LS055I05-MP-V1: 5.46-Inch a-Si TFT LCD Module, 1080×2160 Resolution, 16.7M Colors, MIPI DSI Interface, 30-Pin, Touch Panel Support
Product Subtitle / Keywords
5.46 Inch Display, 1080(H)×2160(V) Resolution, Transmissive a-Si TFT-LCD, MIPI DSI Interface (4 Data Lanes + 1 Clock Lane), COG+FPC+B/L, 16.7M Colors, 30-Pin, 15.3g Mass, 3H Surface Hardness, -10°C~60°C Operating Temperature, -20°C~70°C Storage Temperature, LED Backlight (12 LEDs, 6 Series 2 Parallel), Nichia NSSW304GT-HG LEDs, Touch Panel (TP) Support
1. Executive Summary & Product Positioning
The LS055I05-MP-V1, developed by Lixin (Wan'an) Intelligent Display Technology Co., Ltd. (立信(万安)智慧科技有限公司), is a 5.46-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module.
This product specification (Revision LCP-3719104, dated Jun.28.2019, Module Type: COG+FPC+B/L) serves as the definitive technical document, defining its structural composition (COG+FPC+B/L), general description, physical features, absolute maximum ratings, complete MIPI DSI interface pinout (30-pin), and comprehensive electro-optical performance. It delivers a high-definition resolution of 1080(H)×2160(V) with 16.7M-color display capability, driven by a driver IC with MIPI interface and featuring a touch panel (TP) interface.
The document provides the core parameters necessary for system integration into embedded display applications requiring a high-resolution display with a standard high-speed serial interface and touch support. The unequivocal recommendation for engineers is to strictly adhere to the electrical specifications, interface timing, and mechanical tolerances described herein to ensure reliable performance and compatibility.
2. Detailed Product Overview & Architecture
- Core Technology: Transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module, which is composed of a TFT-LCD panel, a driver circuit and a backlight unit.
- Display Mode: Transmissive type.
- Display Format: Graphic 1080(H)×2160(V) pixel array.
- Display Characteristics: Capable of displaying up to 16.7 million colors.
- Module Construction: COG (Chip-On-Glass) + FPC (Flexible Printed Circuit) + B/L (Backlight Unit).
- Interface Type: MIPI DSI (4 data lanes + 1 clock lane as per pin description).
- Connector Pin Count: 30-Pin (Molex 504618-3010 connector).
- Touch Panel: Includes touch panel control pins (TP_XR, TP_XL, TP_YU, TP_YD, TP_RESX, TP_INT) for capacitive touch.
- Backlight LED: Nichia NSSW304GT-HG, 12 LEDs (6 Series 2 Parallel).
- Mass: 15.3g (TYP).
- Surface Hardness: 3H (Initial) Pencil hardness.
- Approval Status: ☑ Approved Product Specification only (as per signature block).
3. Exhaustive Technical Specifications
3.1 Mechanical & Physical Specifications
| Screen size (Diagonal) | 13.8684 cm [5.46 inch] |
| Active area | 62.046(H) × 124.092 (V) mm |
| Pixel format | 1080(H) × RGB × 2160(V) Pixel |
| Pixel pitch | 0.01915(H) × 0.05745 (V) mm |
| Pixel configuration | R,G,B vertical stripes |
| Outline dimensions (Except protrusion) | 63.88(W) × 130.33(H) × 1.131(D) mm (Note4) |
| Mass | 15.3 (TYP) g |
| Surface hardness (HC) | 3H (Initial) Pencil hardness |
| Backlight Type | 12 LEDs (6 Series 2 Parallel), Nichia NSSW304GT-HG |
| FPC Bending | Bending radius = R0.6mm, angle = 90°, min 30 times without break |
Critical Mechanical Design Notes (from outline dimension drawing):
- Note4: For detailed measurements and tolerances, please refer to Fig.5-1 Outline Dimensions.
- There is a possibility of light leakage from the LCM edge excluding OLB area. Please cover the place which would be the light leakage when the phone set is designed.
- It does not include module deformation and warping of the drawing dimensions.
- FPC bending radius should be the MIN. R0.
- The dimensions of the protrusions such as nails and hooks are not included in the external dimensions.
- Parenthesis dimensions are reference dimensions.
- There is that the IC is higher than the POL TOP by tolerance.
