LS055I13-MP-V1: 5.46-Inch a-Si TFT LCD Module, 1080×1920 Resolution, 16.7M Colors, MIPI DSI Interface, 30-Pin, Touch Panel Support

LS055I13-MP-V1: 5.46-Inch a-Si TFT LCD Module, 1080×1920 Resolution, 16.7M Colors, MIPI DSI Interface, 30-Pin, Touch Panel Support

Product Subtitle / Keywords

5.46 Inch Display, 1080(RGB)×1920 Resolution, Transmissive a-Si TFT-LCD, MIPI DSI Interface (4 Data Lanes + 1 Clock Lane), COG+FPC+B/L, 16.7M Colors, 30-Pin, 2.65V~3.3V VCC, 1.65V~3.3V IOVCC, -20°C~70°C Operating Temperature, -30°C~80°C Storage Temperature, LED Backlight (7 Series 2 Parallel, VF=19.6~22.4V, IF=40mA), Touch Panel (TP) Support, HX8399 Driver IC, IPS Display

1. Executive Summary & Product Positioning

The LS055I13-MP-V1, developed by Lixin (Wan'an) Intelligent Display Technology Co., Ltd. (立信(万安)智显科技有限公司), is a 5.46-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module.

This product specification (Revision 1.0, Module Type: COG+FPC+B/L) serves as the definitive technical document, defining its structural composition (COG+FPC+B/L), general description, physical features, absolute maximum ratings, and complete MIPI DSI interface pinout (30-pin). It delivers a high-definition resolution of 1080(RGB)×1920 (Full HD) with 16.7M-color display capability, driven by the HX8399 driver IC.

The document provides the core parameters necessary for system integration into embedded display applications requiring a high-resolution display with a standard high-speed serial interface. The unequivocal recommendation for engineers is to strictly adhere to the electrical specifications, interface timing, and mechanical tolerances described herein to ensure reliable performance and compatibility.

2. Detailed Product Overview & Architecture

• Core Technology: Transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module, which is composed of a TFT-LCD panel, a driver circuit and a backlight unit.
• Display Mode: Transmissive type, IPS (In-Plane Switching) technology.
• Display Format: Graphic 1080(RGB)×1920 pixel array (Full HD).
• Display Characteristics: Capable of displaying up to 16.7 million colors.
• Module Construction: COG (Chip-On-Glass) + FPC (Flexible Printed Circuit) + B/L (Backlight Unit).
• Interface Type: MIPI DSI (4 data lanes + 1 clock lane as per pin description).
• Connector Pin Count: 30-Pin (GB042-30P-H10-E3000 connector).
• Touch Panel: Includes touch panel control pins (TP_SDA, TP_SCL, TP_RST, TP_EINT, TP_VDD) for I2C capacitive touch.
• Backlight LED: 7 Series 2 Parallel configuration (VF=19.6~22.4V, IF=40mA).
• Driver IC: HX8399.
• Approval Status: ☑ Approved Product Specification only (as per signature block).

3. Exhaustive Technical Specifications

3.1 Mechanical & Physical Specifications

Critical Mechanical Design Notes (from outline dimension drawing):

• The physical drawing provides detailed dimensions for the module, including LCD AA (Active Area), LCD & CF, BL, and POL thicknesses.
• Unit of measurement: mm.
• Drawing scale: Not to scale (NTS).
• Tolerance: ±0.2mm for dimensions with one decimal; ±0.3mm for dimensions without decimal; ±1/4° for angular dimensions.
• Module thickness (LCM): 1.95±0.2mm.
• LCD thickness: 0.8mm.
• FPC + Steel sheet reinforcement total thickness: 0.3mm.
• POL thickness: 0.13mm.
• Steel sheet reinforcement thickness: T=0.2mm.
• Connector: GB042-30P-H10-E3000.
• Yellow insulating tape and silver paste points are present on the FPC.
• White alignment marks are provided for assembly.
• Easy-tear tape (易撕贴) with hand-tear position is included.
• FPC bending and folding diagram is provided for shipping configuration.
• 0.05mm double-sided tape is used in the FPC assembly.
• Notes from drawing:
  • TP edge must not contact metal conductors.
  • Chassis foam window should be larger than VAmds by 0.6mm or more per side.
  • Suggested housing visible area should be smaller than VAmds by 0.3mm or more per side.
  • RoHS compliance.

