LS055I06-MP-V1: 5.5-Inch a-Si TFT LCD Module, 720×1280 Resolution, 16.7M Colors, MIPI DSI Interface, 40-Pin, Touch Panel Support
Product Subtitle / Keywords
5.5 Inch Display, 720(RGB)×1280 Resolution, Transmissive a-Si TFT-LCD, MIPI DSI Interface (2/3/4 Data Lanes + 1 Clock Lane), COG+FPC+B/L, 16.7M Colors, 40-Pin, 70.6mm × 128.25mm Module Size, 68.04mm × 120.96mm Active Area, 2.8V AVDD, 1.8V IOVCC, -20°C~60°C Operating Temperature, -30°C~70°C Storage Temperature, LED Backlight (14 LEDs, 2×7 String Parallel, VF=22.4V, IF=40mA), Touch Panel (TP) Support
1. Executive Summary & Product Positioning
The LS055I06-MP-V1, developed by Lixin (Wan'an) Intelligent Display Technology Co., Ltd. (立信(万安)智显科技有限公司), is a 5.5-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module.
This product specification (Revision 1.0, Module Type: COG+FPC+B/L) serves as the definitive technical document, defining its structural composition (COG+FPC+B/L), general description, physical features, absolute maximum ratings, complete MIPI DSI interface pinout (40-pin), and electro-optical performance. It delivers a high-definition resolution of 720(RGB)×1280 (HD) with 16.7M-color display capability, featuring flexible data lane configuration (2, 3, or 4 lanes).
The document provides the core parameters necessary for system integration into embedded display applications requiring an HD resolution display with a standard high-speed serial interface and touch support. The unequivocal recommendation for engineers is to strictly adhere to the electrical specifications, interface timing, and mechanical tolerances described herein to ensure reliable performance and compatibility.
2. Detailed Product Overview & Architecture
- Core Technology: Transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module, which is composed of a TFT-LCD panel, a driver circuit and a backlight unit.
- Display Mode: Transmissive type.
- Display Format: Graphic 720(RGB)×1280 pixel array (HD resolution).
- Display Characteristics: Capable of displaying up to 16.7 million colors.
- Module Construction: COG (Chip-On-Glass) + FPC (Flexible Printed Circuit) + B/L (Backlight Unit).
- Interface Type: MIPI DSI (Supports 2, 3, or 4 data lanes + 1 clock lane).
- Connector Pin Count: 40-Pin (from interface definition drawing).
- Touch Panel: Includes touch panel control pins (SDA, SCL, RST, INT) for I2C capacitive touch.
- Backlight LED: 14 LEDs (2×7 String Parallel, VF=22.4V, IF=40mA).
- Approval Status: ☑ Approved Product Specification only (as per signature block).
3. Exhaustive Technical Specifications
3.1 Mechanical & Physical Specifications
| Panel Size (Diagonal) | 5.5 inch |
| Number of dots / Resolution | 720(RGB) × 1280 pixel |
| Display Type | 5.5" TFT, a-Si TFT, Transmissive |
| Module Type | COG+FPC+B/L |
| Module Size (H×V×D) | 70.6 × 128.25 × 1.53 mm (Max 0.8mm protrusion for components on FPC) |
| Active Area (H×V) | 68.04 × 120.96 mm |
| Number of pixels | 720(RGB) × 1280 pixels |
| Display Colors | 16.7M |
| Backlight Type | LED (14 LEDs, 2×7 String Parallel) |
| Backlight Drive Condition | VF=22.4V, IF=40mA (Typ.) |
Critical Mechanical Design Notes (from outline dimension drawing):
- The physical drawing includes detailed dimensions for the module, FPC, and component layout.
- Unit of measurement: mm.
- Drawing scale: Not to scale (NTS).
- Tolerance: ±0.2mm for dimensions with one decimal; ±0.3mm for dimensions without decimal; ±1/4° for angular dimensions.
- Single-sided adhesive soft foam (T=0.3MM) is applied to the FPC.
- Component area height: 0.8mm MAX (protrusion from backlight surface).