- For the chip side profile (S part), the maximum outline, including the BL / LCD centered shift and each member tolerance is the 63.98mm Max.
- Dimensional tolerance is applied within the range of 5mm than LCM outer edge; other range will apply the tolerance ± 0.2mm.
- Dimensions is the distance from the A.A. Center to the module outline.
- It protrudes resin onto the FPC is the 0.6mm Max from glass outline. It resin height does not exceed the POL height (the same is true for the IC and CF glass and FPC ton).
- Ag paste height shall not exceed the POL height.
- BLU LED quantity: 12pcs (6 Series 2 Parallel) [Nichia NSSW304G-HG].
- Connector: Molex 504622-3010 (h=0.78max w/o FPC).
- Stiffener (PI) thickness: 0.154mm.
- Bending area: 7.12mm.
- Component area: h=0.65max w/o FPC, h=0.95Max w/ FPC.
- Polarizer thickness: 0.077mm (Front-Pol), 0.083mm (Rear-Pol).
- CF thickness: 0.15mm, TFT thickness: 0.15mm.
- B/L thickness: 0.671mm.
- Total thickness: 1.131mm.
3.2 Electrical & Interface Specifications
3.2.1 Absolute Maximum Ratings
| Parameter | Symbol | Rated value | Unit | Remarks |
|---|---|---|---|---|
| Power Supply Voltage | IOVCC | -0.3 ~ +2.3 | V | Driver IC(Digital) |
| Power Supply Voltage | VSP | -0.3 ~ +6.2 | V | Positive Analog |
| Power Supply Voltage | VSN | -6.2 ~ +0.3 | V | Negative Analog |
| Input Voltage | VIN | -0.3 ~ IOVCC+0.3 | V | Digital (*4) |
| LED Reverse electric current | VR(LED) | +5.0 | Vmax | (*2) |
| LED Input electric current | I(LED) | 25 | mAmax | (*2), (*3) |
| LED Power Dissipation | PD(LED) | 82.5 | mWmax | Per 1LED.(*2) |
| Temperature for operation | Topr | -10 ~ +60 | °C | (*1) |
| Temperature for storage | Tstg | -20 ~ +70 | °C | (*1) |
3.2.2 Electrical Characteristics (Ta=-10~60°C, IOVCC=1.65~1.95V, GND=0V)
| Parameter | Symbol | Condition | Min. | Typ. | Max. | Unit | Remarks |
|---|---|---|---|---|---|---|---|
| Current consumption(1) | IOPE1 | 60Hz (*4) | 40.8 | 55 | mA | (*1) IOVCC | |
| Current consumption(1) | IOPE2 | 60Hz (*4) | 6.5 | 9.5 | mA | (*2) VSP | |
| Current consumption(1) | IOPE3 | 60Hz (*4) | 9.1 | 13.5 | mA | (*3) VSN | |
| Current consumption(2) | IOPE1 | 30Hz (*5) | 33.3 | 45 | mA | (*1) IOVCC | |
| Current consumption(2) | IOPE2 | 30Hz (*5) | 5.2 | 7.6 | mA | (*2) VSP | |
| Current consumption(2) | IOPE3 | 30Hz (*5) | 5.6 | 8.2 | mA | (*3) VSN | |
| Current consumption(3) | ISTBY1 | (*6) | - | - | 10 | uA | (*1) IOVCC |
| Power Consumption | WOPE | 60Hz (*4) Ta=25°C | 165 | 232 | mW |
Notes:
- (*4) setting based on 9-1sequence(Video Mode, 1/4 Shift gray scale pattern), VSP=5.8V, VSN=-5.8V, IOVCC=1.8V, Video Mode, TP=Active mode.
- (*5) setting based on 9-1sequence(Video Mode, 1/4 Shift gray scale pattern), VSP=5.8V, VSN=-5.8V, IOVCC=1.8V, Video Mode, TP=Active mode (Vblanking=TP scan stop), HOST=Dynamic FPS.
- (*6) Deep Standby Mode (Input signal stop), VSP=0V, VSN=0V, MIPI(DATAnP/DATAnN)=0V, Reset=L, TP Reset=L.
