Publication Date: March 6, 2026
Keywords: 6.4 inch LCD, TFT-LCD Module, a-Si TFT, 1440x2560, QHD+, MIPI DSI, COG, High Resolution, Wide Temperature, RoHS
1. Product Overview & General Description
The LSC064I01-MP-V1 is a high-performance, high-resolution transmissive a-Si TFT-LCD module designed for premium applications requiring exceptional visual clarity and color fidelity. It integrates a TFT-LCD panel, driver circuit, and backlight unit into a compact COG+FPC+B/L package.
Core Identity:
- Manufacturer: LESSON Smart Display Technology Co., Ltd.
- Model Number: LSC064I01-MP-V1
- Module Type: COG + FPC + Backlight Unit
- Revision: 1.0
- Document: PRODUCT SPECIFICATION FOR LCD MODULE
Fundamental Specifications:
- Display Type: Transmissive a-Si TFT-LCD
- Panel Size: 6.4 inch (Diagonal)
- Resolution: 1440 (RGB) × 2560 pixels (QHD+)
- Display Colors: Up to 16.7 Million colors
- Construction: Composed of TFT-LCD panel, driver circuit, and backlight unit.
2. Absolute Maximum Ratings
To prevent permanent damage to the module, the following voltage limits must not be exceeded, even momentarily.
| Parameter | Symbol | Min | Max | Unit | Remark |
|---|---|---|---|---|---|
| Supply Voltage | AVDD - GND | -0.3 | 3.6 | V | *1 |
| Supply Voltage | VDDIN - GND | -0.3 | 3.6 | V | *1 |
| Supply Voltage | VDDIO - GND | -0.3 | 3.6 | V | *1 |
*Note 1: Voltage is applied relative to GND pins. All GND pins are assumed to be at the same potential (0V). Always connect all GND pins externally and maintain them at the same voltage.
3. Electrical Characteristics
3.1 DC Characteristics (Logic & Power)
| Parameter | Symbol | Conditions | Min. | Typ. | Max. | Unit | Applicable Pin / Note |
|---|---|---|---|---|---|---|---|
| Logic High Input Voltage | VIH | Ta = -20~60 °C | 880 | - | 1350 | mV | (Note 3) |
| Logic Low Input Voltage | VIL | Ta = -20~60 °C | -50 | - | 550 | mV | (Note 3) |
| Logic High Output Voltage | VOH | Ta = -20~60 °C | 1.1 | 1.2 | 1.3 | V | (Note 3) |
| Logic Low Output Voltage | VOL | Ta = -20~60 °C | -50 | - | 50 | mV | (Note 3) |
| Logic 0 Contention Threshold | VILCD | Ta = -20~60 °C | - | - | 200 | mV | (Note 3) |
| Logic 1 Contention Threshold | VIHCD | Ta = -20~60 °C | 450 | - | - | mV | (Note 3) |
| LCD Current Consumption | Iiovcc1 | Ta = 25 °C | - | 24.33 | 30.34 | mA | (note 4) |
| LCD Current Consumption | Ivsp1 | Ta = 25 °C | - | 22.22 | 29.47 | mA | (note 4) |
| LCD Current Consumption | Ivsp1 | Ta = 25 °C | - | 17.29 | 22.94 | mA | (note 4) |
| LCD Current Consumption | Iiovcc1 | Ta = 25 °C | - | 0.005 | 0.02 | mA | (note 5) |
Notes:
- (Note 3): Applicable to specific logic interface pins as defined.
- (Note 4): Measurement conditions: Ta=25°C, Full screen white pattern, VSP=5.9V, VSN=-5.9V, IOVCC=1.8V, 60Hz Refresh, MIPI-DSI Video bypass mode.
- (Note 5): Measurement conditions: Deep standby mode.
