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LSC1051I01-MP-V1 10.51 inch TFT-LCD Module 1200x1920 16.7M Colors

LSC1051I01-MP-V1 10.51 inch TFT-LCD Module 1200x1920 16.7M Colors

Product Keywords: 10.51″ LCD Module, 1200(H)×1920(V) Resolution, 16.7M Colors, Color Active Matrix TFT LCD, Normally Black, Full Viewing, MIPI Interface, Glare Surface Treatment, In-Cell Touch (32x48 Channels), White LED Backlight (9S4P), -20°C to +70°C Operation.

1. Executive Summary & Product Positioning

The LSC1051I01-MP-V1 is a 10.51-inch color active matrix TFT LCD module developed by 立信(万安)智显科技有限公司 (Lesson Smart Display Technology Co., Ltd). The module features a resolution of 1200(H) × 1920(V) pixels and can display up to 16.7M colors.

Product Positioning: This module is designed for applications requiring a large, high-resolution display with a touch interface. It features a Normally Black display mode, Full Viewing direction, and an integrated In-Cell touch sensor. The 10.51-inch size and MIPI interface make it suitable for a wide range of industrial, medical, and high-end consumer embedded display systems.

2. Detailed Product Overview & Architecture

The module's architecture is designed for robust performance and easy integration. The primary components include:

  • TFT-LCD Panel: 10.51-inch diagonal, color active matrix TFT LCD. Resolution is 1200(H) × 3 (RGB) × 1920(V) pixels. Display mode is Normally Black with Full Viewing.
  • Backlight Unit (B/L): A white LED backlight with a 9S4P (9 series, 4 parallel) configuration. The typical driving condition is IF=22.5mA × 4 (90mA total), VF= (2.7 ~ 3.0) × 9V (24.3 ~ 27.0V).
  • Touch Sensor: Integrated In-Cell touch panel with a 32 x 48 touch channel matrix (T×R: 32 x 48). The touch interface uses SPI (MOSI, MISO, SCL) and includes INT (Interrupt) and RST (Reset) pins.
  • Interface: The module communicates via an MIPI interface.
  • Pixel Arrangement: RGB-Stripe.
  • Surface Treatment: Glare.

3. Exhaustive Technical Specifications

3.1 General & Mechanical Specifications

Item Specification
Display Size (Diagonal) 10.51 inches
Number of Pixels 1200(H) × 3 (RGB) × 1920(V)
Active Area (H×V) 141.48 × 226.37 mm
Pixel Pitch (H×V) 0.1179 × 0.1179 mm
Outline Dimensions (H×V×D) 158.48 × 243.368 × 2.825 (+0.1/-0.15) mm
Number of Colors 16.7M
Display Mode Normally Black
Viewing Direction Full Viewing
Pixel Arrangement RGB-Stripe
Interface MIPI
Touch Type In-Cell (Capacitive Touch)
Touch Channel (T×R) 32 x 48
Surface Treatment Glare
Backlight Type White LED (9S4P)
Warranty 12 months from shipment

3.2 Pin Description (Relevant Portion)

The module communicates via a 40+ pin connector. The interface is MIPI for display and SPI for the In-Cell touch controller.

Pin No. Symbol Function
1,2 LED+ Power for LED backlight (Anode)
4,5,6,7 LED1-, LED2-, LED3-, LED4- Power for LED backlight (Cathode)
9 AVDD Positive input power (6V)
11 AVEE Negative input power (-6V)
13 IOVCC Logic power input (1.8V)
14 LED_PWM LED PWM Signal
15 TP SPI_MOSI TP SPI MOSI PIN
16 TP SPI_MISO TP SPI MISO PIN
17 TP SPI SCL TP SPI SCL PIN
34,40,41 GND Ground
35 TP_INT TP INT PIN
36 TP_RST TP RESET PIN (1.8V)
37 LCD_RST LCD RESET PIN (1.8V)
38 LCD_ID1 ID1 10K to GND
39 LCD_ID2 ID2 10K to IOVCC

3.3 Power On/Off Sequence

3.3.1 Power ON and DSI Signal Sequence

The correct power-on sequence is crucial for the stable operation of the module.

  1. VDD1 (IOVCC): Apply first.
  2. VSP (AVDD): Apply ≥1ms after VDD1.
  3. VSN (AVEE): Apply ≥1ms after VSP.
  4. RESX (LCD_RST): Release (set to high) ≥1ms after VSN.
  5. TP_RESX (TP_RST): Release ≥15us after RESX.
  6. DSI Data & Clock: Send ≥1ms after TP_RESX.
  7. DSI Video/Command: Send Video after ≥50ms, or Command after ≥120ms from step 6.
  8. Initial Code, SLPOUT, DISPON: Send after ≥150ms from step 6 (Note 1).

Note 1: If the initial code is uploaded by an external flash, the delay of 150ms may be required.

3.3.2 Power OFF and DSI Signal Sequence

The power-off sequence should follow the reverse order after sending the appropriate display shut-down commands.

  1. DSI Video: Stop after ≥2 frames from command.
  2. DSI Command (SLPIN): Send.
  3. VSN (AVEE): Remove.
  4. VSP (AVDD): Remove.
  5. VDD1 (IOVCC): Remove last.

3.4 Input Signal Timing

3.4.1 DC Characteristics (Logic Pins)

Condition: VDD1 = 1.65 ~ 1.95V.

