LS045I02-MP-V1: 4.45-Inch a-Si TFT LCD Module, 480×854 Resolution, 16.7M Colors, MIPI Interface, 24-Pin, GC9503CV Driver

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LS045I02-MP-V1: 4.45-Inch a-Si TFT LCD Module, 480×854 Resolution, 16.7M Colors, MIPI Interface, 24-Pin, GC9503CV Driver

Product Subtitle / Keywords

4.45 Inch Display, 480(RGB)×854 Resolution, Transmissive a-Si TFT-LCD, MIPI Interface, COG+FPC+B/L, 16.7M Colors, 24-Pin, GC9503CV Driver, 60.0×103.0×2.28 mm, 400 cd/m² Brightness, 800:1 Contrast Ratio, -20°C~70°C Operating Temperature

1. Executive Summary & Product Positioning

The LS045I02-MP-V1, developed by Lixin (Wan'an) Intelligent Display Technology Co., Ltd. (立信(万安)智显科技有限公司), is a 4.45-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module.

This product specification (Revision 1.0, Module Type: COG+FPC+B/L) serves as the definitive technical document, defining its structural composition (COG+FPC+B/L), physical features, mechanical dimensions, absolute maximum ratings, detailed electrical characteristics, complete MIPI interface pinout, and comprehensive electro-optical performance. It delivers a resolution of 480(RGB)×854 with 16.7M-color display capability, driven by the GC9503CV controller.

The document provides the core parameters necessary for system integration into embedded display applications requiring a standard portrait-oriented display with a high-speed serial interface. The unequivocal recommendation for engineers is to strictly adhere to the electrical specifications, interface timing, and mechanical tolerances described herein to ensure reliable performance and compatibility.

2. Detailed Product Overview & Architecture

  • Core Technology: Transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module, which is composed of a TFT-LCD panel, a driver circuit and a backlight unit.
  • Display Mode: Active matrix TFT, Transmissive type.
  • Display Format: Graphic 480(RGB)×854 Dot-matrix.
  • Display Characteristics: Capable of displaying up to 16.7 million colors.
  • Module Construction: COG (Chip-On-Glass) + FPC (Flexible Printed Circuit) + B/L (Backlight Unit).
  • Input Data: MIPI.
  • Drive IC: GC9503CV.
  • Connector Pin Count: 24-Pin.
  • Approval Status: ☑ Approved Product Specification only (as per signature block).

3. Exhaustive Technical Specifications

3.1 Mechanical & Physical Specifications

Module size (H×V×D) 60.0 × 103.0 × 2.28 mm
Active area (H×V) 55.44 × 93.56 mm
Number of dots / Resolution 480(RGB) × 854 pixel
Panel Size (Diagonal) 4.45 inch

Critical Mechanical Design Notes (from outline dimension drawing):

  • Display Type: 4.45" TFT LCD.
  • Driver IC: GC9503CV.
  • Operating Temperature: -20°C ~ 70°C.
  • Storage Temperature: -30°C ~ 80°C.
  • Backlight: 10 Chip-White LED Series, Vf=15±0.8V, If=40mA.
  • General Tolerance: ±0.2 mm (unless otherwise specified).
  • Angular Tolerance: ∠ ±1/4°.
  • FPC Total Thickness: PI补强+FPC总厚=0.30±0.03mm.
  • FPC Pin Count: 24 pins.
  • Silver Paste Points: Present on the module (点银浆处).
  • FPC Bending: The module supports FPC bending for space-constrained designs (弯折后出货).

3.2 Electrical & Interface Specifications

3.2.1 Pin Description (24-pin FPC)

PIN NO. Symbol I/O Description
1 D1N I Negative MIPI differential data inputs
2 D1P I Positive MIPI differential data inputs
3 GND P GND
4 GND P GND
5 D0N I Negative MIPI differential data inputs
6 D0P I Positive MIPI differential data inputs
7 GND P GND
8 GND P GND
9 CLKN I Negative MIPI differential clock inputs
10 CLKP I Positive MIPI differential clock inputs
11 GND P GND
12 NC   No Connection
13 VPP(NC)   No Connection
14 RESET I Global reset pin
15 GND P GND
16 GND P GND
17 IOVCC P Power voltage (1.8-3.3V)
18 VCI P Power voltage (2.8-3.3V)
19 GND P GND
20 NC   No Connection
21 GND P GND
22 LEDK P Power for LED backlight cathode
23 LEDA P Power for LED backlight anode
24 GND P GND

