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LSL0146I01-X-V1 | 1.46 inch TFT-LCD | 360x360 | MIPI / SPI / 8080 / SRGB / QSPI | IPS | ST77916

LSL0146I01-X-V1 | 1.46 inch TFT-LCD | 360x360 | MIPI / SPI / 8080 / SRGB / QSPI | IPS | ST77916

Product Subtitle / Keywords: 1.46" TFT LCD Module, 360(RGB)×360 Resolution, 262K Colors, Transmissive a-Si TFT, Active Matrix, IPS (Free) Viewing Direction, COG+FPC+B/L Structure, MIPI-DSI/SPI/8080/SRGB/QSPI Interfaces, ST77916 Driver IC, -20°C to +70°C Operation, White LED Backlight, Wide Viewing Angle, High Contrast.

1. Executive Summary & Product Positioning

The LSL0146I01-X-V1 is a 1.46-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module developed by 立信(万安)智显科技有限公司 (Lesson Smart Display Technology Co., Ltd). It is composed of a TFT-LCD panel, a driver circuit, and a backlight unit. The panel size is 1.46 inch and the resolution is 360(RGB)*360, the panel can display up to 262k colors.

Product Positioning: Designed for a wide range of compact, square-shaped display applications requiring a high-resolution, versatile multi-interface design and excellent viewing angles. With its IPS (Free) viewing direction, multiple interface options (MIPI, SPI, 8080, SRGB, QSPI), and integrated ST77916 driver IC, it is ideally suited for smart wearables, compact handheld devices, and other embedded systems that need flexible host connectivity.

2. Detailed Product Overview & Architecture

The module's architecture is designed for high performance and straightforward integration. The primary components include:

  • TFT-LCD Panel: 1.46-inch diagonal, a-Si TFT active matrix, transmissive, IPS display mode. The resolution is 360(RGB) × 360 pixels with an active area of 36.94 (H) × 36.94 (V) mm.
  • Driver IC: The module uses the ST77916 driver IC, which supports multiple interface protocols.
  • Mechanical Construction: COG (Chip-on-Glass) + FPC + Backlight (B/L). The module outline dimensions are 39.34 (H) × 40.01 (V) × 1.6 (D) mm.
  • Interface: The module communicates via a 39-pin (or similar) connector. The main display interface can be configured as MIPI-DSI (1 data lane + clock), SPI (3/4-line serial), 8/9-bit serial, 8-bit 8080 parallel, QSPI (Single/Dual/Quad), or 6-bit RGB. The interface mode is selected by the IM[2:0] pins.

3. Exhaustive Technical Specifications

3.1 General & Mechanical Specifications

Item Specification
Display Size (Diagonal) 1.46 inches
Resolution (Dots) 360(RGB) × 360
Display Technology Active matrix TFT, Transmissive, a-Si
Display Format Graphic 360(RGB)×360 Dot-matrix
Module Construction COG+FPC+B/L
Color Depth 262K Colors
Viewing Direction (Grayscale Inversion) Free (IPS)
Input Data Interfaces MIPI-DSI / SPI / 8080 / SRGB / QSPI
Driver IC ST77916
Number of Dots 360(RGB) × 360 pixels
Active Area (H×V) 36.94 × 36.94 mm
Module Size (H×V×D) 39.34 × 40.01 × 1.6 mm
Operating Temperature -20°C to +70°C
Storage Temperature -30°C to +80°C

3.2 Electrical Specifications

3.2.1 Absolute Maximum Ratings

Parameter Symbol Min Max Unit
Supply Voltage (Logic) VCC -0.3 4.6 V
Supply Voltage (IO) IOVCC -0.3 4.6 V
Operating Temperature TOPR -20 70 °C
Storage Temperature TSTR -30 80 °C

3.2.2 DC Characteristics (Ta=25°C)

Parameter Symbol Min Typ Max Unit
Supply Voltage (Logic) VCC 2.65 2.8 3.3 V
Supply Voltage (IO) IOVCC 1.65 1.8 3.3 V
Input Voltage (Low Level) VIL GND -- 0.3*IOVCC V
Input Voltage (High Level) VIH 0.7*IOVCC -- IOVCC V

3.3 Interface & Pin Map

The module uses a 39-pin (approximately) connector. Below is a description of the key pins.