3.2.3 Pin Description (30-pin FPC, Molex 504618-3010)
The module uses a 30-pin interface with a MIPI DSI configuration that includes 4 data lanes (DATA0, DATA1, DATA2, DATA3) and 1 clock lane (CLK). The full pin assignments are as follows:
| PIN NO. | Symbol | I/O | Description | Function Group |
|---|---|---|---|---|
| 1 | GND | P | Ground | Power/Ground |
| 2 | NC | - | No connection | - |
| 3 | NC | - | No connection | - |
| 4 | NC | - | No connection | - |
| 5 | NC | - | No connection | - |
| 6 | NC | - | No connection | - |
| 7 | NC | - | No connection | - |
| 8 | NC | - | No connection | - |
| 9 | NC | - | No connection | - |
| 10 | NC | - | No connection | - |
| 11 | NC | - | No connection | - |
| 12 | NC | - | No connection | - |
| 13 | NC | - | No connection | - |
| 14 | NC | - | No connection | - |
| 15 | NC | - | No connection | - |
| 16 | NC | - | No connection | - |
| 17 | NC | - | No connection | - |
| 18 | NC | - | No connection | - |
| 19 | NC | - | No connection | - |
| 20 | NC | - | No connection | - |
| 21 | NC | - | No connection | - |
| 22 | NC | - | No connection | - |
| 23 | NC | - | No connection | - |
| 24 | NC | - | No connection | - |
| 25 | NC | - | No connection | - |
| 26 | NC | - | No connection | - |
| 27 | NC | - | No connection | - |
| 28 | NC | - | No connection | - |
| 29 | NC | - | No connection | - |
| 30 | NC | - | No connection | - |
Interface Summary (from recommended peripheral circuit diagram):
- MIPI DSI Interface: Uses 4 data lanes (DATA0P/N, DATA1P/N, DATA2P/N, DATA3P/N) and 1 clock lane (CLKP/N) for high-speed serial data transmission.
- Touch Panel (TP): Integrated touch panel interface with signals including TP_XR, TP_XL, TP_YU, TP_YD, TP_RESX, TP_INT.
- Backlight: Dedicated Anode_1, Anode_2 and Cathode_1, Cathode_2 pins for LED backlight.
- Power: IOVCC for I/O, VSP for positive analog, VSN for negative analog, DGND and AGND for ground.
- Control: RESX for hardware reset, TE for tearing effect output, INT for interrupt.
- Communication: SCL and SDA for I2C interface.
- Connector: Molex 504618-3010 (30-pin).
3.2.4 MIPI DSI Interface Characteristics
| Parameter | Symbol | Min. | Typ | Max. | Unit | Note |
|---|---|---|---|---|---|---|
| DSI CLK cycle time | tCLKP | 1.8 | - | 4 | ns | *1 |
| DSI Data Transfer Rate | tDSIR | 500 | - | 1000 | Mbps | *1 |
| Data to Clock Setup Time | tSETUP | 0.15 | - | - | UI | *1,2,3 |
| Data to Clock Hold Time [measured at receiver] | tHOLD | 0.15 | - | - | UI | *1,2,3 |
3.2.5 Touch Panel Characteristics (Table 8-3)
The specification includes detailed TP inspection limits (Table 8-3) for the touch panel, with settings based on 9-1sequence (Common Mode, Full screen White pattern), VSP=5.8V, VSN=-5.8V, IOVCC=1.8V, Video Mode.
3.3 VCOM Adjustment
The specification describes two methods for VCOM adjustment using a photoelectric device:
- Flicker measurement method: Flicker is set to minimum.
- Contrast measurement method: Contrast is set to maximum.
Using a photoelectric device, accuracy of 0.1 volts can be achieved (compared to ~0.5V with conventional visual adjustment).
3.4 Reliability Test Items
| No. | Test item | Conditions | Note |
|---|---|---|---|
| 1 | High temperature storage test | Ta= 70°C, 240h (storage test) | |
| 2 | Low temperature storage test | Ta=-20°C, 240h (storage test) | |
| 3 | High temperature and high humidity storage test | Ta= 40°C/95%RH, 240h (storage test) | |
| 4 | High temperature operation test | Tp= 60°C, 240h | |
| 5 | Low temperature operation test | Tp=-10°C, 240h | |
| 6 | High temperature and high humidity operation test | Tp= 40°C/95%RH, 240h | |
| 7 | Heat shock test | Ta=-20°C(1h) to +70°C(1h), 5cycle (storage test) | |
| 8 | Electro static discharge test | ±200V, 200pF(0Ω) to Terminals(Contact) (1 time for each terminals) | |
| 9 | Burn-in test | Ta= 25°C, 6h operation test (Checker Flag pattern) |
3.5 Display Quality
The standard about the color liquid crystal display module quality is based on shipment inspection standards.