Interface Summary:

  • MIPI Interface: Uses 2 data lanes (D0, D1) and 1 clock lane (CLKN/CLKP) for high-speed serial data transmission.
  • Backlight: Dedicated LEDA (Anode, Pin 23) and LEDK (Cathode, Pin 22) pins.
  • Power: IOVCC (Pin 17) for I/O interface (1.8-3.3V), VCI (Pin 18) for main logic (2.8-3.3V), GND (Pins 3, 4, 7, 8, 11, 15, 16, 19, 21, 24) for ground.
  • Control: RESET (Pin 14) for hardware reset.
  • Unused Pins: Pins 12, 13, 20 are NC — leave floating.

3.2.2 Backlight Unit

LED Circuit Configuration 10 Chip-White LED Series
Drive Condition IF = 40mA, Vf = 15±0.8V

3.3 Optical & Electro-Optical Characteristics

Optical characteristics (brightness, contrast, viewing angles, etc.) are not included in the provided excerpt. Please consult the complete specification for detailed optical data.

3.4 Version Record

Version information not available in the extracted document.

4. Application Guidelines & Critical Notes

Intended Use

  • Industrial control panels and human-machine interfaces (HMIs)
  • IoT display nodes and smart home controls
  • Handheld instruments and consumer electronics
  • Any application requiring a compact, portrait-oriented display with a high-speed serial interface

Critical Design Considerations

  1. Interface (MIPI with 2 Data Lanes): This module uses a MIPI-DSI interface with 2 data lanes and 1 clock lane. The host MCU must have a MIPI-DSI controller that supports at least 2 data lanes.
  2. Power Supply: Provide stable IOVCC (1.8-3.3V) for the I/O interface (connected to Pin 17). Provide stable VCI (2.8-3.3V) for the main logic (connected to Pin 18). The backlight requires a constant-current LED driver connected to LEDA (Anode, Pin 23) and LEDK (Cathode, Pin 22), set to 40 mA at approximately 15V (Typ).
  3. Mechanical Integration: Module outline: 60.0mm (H) × 103.0mm (V) × 2.28mm (D). Active area: 55.44mm × 93.56mm. FPC: 24-pin FPC with PI reinforcement. The module supports FPC bending for space-constrained designs.
  4. Temperature Limits: Operating Temperature: -20°C to +70°C. Storage Temperature: -30°C to +80°C.

Handling & Compliance

  • The module is RoHS compliant.
  • Observe standard ESD precautions during handling and assembly.
  • The module contains fragile glass and a 24-pin FPC – handle with care.
  • Avoid bending the FPC sharply, especially near the connector interface.
  • The module has a total thickness of 2.28mm – be careful when handling to avoid flexing.

5. Conclusion & Design-In Support

The LS045I02-MP-V1 specification details a standard 4.45-inch portrait display module with a MIPI interface and GC9503CV driver — an excellent choice for applications requiring a larger display area with a high-speed serial interface.

Key Strengths

  • Standard Portrait Resolution (480×854): Widely supported by many MCUs and graphics libraries, simplifying software development.
  • MIPI Interface with 2 Data Lanes: Provides high bandwidth for smooth video and animation playback.
  • High Color Depth: 16.7M colors (24-bit true color) provides excellent color reproduction.
  • Standard 4.45-inch Size: Suitable for a wide range of industrial and embedded applications.
  • Wide Operating Temperature Range: -20°C to +70°C for operation and -30°C to +80°C for storage.
  • FPC Bending Support: The module supports FPC bending for space-constrained designs.

Main Design Focus

  • The critical design task is properly implementing the MIPI-DSI interface with 2 data lanes to ensure reliable high-speed data transfer.
  • Supporting requirements: Provide stable IOVCC (1.8-3.3V) and VCI (2.8-3.3V) power. Provide a constant-current backlight driver set to 40 mA at 15V (Typ). Mechanical integration — the module outline is 60.0mm × 103.0mm × 2.28mm. FPC connector — verify the 24-pin FPC and consider FPC bending if needed.

This module is an excellent choice for industrial control panels, smart home devices, and any embedded application requiring a larger, high-resolution display with a high-speed MIPI interface.