- LED configuration: 2×7=14 PCS.
- Resistor configuration: R1=820KΩ, R2=150KΩ, LCD_ID=0.28V.
- ESR (Electrostatic discharge resistor) is not added on Pin 10.
- Brightness enhancement film (增亮片) is included.
- FPC fold angle: bending (弯折后示意图).
- RoHS compliant + Halogen-free requirements.
3.2 Electrical & Interface Specifications
3.2.1 Absolute Maximum Ratings
| Item | Symbol | Min | Max | Unit | Remark |
|---|---|---|---|---|---|
| Supply voltage | VCC | -0.3 | 4 | V | Note1 Note2 |
| Supply voltage | IOVCC | -0.3 | 3.6 | V | Note1 Note2 |
| Operating temperature | TOPR | -20 | 60 | °C | Note1 Note2 |
| Storage temperature | TSTR | -30 | 70 | °C | Note1 Note2 |
3.2.2 Recommended Operating Conditions (from drawing notes and electrical spec)
| Parameter | Symbol | Value | Unit | Note |
|---|---|---|---|---|
| Analog Power Supply | AVDD | 2.8 | V | From drawing note |
| I/O Interface Power Supply | IOVCC | 1.8 | V | From drawing note |
| Digital Power Supply | VCC | 2.4~3.3 | V | From Reset Timing Table |
| Backlight Forward Voltage | VF | 22.4 | V | Typical, from drawing |
| Backlight Forward Current | IF | 40 | mA | Typical, from drawing |
| LCD ID Voltage | LCD_ID | 0.28 | V | From drawing (dividing by R1/R2) |
3.2.3 Pin Description (40-pin FPC)
The module uses a 40-pin interface with a MIPI DSI configuration that supports flexible data lane configurations. Based on the interface definition drawing and pin header descriptions, the pin assignments are as follows:
| PIN NO. | Symbol | I/O | Description | Function Group |
|---|---|---|---|---|
| 1 | GND | P | Ground | Power/Ground |
| 2 | NC | - | No connection (ESR not applied per drawing note) | - |
| 3 | NC | - | No connection | - |
| 4 | LEDA | P | Anode pin of backlight (Power for LED backlight) | Backlight |
| 5 | LEDK | P | Cathode pin of backlight (Ground for LED backlight) | Backlight |
| 6 | NC | - | No connection | - |
| 7 | TE | O | Tearing effect output pin to synchronize MPU to frame writing | Control |
| 8 | GND | P | Ground | Power/Ground |
| 9 | RESET | I | Reset signal for LCD (active low) | Control |
| 10 | NC | - | No connection (ESR not added per drawing note) | - |
| 11 | GND | P | Ground | Power/Ground |
| 12 | D0N | I/O | MIPI-DSI Data lane 0 — Differential negative signal | MIPI Interface |
| 13 | D0P | I/O | MIPI-DSI Data lane 0 — Differential positive signal | MIPI Interface |
| 14 | GND | P | Ground | Power/Ground |
| 15 | D1N | I | MIPI-DSI Data lane 1 — Differential negative signal | MIPI Interface |
| 16 | D1P | I | MIPI-DSI Data lane 1 — Differential positive signal | MIPI Interface |
| 17 | GND | P | Ground | Power/Ground |
| 18 | CLKN | I | MIPI-DSI Clock lane — Differential negative signal | MIPI Interface |
| 19 | CLKP | I | MIPI-DSI Clock lane — Differential positive signal | MIPI Interface |
| 20 | GND | P | Ground | Power/Ground |
| 21 | D2N | I | MIPI-DSI Data lane 2 — Differential negative signal | MIPI Interface |
| 22 | D2P | I | MIPI-DSI Data lane 2 — Differential positive signal | MIPI Interface |
| 23 | GND | P | Ground | Power/Ground |
| 24 | D3N | I | MIPI-DSI Data lane 3 — Differential negative signal | MIPI Interface |