3.2 LCD Power Supply Voltages
| Parameter | Symbol | Conditions | Min. | Typ. | Max. | Unit | Note |
|---|---|---|---|---|---|---|---|
| LCD Supply Voltage 1 | IOVCC - GND | Ta = -20~60 °C | 1.7 | 1.8 | 1.9 | V | (note 1) |
| LCD Supply Voltage 2 | VSP - GND | Ta = -20~60 °C | 5.8 | 5.9 | 6.0 | V | (note 1) |
| LCD Supply Voltage 3 | VSN - GND | Ta = -20~60 °C | -6.0 | -5.9 | -5.8 | V | (note 1) |
| "H" Level Input Voltage | VIH | Ta = -20~60 °C | 0.7 x IOVCC | - | IOVCC | V | (note 2) |
| "L" Level Input Voltage | VIL | Ta = -20~60 °C | 0 | - | 0.3 x IOVCC | V | (note 2) |
Notes:
- (Note 1): Includes ripple noise.
- (Note 2): Includes applied overshoot.
3.3 Backlight LED Characteristics (Ta = 25°C)
| Parameter | Symbol | Condition | MIN. | TYP. | MAX. | Unit |
|---|---|---|---|---|---|---|
| Forward Voltage | V_F | I_F = 20 mA | - | 2.9 | 3.1 | V |
| Luminous Flux (*4) | Φ_v | I_F = 20 mA | 6.10 | 6.7 | - | lm |
| Chromaticity x | x1 | I_F = 20 mA | 0.26 | 0.273 | 0.286 | - |
| Chromaticity y | y1 | I_F = 20 mA | 0.24 | 0.253 | 0.266 | - |
Backlight Absolute Ratings:
| Parameter | Symbol | Rating | Unit |
|---|---|---|---|
| Power Dissipation | P | 77.5 | mW |
| Forward Current | I_F | 25 | mA |
| Peak Pulsed Forward Current(*1) | I_FM | 50 | mA |
| Forward Current Derating Factor (DC) | - | -0.46 | mA/°C |
| Forward Current Derating Factor (Pulse) | - | -0.67 | mA/°C |
| Reverse Voltage | V_R | 5 | V |
| Operating Temperature(*3) | T_opr | -30 to +85 | °C |
| Storage Temperature | T_stg | -40 to +90 | °C |
4. Interface & Pin Description
4.1 Main Module Connector (60-pin, MIPI DSI & Power)
The module uses a 60-pin board-to-board connector.
- Mounted Connector: HIROSE BM14B(0.8)-60DP-0.4V (0.4mm pitch)
- Mating Connector: HIROSE BM14B(0.8)-60DS-0.4V (0.4mm pitch)
Selected Pinout (Refer to spec for complete 60-pin list):
| Pin No | Symbol | Description | I/O | Remarks |
|---|---|---|---|---|
| 1 | DSIB_D3_N | MIPI DSI (-) of Port B | I | |
| 2 | DSIB_D3_P | MIPI DSI (+) of Port B | I | |
| 3 | GND | Ground | - | |
| ... | ... | ... | ... | ... |
| 16 | DSIA_D2_P | MIPI DSI (+) of Port A | I | |
| 17 | DSIA_D2_N | MIPI DSI (-) of Port A | I | |
| 18 | GND | Ground | - | |
| ... | ... | ... | ... | ... |
| 25 | DSIA_D0_P | MIPI DSI (+) of Port A | I/O | |
| 26 | DSIA_D0_N | MIPI DSI (-) of Port A | I/O | |
| ... | ... | ... | ... | ... |
| 32 | LED2- | LED Backlight Power Group 2 Negative | I | |
| 33 | LED1- | LED Backlight Power Group 1 Negative | I | |
| 34 | LED2+ | LED Backlight Power Group 2 Positive | I | |
| 35 | LED1+ | LED Backlight Power Group 1 Positive | I | |
| ... | ... | ... | ... | ... |
| 48 | XRES | Device Reset Signal | I | |
| 49 | PWM | Backlight LED Driver PWM | O | |
| 50 | GND | Ground | - | |
| 51 | HSYNC | Horizontal Synchronizing Signal | O |
4.2 Touch Panel (TP) Connector Pin Description
| Pin No | Symbol | Description | I/O | Remarks |
|---|---|---|---|---|
| 1 | GND | Ground | - | |
| 2 | VDDH_3.3V(AVDD) | Power Input (3.3V) for TP(AVDD) | I | |
| 3 | GND | Ground | - | |
| 4 | /RST | Reset Pin for TP | I | |
| 5 | INT | State Change Interrupt - TP | OD | |