3.2 Electrical & Interface Specifications

3.2.1 Absolute Maximum Ratings

3.2.2 Recommended Operating Conditions (from pin description)

3.2.3 Pin Description (30-pin FPC, GB042-30P-H10-E3000)

The module uses a 30-pin interface with a MIPI DSI configuration that includes 4 data lanes (D0, D1, D2, D3) and 1 clock lane (CLK). The full pin assignments are as follows:

Interface Summary:

• MIPI DSI Interface: Uses 4 data lanes (D0, D1, D2, D3) and 1 clock lane (CLK) for high-speed serial data transmission.
• Touch Panel (CTP): Integrated capacitive touch panel interface using I2C protocol (TP_SCL and TP_SDA), plus TP_RST (reset) and TP_EINT (interrupt) control signals, and TP_VDD (power).
• Backlight: Single A (Anode, Pin 13) and K (Cathode, Pin 14) pins for LED backlight (7 Series 2 Parallel, VF=19.6~22.4V, IF=40mA).
• Power: VCC (Pins 2, 3) for analog circuits (2.65V~3.3V), IOVCC (Pins 5, 6) for digital circuits (1.65V~3.3V), GND (Pins 1, 4, 7, 10, 15, 16, 17, 20, 23, 24, 27, 30) for ground.
• Control: RESET (Pin 11) for hardware reset of LCD, TE (Pin 12) for tearing effect synchronization.

3.3 Version Record

Revision 1.0, dated 2025-06-13.

4. Application Guidelines & Critical Notes

Intended Use

• Smartphones and mobile devices
• Portable media players and handheld gaming consoles
• Industrial control panels and human-machine interfaces (HMIs)
• Any application requiring a full-HD resolution display with a standard MIPI interface and touch support

Critical Design Considerations

1. Interface (4-lane MIPI DSI): This module uses a MIPI DSI interface with 4 data lanes and 1 clock lane. The host controller must be capable of 4-lane MIPI operation for the 1080×1920 resolution.
2. Power Supply: Provide stable VCC (2.65V~3.3V) for analog circuits and IOVCC (1.65V~3.3V) for digital circuits. The backlight requires a constant-current LED driver set to 40mA at approximately 19.6~22.4V.
3. Touch Panel Integration: The module includes a capacitive touch panel interface with I2C communication (TP_SCL, TP_SDA), interrupt (TP_EINT), reset (TP_RST), and power (TP_VDD) signals. Ensure the host has an I2C controller for touch interaction.
4. Mechanical Integration: Module thickness: 1.95±0.2mm. Connector: GB042-30P-H10-E3000. The FPC includes steel sheet reinforcement (T=0.2mm) and double-sided tape (0.05mm). Pay attention to the FPC bending and folding requirements for shipping.
5. Temperature Limits: Operating Temperature: -20°C to +70°C. Storage Temperature: -30°C to +80°C.
6. ESD Protection: Observe standard ESD precautions during handling and assembly.
7. Reset Sequence: Ensure the RESET pin (Pin 11) is held low for a sufficient period during power-up to guarantee proper initialization.
8. Tearing Effect (TE) Signal: Pin 12 provides a TE output for synchronizing the MPU to frame writing. If not used, leave this pin open.
9. Mechanical Design Notes: TP edge must not contact metal conductors. Chassis foam window should be larger than VAmds by 0.6mm or more per side. Suggested housing visible area should be smaller than VAmds by 0.3mm or more per side.

Handling & Compliance

• The module is RoHS compliant.
• Observe standard ESD precautions during handling and assembly.
• The module contains fragile glass and a 30-pin FPC – handle with care.
• Avoid bending the FPC sharply, especially near the connector interface.
• Do not attempt to disassemble or process the LCD module.
• NC terminals should be open. Do not connect anything.
• If the logic circuit power is off, do not apply the input signals.

5. Conclusion & Design-In Support

The LS055I13-MP-V1 specification details a standard 5.46-inch full-HD display module with a 4-lane MIPI DSI interface and integrated touch panel — an excellent choice for applications requiring a high-resolution display with a standard high-speed serial interface and touch capability.

Key Strengths

• Full-HD Resolution (1080×1920): Provides sharp and detailed image quality for a 5.46-inch display.
• IPS Display Technology: Offers superior viewing angles and color reproduction compared to standard TN panels.
• MIPI DSI Interface (4 Data Lanes): Sufficient bandwidth for full-HD video content.
• Integrated Capacitive Touch (I2C): Built-in touch panel with standard I2C interface simplifies system design and reduces BOM.
• High Color Depth: 16.7M colors (24-bit true color) provides excellent color reproduction.
• Standard 5.46-inch Size: Suitable for a wide range of embedded and mobile applications.
• Wide Operating Temperature Range: -20°C to +70°C for operation and -30°C to +80°C for storage.
• HX8399 Driver IC: Reliable and well-supported driver IC for MIPI DSI interfaces.

Main Design Focus

• The critical design task is properly configuring the MIPI DSI interface on the host processor for 4-lane operation and ensuring reliable high-speed data transfer for 1080×1920 resolution.
• Supporting requirements: Provide stable VCC (2.65V~3.3V) and IOVCC (1.65V~3.3V) power. Provide a constant-current backlight driver set to 40mA at 19.6~22.4V. Integrate the touch panel I2C interface. Mechanical integration — the module thickness is 1.95±0.2mm. Connector — GB042-30P-H10-E3000.

This module is an excellent choice for mobile devices, portable applications, and any embedded system requiring a full-HD IPS display with touch capability and a standard MIPI interface.