 70 °C
Storage temperature TSTR -30 80 °C

3.3 Electrical Characteristics

3.3.1 Recommended DC Characteristics

Item Symbol Min Typ Max Unit
Supply voltage VCC 2.8 3.3 3.6 V
Supply voltage IOVCC 1.65 1.8 3.6 V
Input Voltage (L level) VIL VSS — 0.3×IOVCC V
Input Voltage (H level) VIH 0.7×IOVCC — IOVCC V

3.4 Interface Pin Assignment (31-Pin FPC)

The module communicates via a 31-pin FPC connector. The interface is MIPI DSI (4-Lane).

PIN NO. Symbol I/O Description
1 LEDA P Power for LED backlight anode
2 LEDA P Power for LED backlight anode
3 LEDA P Power for LED backlight anode
4 NC — No connection
5 LEDK P Power for LED backlight cathode
6 LEDK P Power for LED backlight cathode
7 LEDK P Power for LED backlight cathode
8 LEDK P Power for LED backlight cathode
9 GND P Ground
10 GND P Ground
11 D2P I MIPI DSI differential data pair (Data lane 2) Positive
12 D2N I MIPI DSI differential data pair (Data lane 2) Negative
13 GND P Ground
14 D1P I MIPI DSI differential data pair (Data lane 1) Positive
15 D1N I MIPI DSI differential data pair (Data lane 1) Negative
16 GND P Ground
17 CLKP I MIPI DSI differential clock pair Positive
18 CLKN I MIPI DSI differential clock pair Negative
19 GND P Ground
20 D0P I MIPI DSI differential data pair (Data lane 0) Positive
21 D0N I MIPI DSI differential data pair (Data lane 0) Negative
22 GND P Ground
23 D3P I MIPI DSI differential data pair (Data lane 3) Positive
24 D3N I MIPI DSI differential data pair (Data lane 3) Negative
25 GND P Ground
26 IOVCC P I/O power supply
27 RESET I Reset pin (active low)
28 NC — No connection
29 IOVCC P I/O power supply
30 VDD P Power supply
31 VDD P Power supply

3.5 MIPI DSI Timing Characteristics

The module uses ILI9881C driver IC with MIPI DSI interface supporting up to 4 data lanes.

3.5.1 DSI Clock Channel Timing

Signal Symbol Parameter Min Max Unit
CLKP/N 2×UI_INST Double UI instantaneous Note2 25 ns
CLKP/N UI_INSTA, UI_INSTB UI instantaneous Half Note2 12.5 ns

3.5.2 Limited Clock Channel Speed (by Data Type & Lane Count)

Data Type UI per Pixel 2-Lane Speed 3-Lane Speed 4-Lane Speed
RGB 565 (0Eh) 16 566 Mbps 466 Mbps 366 Mbps
RGB 666 (1Eh) 18 637 Mbps 525 Mbps 412 Mbps
RGB 666 Loosely (2Eh) 24 850 Mbps 750 Mbps 650 Mbps
RGB 888 (3Eh) 24 850 Mbps 750 Mbps 650 Mbps

3.5.3 DSI Data to Clock Channel Timings

Signal Symbol Parameter Min Unit
DnP/N (n=0,1) t_DS Data to Clock Setup time 0.15×UI -
DnP/N (n=0,1) t_DH Clock to Data Hold Time 0.15×UI -

3.5.4 Rise and Fall Timings on Clock and Data Channels

Parameter Symbol Condition Min Max Unit
Differential Rise Time for Clock t_DRTKL CLKP/N 150 0.3UI ps
Differential Rise Time for Data t_DRDATA DnP/N (n=0,1) 150 0.3UI ps
Differential Fall Time for Clock t_DFTCKL CLKP/N 150 0.3UI ps
Differential Fall Time for Data t_DFDATA DnP/N (n=0,1) 150 0.3UI ps

3.5.5 Low Power State Period Timings

Signal Symbol Description Min Max Unit
D0P/N T_LPXM Length of LP-00, LP-01, LP-10 or LP-11 periods (MCU → Display Module) 50 75 ns
D0P/N T_LPXD Length of LP-00, LP-01, LP-10 or LP-11 periods (Display Module → MCU) 50 75 ns
D0P/N T_TA-SURED Time-out before Display Module starts driving T_LPXD 2×T_LPXD ns