| 6 | GND | Ground | - | |
| 7 | SDA | Serial Interface Data - TP | I/O | |
| 8 | SCL | Serial Interface Clock - TP | OD | |
| 9 | GND | Ground | - | |
| 10 | GND | Power Input - TP(VDDIO) | I | |
| 11 | VDD_3.3V(VDDIN) | Power Input (3.3V) - TP(VDDIN) | I |
5. MIPI DSI Interface Specifications
5.1 D-PHY DC Characteristics (HS-RX)
| Item | Symbol | Unit | Test Condition | Min. | Typ. | Max. | Note |
|---|---|---|---|---|---|---|---|
| Diff. Input High Threshold | VIDTH | mV | IOVDD=1.65V~3.30V | - | - | 70 | 2 |
| Diff. Input Low Threshold | VIDTL | mV | IOVDD=1.65V~3.30V | -70 | - | - | 2 |
| Single-ended Input Low Voltage | VILHS | mV | IOVDD=1.65V~3.30V | -40 | - | - | |
| Single-ended Input High Voltage | VIHHS | mV | IOVDD=1.65V~3.30V | - | - | 460 | |
| Common-mode Voltage (DC) | VCMRX(DC) | mV | IOVDD=1.65V~3.30V | 70 | - | 330 | 1 |
| Differential Input Impedance | ZID | Ω | IOVDD=1.65V~3.30V | - | 100 | - |
Notes:
- VCMRX(DC) = (VP + VDN)/2
- Minimum 110mV / -110mV HS differential swing is required for display data transfer.
5.2 D-PHY AC & Timing Characteristics
| Item | Symbol | Unit | Test Condition | Min | Typ | Max | Notes |
|---|---|---|---|---|---|---|---|
| DSI Clock Frequency | f_DSICLK | MHz | IOVCC=1.65V~3.30V | 100 | - | 500 | 1 |
| DSI Data Transfer Rate | t_DSIR | Mbps | IOVCC=1.65V~3.30V (2/3/4 lane) | 200 | - | 1000 | 1 |
| LP State Period Length | T_LPX | ns | IOVCC=DPHYVCC=1.65~1.95V | 50 | - | - | |
| HS Prepare Time | T_HS-PREPARE | - | IOVCC=DPHYVCC=1.65~1.95V | 40ns+4*UI | - | 85ns+6*UI | |
| HS Exit Time | T_HS-EXIT | ns | IOVCC=DPHYVCC=1.65~1.95V | 100 | - | - | |
| CLK Post Time | T_CLK-POST | - | IOVCC=DPHYVCC=1.65~1.95V | 60ns+52UI | - | - | 3 |
6. Power On/Off & Operation Sequences
6.1 Power ON Sequence
| Step | State | Action/Command | DSI Data Type | Address | Para. | Data | Note |
|---|---|---|---|---|---|---|---|
| 1 | RESX = L | ||||||
| 2 | Power Supply IOVDD ON (Typ 1.8V) | ||||||
| 3 | Wait Min. 200ms | Wait for IOVDD=90% | |||||
| 4 | Power Supply AVDD+ ON (Typ 5.9V) | ||||||
| 5 | Wait 20ms | Wait for VSP->VSN ordering | |||||
| 6-8 | Wait 20ms (x3) | ||||||
| 9 | RESX = L | ||||||
| 10 | Wait Min. 10ms | Wait for VSP/VSN=±90% & RESX Low | |||||
| 11 | RESX = H | ||||||
| 12 | Wait MIN 10ms | ||||||
| 13 | NVM Auto Load | ||||||
| 14 | Sleep Mode On |
6.2 Deep Standby IN Sequence
| Step | State | Action/Command | DSI Data Type | Address | Para. | Data | Note |
|---|---|---|---|---|---|---|---|
| 1 | Backlight OFF | DCS | 39h | 53h | P1 | 00h | LED OFF |
| 2 | Display OFF | set_display off | DCS | 39h | 28h | - | - |
| 3 | Wait Min. 20ms | ||||||
| 4 | enter sleep mode | DCS | 39h | 10h | - | - | |
| 5 | Sleep Mode On | Wait Min. 120ms | |||||
| 6 | note4 | DSI signal transfer stop | |||||
| 7 | Manufacture Command Access Protect | Generic | 29h | B0h | P1 | 04h | |
| 8 | Generic | 29h | B1h | P1 | 01h | ||
| 9 | Power Supply AVDD-OFF (GND=0V) | ||||||
| 10 | Wait 20ms | ||||||
| 11 | Power Supply AVDD-OFF (GND=0V) | ||||||
| 12 | Deep Standby IN | Wait 20ms |
Note 4: STEP6 can be deleted if command mode is used.