Pin No. Symbol I/O Description
1, 4, 7, 10, 33, 39 GND P Ground
2 LEDK P Power for LED backlight cathode
3 LEDA P Power for LED backlight anode
5 CLKP I MIPI-DSI clock lane positive-end
6 CLKN I MIPI-DSI clock lane negative-end
8 D0P I/O MIPI-DSI data lane 0 positive-end
9 D0N I/O MIPI-DSI data lane 0 negative-end
11 IM0 I System Interface Mode Select (LSB)
... (pins 21-28) D[7:0] I/O Multi-function data bus. Used for MCU parallel (8-bit), SPI, QSPI (single/dual/quad), and RGB interface data. Functions are interface-dependent.
29 CS I Chip select pin (Low active)
30 RD(SCL) I Read enable (MCU parallel) or Clock (SPI interface)
31 WR I Write enable (MCU parallel) or Dot clock (RGB interface)
32 DCX I Data/Command selection

Note: This is a summary. The full datasheet must be consulted for the complete pin mapping and interface mode selection tables.

3.4 Optical Specifications

Optical characteristics are measured at θx = θy = 0°, Ta=25°C.

Item Symbol Min Typ Max Unit
Response Time (Tr+Tf) Tr+Tf - 30 35 ms
Contrast Ratio CR 900 1200 - -
Transmittance T% 2.5 2.94 - %
Color Chromaticity (White) - CIE1931 Wx, Wy - 0.294, 0.323 - -
Viewing Angle (CR > 10) θT, θB, θL, θR 80 (All) 85 (All) - Deg.

3.5 Interface Timing Characteristics

The specification defines timing for several interfaces. Key parameters are highlighted below:

3.5.1 8080 Series MCU Parallel Interface (8-bit Bus)

Parameter Symbol Min Max Unit
Write Cycle twc 30 - ns
Control Pulse "H"/"L" duration tWRH / tWRL 14 - ns

3.5.2 MIPI Interface Characteristics

Parameter Symbol Min Max Unit
Double UI instantaneous 2xUI INST 8 25 ns
UI instantaneous half UI INSTA/B 4 12.5 ns
HS clock preparation time T CLK-PREPARE 38 95 ns

3.5.3 Reset Timing

Parameter Symbol Min Max Unit
Reset pulse duration TRW 10 - us
Reset cancel time (Sleep Out) TRT - 120 ms

Note: It is necessary to wait 5ms after releasing RESX before sending commands. Sleep Out command cannot be sent for 120ms.

4. Application Guidelines & Critical Notes

When integrating the LSL0146I01-X-V1 module, engineers must adhere to the specific guidelines outlined in the specification to ensure optimal performance and reliability.

  • Power Supply (Dual Rail): The module requires two supply rails: VCC (2.65V to 3.3V, Typ 2.8V) for the LCD logic and IOVCC (1.65V to 3.3V, Typ 1.8V) for the I/O interface. The I/O voltage level must match the host's logic level.
  • Interface Selection (IM Pins): The module supports multiple interfaces. The interface mode is selected by the IM[2:0] pins. Ensure these pins are set correctly to the desired interface (e.g., MIPI, SPI, 8080) before power-up.
  • MIPI-DSI Design: If using the MIPI interface, the host processor must have a compatible MIPI DSI transmitter. The PCB layout for the differential clock (CLKP/N) and data (D0P/N) pairs must be carefully designed for controlled impedance (100-ohm differential) and matched trace lengths.
  • Backlight Driver (External): The module provides separate LED Anode (LEDA) and Cathode (LEDK) pins. An external constant current driver is required, typically designed for the optimal forward current of the backlight LED string.
  • Mechanical Integration: The module outline dimensions are 39.34 (H) × 40.01 (V) × 1.6 (D) mm. The active area is 36.94 × 36.94 mm. Allow for proper clearance around the module.
  • I/O Voltage: All I/O signals are referenced to IOVCC. The host's I/O voltage must be compatible with the IOVCC voltage supplied to the module.
  • Reset Timing: The reset pulse must be at least 10μs wide. After releasing the reset, a waiting period of 5ms is required before sending any commands. The Sleep Out command cannot be sent for 120ms after reset if coming from Sleep Out mode.

5. Conclusion & Design-In Support

The LSL0146I01-X-V1 from Lesson Smart Display Technology is a feature-rich, compact 1.46-inch TFT-LCD module. Its combination of a high-resolution square format, multi-interface support (including MIPI and SPI), wide temperature range, and excellent optical performance makes it an extremely versatile choice for wearable, portable, and industrial embedded applications.

For design-in support, it is strongly recommended to:

  • Obtain and review the full Product Specification (Revision 1.0) for the complete set of electrical parameters, interface timing diagrams, mechanical drawings, and the ST77916 driver IC datasheet.
  • Design the power supply to provide both VCC and IOVCC rails, ensuring proper power sequencing.
  • Select the appropriate interface and configure the IM[2:0] pins accordingly. For MIPI, carefully design the differential PCB traces.
  • Contact the manufacturer for evaluation kits, sample requests, and technical support during the design-in phase.

This module is engineered to deliver reliable, high-quality display performance for a broad spectrum of modern electronic devices.

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Eddie Chen
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