Item Symbol Min Max Unit
Input high voltage VIH 0.7 VDD1 VDD1 V
Input low voltage VIL 0 0.3 VDD1 V
Output high voltage VOH 0.8 VDD1 VDD1 V
Output low voltage VOL 0 0.2 VDD1 V

3.4.2 Parallel RGB Input Timing Table

The module supports a Parallel RGB input mode. The timing parameters are listed below.

Horizontal Timing
Parameter Symbol Min Typ Max Unit
Horizontal Display Area thd -- 1200 -- DCLK
HS Period th -- 1272 -- DCLK
HS Pulse Width thpw -- 16 -- DCLK
HS Back Porch thbp -- 16 -- DCLK
HS Front Porch thfp -- 40 -- DCLK
Vertical Timing
Parameter Symbol Min Typ Max Unit
Vertical Display Area tvd -- 1920 -- TH
VS Period tv -- 2174 -- TH
VS Pulse Width tvpw -- 12 -- TH
VS Back Porch tvbp -- 18 -- TH
VS Front Porch tvfp -- 224 -- TH

3.5 ESD Characteristics

The module's ESD (Electrostatic Discharge) test conditions are defined as follows.

Test Item Conditions Remark Class
Electro Static Discharge Test (non-operation) 150pF, 330Ω, Contact: ±4KV, Air: ±8KV 1 Class B
Electro Static Discharge Test (non-operation) 200pF, Ω, ±200V contact test 2 Class B

3.6 Package Drawing Notes

The module packaging ensures product safety during transport. Key features include:

  • Pallet Stacking: 5 layers per pallet, 6 boxes per layer, total 30 boxes per pallet.
  • Protection: Products are placed into an anti-static bag. The box includes 2 layers of anti-static foam (top and bottom).
  • Corner Protection: Paper corner protectors are used on the four edges and top of the pallet.
  • Strapping: 2 steel straps in the X and Y directions, and 2 in the Z direction.
  • Wrapping: The entire pallet is wrapped with a stretch film.
  • Box Contents: 15 Tray packs + 1 empty Tray pack per box, totaling 30 pieces per box.

3.7 Design Notes from Documentation

  • B/L Driver: The backlight driving condition is IF=22.5mA × 4 (90mA total), VF= (2.7 ~ 3.0) × 9V (24.3 ~ 27.0V) for a 9S4P LED configuration. An external boost converter and constant current driver are required.
  • Touch Panel: The module integrates an In-Cell touch panel with a dedicated SPI interface (MOSI, MISO, SCL) and control pins (INT, RST). The host processor must be configured for this protocol.
  • Power Supply: The module requires IOVCC (1.8V), AVDD (6V), and AVEE (-6V) for the TFT drive. The power-on sequence must be strictly followed to avoid damage.
  • Interface: The display uses an MIPI interface. Ensure the host processor is configured for this protocol.
  • ESD Protection: The module's ESD protection must be considered during system design. Good grounding and handling practices are recommended.
  • Storage: Store in a clean, dry environment away from direct sunlight, and follow recommended temperature and humidity conditions.

4. Application Guidelines & Critical Notes

  • Power Supply: The module requires IOVCC (1.8V), AVDD (6V), and AVEE (-6V) power supplies. Ensure the power supplies are stable and have low ripple. The power-on sequence must be strictly followed as per section 4.4.1.
  • Interface: This module uses an MIPI DSI interface for display data and an SPI interface for the In-Cell touch controller. The host processor must be configured for these protocols.
  • Backlight Driver (External): An external boost converter and constant current driver are required to supply the high-voltage backlight via the LED+ and LED1- to LED4- pins. The required driving condition is 90mA total current at 24.3~27.0V forward voltage.
  • Reset: Proper reset sequencing is required for both the LCD (LCD_RST) and the Touch Panel (TP_RST) as per the power-on sequence.
  • Touch Panel Integration: When integrating the In-Cell touch panel, ensure the host processor can communicate with it via the SPI interface. The TP_RST pin must be properly managed to ensure the controller initializes correctly.
  • ESD Protection: The module has specified ESD performance (Class B). Ensure proper grounding and handling procedures during assembly and operation.
  • Handling Precautions: Handle the module with care to avoid damage to the glass or FPC. Ground yourself to prevent electrostatic discharge (ESD).

5. Conclusion & Design-In Support

The LSC1051I01-MP-V1 from Lesson Smart Display Technology is a 10.51-inch color active matrix TFT-LCD module with a 1200x1920 resolution and integrated In-Cell touch. It is a high-quality, versatile display solution suitable for a wide variety of industrial and consumer embedded display applications.

For successful design-in, engineers should:

  • Obtain and review the complete, official Product Specification (Revision 1.4) for the full mechanical drawing and the driver IC datasheet for detailed initialization and timing parameters.
  • Design a clean power supply for the LCD (IOVCC, AVDD, AVEE). Design a backlight boost converter and constant current driver circuit capable of delivering 90mA at up to 27V.
  • Configure the host processor's MIPI DSI and SPI interfaces to match the timing specifications detailed in the datasheets.
  • Contact the manufacturer for evaluation modules, sample requests, and further technical support during the design-in phase.

This module is designed to provide a reliable and vibrant display solution for a wide array of applications.

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Eddie Chen
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