7. Electro-Optical Characteristics
Measurement Conditions: Vddio=1.8V, VSP=5.9V, VSN=-5.9V, I_LED=20mA/piece, Ta = 25°C, θ=0°
| Parameter | Symbol | Condition | MIN | TYP | MAX | Unit | Remark |
|---|---|---|---|---|---|---|---|
| Brightness | Br | θ=0° | 300 | 400 | - | cd/m² | Note1,2 |
| Contrast Ratio | Co | θ=0° | 910 | 1300 | - | - | Note1,3 |
| Viewing Angle (Left/Right) | θ11, θ12 | Co > 10 | 80 | - | - | deg | Note1 |
| Viewing Angle (Up/Down) | θ21, θ22 | Co > 10 | 80 | - | - | deg | Note1 |
| White Chromaticity x | x | θ=0° | 0.27 | 0.30 | 0.33 | - | Note1,3 |
| White Chromaticity y | y | θ=0° | 0.29 | 0.32 | 0.35 | - | Note1,3 |
| Uniformity | - | θ=0° | 80 | 85 | - | % | Note5 |
| NTSC Ratio | - | θ=0° | - | 90 | - | % | Note1,3 |
| Response Time (Tr+Td) | (rr+td) | θ=0° | - | 35 | - | ms | Note1,6 |
| Flicker Ratio | - | θ=0° | - | - | 10 | % | Note4 |
Notes:
- Measuring pattern please refer to spec figure (e.g., Fig. 14 Flicker Measuring pattern).
- Brightness measured with specific gray/black checkerboard pattern.
- Color and contrast measured under defined conditions.
- Flicker ratio maximum limit.
- Luminance uniformity across the screen.
- Total response time (rise + decay).
8. Mechanical Specifications
- Panel Size: 6.4 inch
- Outline Dimensions: Detailed dimensions are provided in the specification's outline drawings, including length, width, thickness, and active area size.
- Active Area (AA): The effective display region dimensions are defined in the mechanical drawings.
- FPC: Includes a bending area with specified constraints to ensure reliability during assembly.
- Connector: 60-pin, 0.4mm pitch board-to-board type located on the FPC.
- General Tolerance: Unspecified tolerances typically follow standard engineering practices. Critical dimensions have explicit tolerances defined in the drawings.
Designers must refer to the official mechanical outline drawings in the specification for all critical dimensions, mounting hole locations, FPC bend zones, and stack-up information.
9. Reliability & Environmental
- Operating Temperature: Specified range for reliable operation (refer to electrical tables).
- Storage Temperature: Specified range for non-operating storage.
- The module is designed to meet standard reliability requirements for consumer and industrial electronics. Specific reliability test conditions and results (e.g., high/low temperature storage, humidity, ESD) would be detailed in the full specification's "Reliability" section.
10. Application & Usage Notes
Target Applications:
- Premium Smartphones
- High-end Tablets
- Virtual Reality (VR) Headsets
- Professional Portable Monitors
- Advanced Industrial HMIs requiring high resolution.
Critical Integration Notes:
- Power Sequencing: Strictly adhere to the provided Power ON/OFF and Deep Standby sequences to avoid latch-up or damage.
- MIPI DSI Compliance: Ensure the host processor's D-PHY meets the voltage and timing specifications listed.
- Backlight Driving: Design LED driver circuit according to absolute ratings and typical Vf/If characteristics. Implement PWM dimming via the PWM pin.
- ESD & Handling: Follow standard ESD precautions during handling and assembly.
- Mechanical Integration: Do not apply excessive force or pressure on the active area. Adhere to FPC bending guidelines.
Disclaimer: This document summarizes key specifications from the provided content. For complete details, design, and manufacturing, always refer to the official and latest "LSC064I01-MP-V1(SPEC).pdf" document from LESSON Smart Display Technology Co., Ltd. Specifications are subject to change without notice.
