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LSC030I06-MP-V1 2.96 inch TFT-LCD Module 360x640 16.7M Colors IPS ST7701SN Driver IC MIPI DSI Interface

LSC030I06-MP-V1 2.96 inch TFT-LCD Module 360x640 16.7M Colors IPS

Product Keywords: 2.96″ LCD Module, COG+FPC+B/L+CTP, 360(RGB)×640 Resolution, 16.7M Colors, IPS (All Viewing), ST7701SN Driver IC, MIPI DSI Interface, 6 Chip-White LED Parallel (20mA), -20°C to +70°C Operation.

1. Executive Summary & Product Positioning

The LSC030I06-MP-V1 is a 2.96-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module developed by 立信(万安)智显科技有限公司 (Lesson Smart Display Technology Co., Ltd). It is composed of a TFT-LCD panel, a driver circuit, and a backlight unit. The panel size is 2.96 inch and the resolution is 360(RGB)*640, the panel can display up to 16.7M colors.

Product Positioning: This module features a 2.96-inch IPS (In-Plane Switching) panel with a CTP (Capacitive Touch Panel), offering superior viewing angles and high color performance. With a MIPI DSI interface, it is well-suited for a wide range of applications such as industrial HMI, smart home devices, portable instruments, and other embedded systems requiring touch capability and wide viewing angles.

2. Detailed Product Overview & Architecture

The module's architecture is designed for robust performance and easy integration. The primary components include:

  • TFT-LCD Panel: 2.96-inch diagonal, a-Si TFT active matrix, transmissive, IPS mode. Resolution is 360(RGB) × 640 pixels with an active area of 36.72 (H) × 65.28 (V) mm.
  • Driver IC: The module uses the ST7701SN driver IC, communicating via a MIPI DSI Interface (1 data lane).
  • Touch Panel (CTP): The module includes an integrated Capacitive Touch Panel (CTP), using a G+TP (Glass + Touch Panel) structure with IC selection CST836U. The surface hardness is 6H with Anti-Fingerprint (AF) coating. Transmittance is ≥85%.
  • Backlight Unit (B/L): A white LED backlight with 6 Chip-White LEDs configured in parallel. The typical driving condition is IF=20mA, Vf=19.6V (TYP).
  • Mechanical Construction: COG (Chip-on-Glass) + FPC + B/L + CTP.
  • Interface: The module communicates via a 25-pin FPC connector. The display interface is MIPI DSI.
  • Display Mode: Transmissive, IPS.
  • Viewing Direction (Grayscale Inversion): All Viewing (IPS).

3. Exhaustive Technical Specifications

3.1 General & Mechanical Specifications

Item Specification
Display Size (Diagonal) 2.96 inches
Resolution (Dots) 360(RGB) × 640
Display Technology Active Matrix TFT, Transmissive, a-Si, IPS
Module Construction COG+FPC+B/L+CTP
Color Depth 16.7M Colors
Viewing Direction (Grayscale Inversion) All Viewing (IPS)
Input Data Interface MIPI DSI (1 Lane)
Driver IC ST7701SN
LCM Module Size (H×V×D) 42.64 × 74.51 × 3.51 mm
Active Area (AA, H×V) 36.72 × 65.28 mm
Pixel Arrangement RGB Dot-matrix (360(RGB)×640)
Display Mode Active matrix TFT, Transmissive type
Backlight Configuration 6 Chip-White LED, Parallel
Operating Temperature -20°C to +70°C
Storage Temperature -30°C to +80°C

3.2 Absolute Maximum Ratings

Stress beyond those listed may cause permanent damage.

Item Symbol Min Max Unit Remark
Supply voltage VCC -0.3 3.6 V Note1 Note2
Supply voltage IOVCC -0.3 3.6 V Note1 Note2
Operating temperature TOPR -20 70 °C Note1 Note2
Storage temperature TSTR -30 80 °C Note1 Note2

3.3 Electrical Characteristics

3.3.1 Recommended Operating Conditions

Item Symbol Min Typ Max Unit
Supply voltage VCC 2.5 2.8 3.6 V
I/O supply voltage IOVCC 1.65 1.8 3.3 V
Input voltage (L level) VIL VSS --- 0.3*IOVCC V
Input voltage (H level) VIH 0.7*IOVCC --- IOVCC V

3.3.2 Backlight LED Characteristics

The backlight consists of 6 Chip-White LEDs in Parallel. The backlight drive condition is IF=20mA, Vf=19.6V (TYP).