| 25 | D3P | I | MIPI-DSI Data lane 3 — Differential positive signal | MIPI Interface |
| 26 | GND | P | Ground | Power/Ground |
| 27 | VCC | P | Power supply for LCD core logic | Power/Ground |
| 28 | GND | P | Ground | Power/Ground |
| 29 | AVDD | P | Analog power supply (2.8V from drawing note) | Power/Ground |
| 30 | NC | - | No connection | - |
| 31 | IOVCC | P | I/O power supply (1.8V from drawing note) | Power/Ground |
| 32 | NC | - | No connection | - |
| 33 | GND | P | Ground | Power/Ground |
| 34 | SDA | I/O | I2C data line for Touch Panel (1.8V from drawing note) | Touch Panel (CTP) |
| 35 | SCL | I | I2C clock line for Touch Panel (1.8V from drawing note) | Touch Panel (CTP) |
| 36 | RST | I | Reset pin for Touch Panel | Touch Panel (CTP) |
| 37 | INT | O | Interrupt signal for Touch Panel (1.8V from drawing note) | Touch Panel (CTP) |
| 38 | GND | P | Ground | Power/Ground |
| 39 | NC | - | No connection | - |
| 40 | NC | - | No connection | - |
Interface Summary:
- MIPI DSI Interface: Supports 2, 3, or 4 data lanes (D0, D1, D2, D3) and 1 clock lane (CLK). The full 4 data lane pair connections are present on pins 12-26, allowing flexible configuration for different bandwidth requirements.
- Touch Panel (CTP): Integrated capacitive touch panel interface using I2C protocol (SCL on Pin 35 and SDA on Pin 34) at 1.8V, plus RST (Pin 36) and INT (Pin 37) control signals.
- Backlight: Single LEDA (Anode, Pin 4) and LEDK (Cathode, Pin 5) pins for LED backlight (14 LEDs, 2×7 String Parallel, VF=22.4V, IF=40mA).
- Power: VCC (Pin 27) for core logic, IOVCC (Pin 31) for I/O at 1.8V, AVDD (Pin 29) for analog at 2.8V, GND (Pins 1, 8, 11, 14, 17, 20, 23, 26, 28, 33, 38) for ground.
- Control: RESET (Pin 9) for hardware reset of LCD, TE (Pin 7) for tearing effect synchronization.
- Unused Pins: Pins 2, 3, 6, 10, 30, 32, 39, 40 are NC (no connection) — leave floating.
3.2.4 MIPI DSI Interface Characteristics
The specification includes detailed MIPI DSI timing parameters for High-Speed and Low-Power modes, with the following key characteristics:
3.2.4.1 Best Frame Rate Setting
The optimal frame rate configuration depends on the number of active data lanes:
- 2 data lanes: 50~60 Hz
- 3 data lanes: 50~70 Hz
- 4 data lanes: 50~70 Hz
3.2.4.2 High-Speed Mode - Rising and Falling Timings (Table 41)
The specification defines the timing parameters for clock and data channels in high-speed mode, including the reference voltage points for differential clock and data signals.
3.2.5 Reset Operation of IC (Table 9: Reset Timing Characteristics)
| Symbol | Parameter | Related Pins | MIN | TYP | MAX | Unit |
|---|---|---|---|---|---|---|
| TRESW | Reset low pulse width | RESX | 10 | - | - | μs |
| TREST | Reset complete time | - | - | - | 10 | ms |
| TREST | - | - | 120 | ms |
Notes: When reset applied during Sleep in mode, TREST max = 10ms. When reset applied during Sleep out mode, TREST max = 120ms.
Test conditions: VSS=0V, VDDI=1.65V to 3.6V, VCI=2.5V to 5.7V, Ta = -30°C to 70°C.
3.3 Version Record
Revision 1.0, Revision status: F. The document includes previous revision history with dates spanning from 2019.7.20 to 2021.7.5 and a Sheet 2 revision.
4. Application Guidelines & Critical Notes
Intended Use
- Smartphones and mobile devices
- Portable media players and handheld gaming consoles
- Industrial control panels and human-machine interfaces (HMIs)
- Any application requiring an HD resolution display with a standard MIPI interface and touch support
Critical Design Considerations
- Flexible MIPI Lane Configuration: This module supports 2, 3, or 4 data lanes on the MIPI DSI interface. The host controller must be configured to match the desired lane count. The best frame rate performance is achieved with 3 or 4 lanes (50-70 Hz) versus 2 lanes (50-60 Hz).
- Power Supply: Provide stable power supplies: VCC (2.4V~3.3V) for core logic, IOVCC (1.8V) for I/O interface, and AVDD (2.8V) for analog circuits. The backlight requires a constant-current LED driver set to 40mA at approximately 22.4V.
- Touch Panel Integration: The module includes an I2C-based capacitive touch panel interface (SDA, SCL) operating at 1.8V logic levels, plus interrupt (INT) and reset (RST) control signals. Ensure the host has an I2C controller for touch interaction.
- Mechanical Integration: Module outline: 70.6mm × 128.25mm × 1.53mm. Active area: 68.04mm × 120.96mm. FPC: 40-pin with 0.3mm thick single-sided adhesive soft foam. Component area protrudes 0.8mm max from backlight surface.
- Temperature Limits: Operating Temperature: -20°C to +60°C. Storage Temperature: -30°C to +70°C.
- Reset Timing: The RESET pin (Pin 9) requires a minimum low pulse width of 10μs. The complete reset time depends on the operation mode — up to 120ms during Sleep Out mode.
- ESD Protection: Pin 10 is designated as NC and the ESR (Electrostatic discharge resistor) is explicitly not added. This should be considered during system-level ESD design.
- Backlight LED Protection: The LED configuration (2×7=14PCS) with VF=22.4V and IF=40mA requires careful current regulation to avoid exceeding maximum ratings.
Handling & Compliance
- The module is RoHS compliant + Halogen-free.
- Observe standard ESD precautions during handling and assembly.
- The module contains fragile glass and a 40-pin FPC – handle with care.
- Avoid bending the FPC sharply, especially near the connector interface.
- Do not attempt to disassemble or process the LCD module.
- NC terminals should be open. Do not connect anything.
- If the logic circuit power is off, do not apply the input signals.
5. Conclusion & Design-In Support
The LS055I06-MP-V1 specification details a versatile 5.5-inch HD display module with a configurable MIPI DSI interface (2/3/4 data lanes) and integrated I2C capacitive touch panel — an excellent choice for applications requiring an HD resolution display with flexible interface options and touch capability.
Key Strengths
- HD Resolution (720×1280): Provides sharp and detailed image quality for a 5.5-inch display.
- Configurable MIPI DSI Interface (2/3/4 Data Lanes): Offers flexibility to optimize pin count and bandwidth for various host controller capabilities.
- Integrated Capacitive Touch (I2C): Built-in touch panel with standard I2C interface simplifies system design and reduces BOM.
- High Color Depth: 16.7M colors (24-bit true color) provides excellent color reproduction.
- Standard 5.5-inch Size: Suitable for a wide range of embedded and mobile applications.
- Wide Operating Temperature Range: -20°C to +60°C for operation.
- RoHS + Halogen-Free Compliant: Environmentally friendly design.
- Multiple Ground Pins: 11 dedicated ground pins provide excellent signal integrity for high-speed MIPI operation.
Main Design Focus
- The critical design task is configuring the MIPI DSI interface on the host processor for the desired lane count (2, 3, or 4 lanes) and integrating the I2C capacitive touch panel interface for a complete HMI solution.
- Supporting requirements: Provide stable VCC, IOVCC (1.8V), and AVDD (2.8V) power supplies. Provide a constant-current backlight driver set to 40mA at 22.4V. Ensure proper reset timing (min 10μs pulse, up to 120ms complete time). Mechanical integration — the module outline is 70.6mm × 128.25mm × 1.53mm. FPC — 40-pin with 0.3mm foam backing.
This module is an excellent choice for mobile devices, portable applications, and any embedded system requiring an HD display with flexible interface configuration and integrated touch capability.