3.6 Shipment Form
Lot number is indicated by printout. The indication location is indicated in a lot number printing position on fig 14-1.
3.7 Version Record
Revision LCP-3719104, dated Jun.28.2019.
4. Application Guidelines & Critical Notes
Intended Use
- Smartphones and mobile devices
- Portable media players and handheld gaming consoles
- Industrial control panels and human-machine interfaces (HMIs)
- Any application requiring a high-resolution display with a standard MIPI interface and touch support
Critical Design Considerations
- Interface (4-lane MIPI DSI): This module uses a MIPI DSI interface with 4 data lanes and 1 clock lane. The host controller must be capable of 4-lane MIPI operation for the 1080×2160 resolution.
- Power Supply: Provide stable IOVCC (1.65~1.95V) for I/O, VSP (5.8V typical) for positive analog, and VSN (-5.8V typical) for negative analog power supplies. The backlight requires a constant-current LED driver connected to the Anode and Cathode pins.
- Touch Panel Integration: The module includes a touch panel interface with I2C communication (SCL, SDA), interrupt (INT), and reset (RESX) signals. Ensure the host has an I2C controller for touch interaction.
- Mechanical Integration: Module outline: 63.88mm × 130.33mm × 1.131mm. Active area: 62.046mm × 124.092mm. Mass: 15.3g. Connector: Molex 504618-3010 (30-pin).
- Temperature Limits: Operating Temperature: -10°C to +60°C. Storage Temperature: -20°C to +70°C.
- ESD Protection: Observe standard ESD precautions during handling and assembly. The module has an ESD test rating of ±200V.
- FPC Bending: The FPC can withstand bending at R0.6mm, 90° angle, for a minimum of 30 times without breaking.
- Surface Hardness: The polarizer has a surface hardness of 3H (Pencil hardness) — handle with care to avoid scratches.
Handling & Compliance
- The module is subject to standard ESD precautions during handling and assembly.
- The module contains fragile glass and a 30-pin FPC – handle with care.
- Avoid bending the FPC sharply, especially near the connector interface.
- Do not attempt to disassemble or process the LCD module.
- NC terminals should be open. Do not connect anything.
- If the logic circuit power is off, do not apply the input signals.
- There is a possibility of light leakage from the LCM edge excluding OLB area — please cover the place which would be the light leakage when the phone set is designed.
5. Conclusion & Design-In Support
The LS055I05-MP-V1 specification details a standard 5.46-inch high-resolution display module with a 4-lane MIPI DSI interface and integrated touch panel — an excellent choice for applications requiring a high-resolution display with a standard high-speed serial interface and touch capability.
Key Strengths
- High Resolution (1080×2160): Provides sharp and detailed image quality for a 5.46-inch display.
- MIPI DSI Interface (4 Data Lanes): Sufficient bandwidth for high-resolution video content.
- Integrated Touch Panel: Built-in touch panel interface with I2C communication simplifies system design.
- High Color Depth: 16.7M colors (24-bit true color) provides excellent color reproduction.
- Standard 5.46-inch Size: Suitable for a wide range of embedded and mobile applications.
- Lightweight Design: Only 15.3g mass for portable applications.
- Wide Operating Temperature Range: -10°C to +60°C for operation.
- High-Quality LED Backlight: Uses Nichia NSSW304GT-HG LEDs for reliable backlight performance.
Main Design Focus
- The critical design task is properly configuring the MIPI DSI interface on the host processor for 4-lane operation and ensuring reliable high-speed data transfer for 1080×2160 resolution.
- Supporting requirements: Provide stable IOVCC, VSP, and VSN power. Provide a constant-current backlight driver. Integrate the touch panel I2C interface. Mechanical integration — the module outline is 63.88mm × 130.33mm × 1.131mm. Connector — Molex 504618-3010 (30-pin).
This module is an excellent choice for mobile devices, portable applications, and any embedded system requiring a high-resolution display with touch capability and a standard MIPI interface.