3.5.6 Data Lanes - Low Power Mode to High Speed Mode Timings

Signal Symbol Description Min Max Unit
DnP/N (n=0,1) T_LPX Length of any Low Power State Period 50 - ns
DnP/N (n=0,1) T_HS-PREPARE Time to drive LP-00 to prepare for HS Transmission 40+4×UI 85+6×UI ns
DnP/N (n=0,1) T_HS-TERMEN Time to enable Data Lane Receiver line termination - 35+4×UI ns
DnP/N (n=0,1) T_HS-SKIP Time-Out at Display Module to ignore transition period of EoT 40 55+4×UI ns
DnP/N (n=0,1) T_HS-EXIT Time to drive LP-11 after HS burst 100 - ns

3.6 Mechanical Dimensions & Design Notes

3.6.1 Key Mechanical Dimensions

Item Specification
LCM Module Outline (H×V) 115.0 × 198.0 mm
LCM Total Thickness 4.83 mm
Active Area (AA) Width (H) 94.2 mm
Active Area (AA) Height (V) 150.72 mm

3.6.2 Design Notes from Documentation

  • Display Type: Main LCD: Transmissive, IPS.
  • Main LCD Driver IC: ILI9881C.
  • Module Type: COG+FPC+B/L+CTP.
  • RoHS: All materials are ROHS compliant.

4. Application Guidelines & Critical Notes

  • Power Supply: The module requires VCC (3.3V typical) and IOVCC (1.8V typical) power supplies. Ensure the power supplies are stable and have low ripple.
  • Interface: This module uses MIPI DSI interface with up to 4 data lanes. The host processor must be configured for the appropriate DSI data format (RGB565, RGB666, or RGB888) and lane count.
  • Backlight Driver: A constant current driver is required to supply the backlight via the LEDA (Pins 1-3) and LEDK (Pins 5-8) terminals.
  • Reset: Ensure the RESET pin (Pin 27) is driven low for a sufficient pulse width to initiate a proper reset before initializing the display.
  • MIPI DSI Configuration: The DSI clock frequency and data lane speed must be configured according to the desired color depth (RGB565, RGB666, RGB888) and the number of active lanes used. The module supports speeds up to 850 Mbps per lane (for RGB888 with 4 lanes).
  • Mechanical Mounting: Follow proper mechanical design guidelines to ensure correct fit and avoid damage to the glass, FPC and integrated touch panel.
  • Operating Temperature: The module operates from -20°C to +70°C. Satisfactory display performance is only guaranteed within this range.
  • Storage: Store the module in a clean environment, free from dust, moisture, and direct sunlight. Storage temperature range is -30°C to +80°C.
  • Handling Precautions: Handle the module with care to avoid damage to the glass or FPC. Ground yourself to prevent electrostatic discharge (ESD).

5. Conclusion & Design-In Support

The LSC070I29-MP-V1 from Lesson Smart Display Technology is a 7.0-inch IPS TFT-LCD module with an integrated CTP and a 4-Lane MIPI DSI interface. It features an 800×1280 resolution, 16.7M colors, wide viewing angles (IPS), and a compact mechanical design. It is a reliable, all-in-one display solution suitable for a wide variety of medium-to-large format embedded display applications requiring touch input.

For successful design-in, engineers should:

  • Obtain and review the complete, official Product Specification (Revision 1.0) for the full mechanical drawing and the driver IC (ILI9881C) datasheet for detailed initialization and timing parameters.
  • Design a clean 3.3V power supply for the LCD. Design a backlight constant current driver circuit.
  • Configure the host processor's MIPI DSI interface to match the data format (RGB565, RGB666, or RGB888) and lane count (up to 4 lanes).
  • Follow proper mechanical design guidelines to ensure correct fit and avoid damage to the integrated touch lens.
  • Contact the manufacturer for evaluation modules, sample requests, and further technical support during the design-in phase.

This module is designed to provide a reliable and vibrant display solution for a wide array of applications.

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Eddie Chen
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