Parameter Symbol Typ Unit
Forward Voltage Vf 19.6 V
Forward Current If 20 mA

3.4 Interface Pin Assignment (25-Pin FPC, MIPI DSI)

Connector: 25-pin FPC. Interface: MIPI DSI (1 Lane).

PIN NO. Symbol I/O Description
1 GND P Ground
2 CTP_RST3.3V I Reset signal pin for CTP
3 CTP_SDA3.3V I Serial data input/output bidirection pin for CTP
4 CTP_SCL3.3V I Serial clock pin for CTP
5 CTP_INT3.3V I Interrupt signal for CTP
6 CTP_VDD3.3V P Power supply for CTP
7 GND P Ground
8 VDD2.8-3.3V P Power supply for LCD
9 IOVCC1.8V P I/O power supply
10 RESET I The external reset input
11 GND P Ground
12 D0N I/O MIPI DSI differential data pair
13 D0P I/O MIPI DSI differential data pair
14 GND P Ground
15 CLKN I MIPI DSI differential clock pair
16 CLKP I MIPI DSI differential clock pair
17 GND P Ground
18 D1N I MIPI DSI differential data pair
19 D1P I MIPI DSI differential data pair
20,21 GND P Ground
22,23 LEDA P Power for LED backlight anode
24,25 LEDK P Power for LED backlight cathode

3.5 Design Notes from Documentation

  • B/L Driver: The backlight driving condition is IF=20mA, Vf=19.6V (TYP) for the 6 parallel LEDs configuration.
  • Mechanical: Tolerance of segments to edge of glass: ±0.2mm. Steel plate reinforcement (钢片补强 T=0.2) is included. The FPC includes PI reinforcement with a total thickness of 0.3mm (FPC+PI补强). Yellow insulating tape is used for protection. Conductive double-sided tape (T=0.05mm) is used.
  • CTP Specification: Touch panel uses G+TP structure. IC selection is CST836U. Surface hardness is 6H with Anti-Fingerprint (AF) coating. Transmittance is ≥85%.
  • Housing: It is recommended that the housing visual area be at least 0.3mm smaller than the VA (Viewing Area) on each side. The housing foam window should be at least 0.6mm larger than the VA on each side. TP edge should not contact metal conductors to avoid ESD or short circuit risks. It is recommended that the customer's device housing avoid the FPC protruding part.
  • RoHS: RoHS compliance is expected.

3.6 Inspection Standards

The module is inspected according to GB/T 2828-2003; normal inspection, Class II.

3.6.1 Major and Minor Defect Acceptance Criteria (Summary)

Category Defect Items (Sample) Criteria
Major Defect No display, Missing line, Flicker, Over current, Pattern blur, Mura (ND filter 2% test), No black tape, Cracks (linear) Reject
Minor Defect (e.g. Bubbles, Dots) Polarizer bubble/concave/convex, Black dots, Impurities Acceptable counts defined by size (e.g. ψ≤0.15mm disregard, ψ>0.5mm=0)
Minor Defect (e.g. Cracks & Damage) Glass extrude conductive area, Pin-side conductive/non-conductive area damage, Non-pin-side damage Acceptable within defined limits (e.g. b≤1/3 pin width)
Minor Defect (e.g. Tape issues) FPC/HS black tape shift, Tape position mistake, Mara tape defect Reject if shift criteria not met or by engineering drawing

4. Application Guidelines & Critical Notes

  • Power Supply: The module requires a 2.8V (Typ.) power supply for VDD and 1.8V (Typ.) for IOVCC. The CTP requires a 3.3V supply. Ensure the power supply ripple is minimized.
  • Interface: This module uses a standard 1-Lane (D0) and 1-Lane (D1) MIPI DSI protocol.
  • Backlight Driver (External): An external constant current driver is required to supply a typical current of 20mA at a forward voltage of 19.6V.
  • Reset: A hardware reset pin (RESET, Pin 10) is provided.
  • CTP Interface: The CTP communicates via I2C (SDA, SCL) with a dedicated interrupt (INT) and reset (RST). The CTP is powered by 3.3V.
  • Handling Precautions: Handle the module with care to avoid damage to the glass, FPC, or CTP. Ground yourself to prevent electrostatic discharge (ESD).

5. Conclusion & