LS020I12-S-V1 2.0 inch TFT-LCD Module 240x320 262k Colors IPS
1. Executive Summary & Product Positioning
The LS020I12-S-V1 is a 2.0-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module developed by 立信(万安)智显科技有限公司 (Lesson Smart Display Technology Co., Ltd). The panel size is 2.0 inch and the resolution is 240(RGB)*320, the panel can display up to 262k colors.
Product Positioning: This module features a compact 2.0-inch IPS (In-Plane Switching) panel, offering superior viewing angles (ALL VIEWING DIRECTION) and high color performance (262k colors). With a standard parallel interface, it is well-suited for a wide range of compact applications such as smart home devices, handheld instruments, and other embedded display systems requiring a high-quality display.
2. Detailed Product Overview & Architecture
The module's architecture is designed for robust performance and easy integration. The primary components include:
- TFT-LCD Panel: 2.0-inch diagonal, a-Si TFT active matrix, transmissive, IPS (In-Plane Switching) mode. Resolution is 240(RGB) × 320 pixels. Active area is 30.6 (H) × 40.8 (V) mm.
- Driver Circuit: The module integrates a driver circuit, communicating via a Parallel Interface.
- Backlight Unit (B/L): A white LED backlight with 3 Chip-White LEDs configured in parallel. The typical driving condition is IF=60mA, Vf=3.0V (TYP).
- Mechanical Construction: COG (Chip-on-Glass) + FPC (with PI reinforcement, total thickness ~0.3mm) + B/L. The total module thickness is 1.91±0.15 mm.
- Interface: The module communicates via a 21-pin FPC connector. The interface is Parallel Interface.
- Display Mode: Active matrix TFT, Transmissive type, IPS.
3. Exhaustive Technical Specifications
3.1 General & Mechanical Specifications
| Item | Specification |
| Display Size (Diagonal) | 2.0 inches |
| Resolution (Dots) | 240(RGB) × 320 |
| Display Technology | Active Matrix TFT, Transmissive, a-Si, IPS |
| Module Construction | COG+FPC+B/L |
| Color Depth | 262K Colors |
| Viewing Direction (Grayscale Inversion) | ALL VIEWING DIRECTION (IPS) |
| Input Data Interface | Parallel Interface (21-pin FPC) |
| Module Size (H×V×D) | 35.25 × 46.85 × 1.91 mm (Approx., based on drawing dimensions) |
| Active Area (AA, H×V) | 30.6 × 40.8 mm |
| Pixel Arrangement | RGB Dot-matrix (240(RGB)×320) |
| Display Mode | Active matrix TFT, Transmissive type, IPS |
| Backlight Type | White LED, 3 Chip-Parallel |
| Operating Temperature | -10°C to +60°C |
| Storage Temperature | -20°C to +70°C |
3.2 Absolute Maximum Ratings
Stress beyond those listed may cause permanent damage.
| Item | Symbol | Min | Max | Unit | Remark |
|---|---|---|---|---|---|
| Supply voltage | VDD | -0.3 | 4.6 | V | Note1 Note2 |
| Operating temperature | TOPR | -10 | 60 | °C | - |
| Storage temperature | TSTR | -20 | 70 | °C | - |
3.3 Electrical Characteristics
3.3.1 Recommended Operating Conditions
Condition: VDDI=1.65 to 3.3V, VDD=2.4 to 3.3V, AGND=DGND=0V, Ta=25°C.
| Item | Symbol | Min | Typ | Max | Unit | Remark |
|---|---|---|---|---|---|---|
| Supply voltage | VDD | 2.4 | 2.8 | 3.3 | V | Note1 |
| Input Voltage "L" level | $V_{IL}$ | 0 | - | 0.3*IOVCC | V | - |
| Input Voltage "H" level | $V_{IH}$ | 0.7*IOVCC | - | IOVCC | V | - |
3.3.2 Backlight LED Characteristics
The backlight drive condition is IF=60mA, Vf=3.0V (TYP) for 3 parallel LEDs.
| Parameter | Symbol | Typ | Unit |
|---|---|---|---|
| Forward Voltage | Vf | 3.0 | V |
| Forward Current (Total) | IF | 60 | mA |
3.4 Interface Pin Assignment (21-Pin FPC)
The module communicates via a 21-pin FPC connector. Interface: 4-Line Serial.
| PIN NO. | Symbol | I/O | Description |
|---|---|---|---|
| 1 | GND | P | Ground |
| 2 | LEDA | P | Power for LED backlight anode |
| 3 | LEDK | P | Power for LED backlight cathode |
| 4 | VDD | P | Power supply |
| 5 | GND | P | Ground |
| 6 | CS | I | Chip select pin |
| 7 | RESET | I | Reset pin |
| 8 | RS | I | Command and Data select pin |
| 9 | SCL | I | Serial clock pin |
| 10 | SDA | I/O | Serial data input/output PIN |
| 11 | REV | - | (Reserved) |
| 12 | EDCBA | - | (Reserved) |
| 13-21 | NC | - | No Connection |
3.5 Timing Characteristics
3.5.1 4-Line Serial Interface Characteristics
Condition: VDDI=1.65 to 3.3V, VDD=2.4 to 3.3V, AGND=DGND=0V, Ta=25°C. Timing parameters are specified as TBD (To Be Defined).
| Signal | Symbol | Parameter | MIN | MAX | Unit |
|---|---|---|---|---|---|
| CSX | TCSS | Chip select setup time (write) | TBD | - | ns |
| CSX | TCSH | Chip select hold time (write) | TBD | - | ns |
| CSX | TCSS | Chip select setup time (read) | TBD | - | ns |
| CSX | TSCC | Chip select hold time (read) | TBD | - | ns |
| CSX | TCHW | Chip select "H" pulse width | TBD | - | ns |
| SCL | TSCYCW | Serial clock cycle (Write) | TBD | - | ns |
| SCL | TSHW | SCL "H" pulse width (Write) | TBD | - | ns |
| SCL | TSLW | SCL "L" pulse width (Write) | TBD | - | ns |
Note 1: The rising time and falling time (Tr, Tf) of input signal are specified at 15 ns or less. Logic high and low levels are specified as 30% and 70% of VDDI for Input signals.
3.5.2 Reset Timing
Condition: VDD=1.65 to 3.3V, VDD=2.4 to 3.3V, AGND=DGND=0V, Ta=25°C.
| Related Pins | Symbol | Parameter | MIN | MAX | Unit |
|---|---|---|---|---|---|
| RESX | TRW | Reset pulse duration | TBD | - | us |
| RESX | TRT | Reset cancel | - | TBD (Note 1, 5) | ms |
| RESX | TRT | Reset cancel | - | TBD (Note 1, 6, 7) | ms |
Notes: 1. The reset cancel includes also required time for loading ID bytes, VCOM setting and other settings from NVM (or similar device) to registers. This loading is done every time when there is HW reset cancel time (tRT) within 5 ms after a rising edge of RESX. 5. When Reset applied during Sleep In Mode. 6. When Reset applied during Sleep Out Mode. 7. It is necessary to wait 5msec after releasing RESX before sending commands. Also Sleep Out command cannot be sent for 120msec.
3.6 Electro-Optical Characteristics (Referenced)
Optical measurements are made using a CA310 or CS2000 at a distance of 50cm from the panel center. The response time definition: Tr is the time for luminance to change from 10% to 90%, and Td is from 90% to 10%.
3.7 Inspection Standards
3.7.1 Visual Inspection (Immobility)
- Glass Defect: Dimension non-conformity, cracks, glass extrude, and scratches are judged according to the defined criteria (Major/Minor).
- FPC Defect: Copper screen peel, no release tape, dirty dots are evaluated. For example, dirty dots with ψ≤0.25mm are allowed (2 pcs), while ψ>0.25mm are rejected.
- Black tape & Mara tape: Shift spec, missing tape, broken "mara" tape, and black tape not covering IC edges or polarizer are rejected.
3.7.2 Electrical Criteria
- Major Defects (Reject): No display, Missing line, Seg-com light and dark, Flicker, Mura, Over current, Voltage out of spec, Pattern blur, Dark light.
- Black/White dots, Dirty dots: Criteria based on diameter. For example, ψ≤0.15mm: disregard; 0.15mm<ψ≤0.25mm: 2 allowed; 0.25mm<ψ≤0.3mm: 1 allowed; ψ>0.3mm: 0 allowed.
- Fiber, glass scratch, polarizer scratch/folded: For W>0.1mm, L>3.0mm: 0 allowed.
Basic inspection: The LCM face is checked with an angle of incidence about 30 degrees, a distance of 30cm, and an angle of 45 degrees under a 30W Light Source.
3.8 Design Notes from Documentation
- B/L Driver: The backlight driving condition is IF=60mA, Vf=3.0V (TYP) for a 3-parallel LED configuration. The BL circuit diagram shows IF=60mA, Vf=3.2V (Note 4).
- Mechanical: Tolerance of segments to edge of glass: ±0.2mm. The FPC includes PI reinforcement with a total thickness of 0.3mm (FPC+PI). The overall module thickness is 1.91±0.15 mm.
- Housing: It is recommended that the housing visual area be at least 0.3mm smaller than the VA (Viewing Area) on each side. The housing foam window should be at least 0.6mm larger than the VA on each side. The TP edge should not contact metal conductors to avoid ESD or short circuit risks.
- RoHS: RoHS compliance is expected.
- Connector: The module uses a 21-pin FPC with a 0.5mm pitch connector (P0.5*(10-1)=4.5).
- FPC Bend Area: The yellow insulating tape is used for the FPC bend area protection.
- Silver Dot: Silver paste dots (银浆点) are used for grounding purposes.
4. Application Guidelines & Critical Notes
- Power Supply: The module requires a 2.8V (Typ.) power supply for VDD and 1.8V (Typ.) for VDDI. Ensure the power supply ripple is minimized.
- Interface: This module uses a standard 4-line Serial Interface (SPI) protocol. The host processor must be configured for this protocol, managing signals such as CS, RESET, RS, SCL, and SDA.
- Backlight Driver (External): An external constant current driver is recommended to supply the backlight via the LEDA and LEDK pins. The required driving condition is 60mA total current at 3.0V forward voltage (for a 3-parallel configuration).
- Reset: A hardware reset pin (RESET, Pin 7) is provided. The reset pulse duration must be at least TBD µs (refer to driver IC datasheet). It is necessary to wait 5ms after releasing RESX before sending commands. Also Sleep Out command cannot be sent for 120msec.
- Handling Precautions: Handle the module with care to avoid damage to the glass or FPC. Ground yourself to prevent electrostatic discharge (ESD).
- FPC Connection: The FPC has a designed bend area. Ensure proper strain relief when integrating into the final product.
5. Conclusion & Design-In Support
The LS020I12-S-V1 from Lesson Smart Display Technology is a 2.0-inch IPS TFT-LCD module with a 4-line SPI interface. It is a compact, high-quality display solution suitable for a wide variety of embedded display applications.
For successful design-in, engineers should:
- Obtain and review the complete, official Product Specification (Revision 1.0) for the full mechanical drawing and the driver IC datasheet for detailed command initialization and timing parameters.
- Design a clean 2.8V power supply and a backlight constant current driver circuit capable of delivering 60mA at 3.0V.
- Configure the host processor's SPI interface to match the timing specifications detailed in this datasheet.
- Contact the manufacturer for evaluation modules, sample requests, and further technical support during the design-in phase.
This module is designed to provide a reliable and vibrant display solution for a wide array of applications.
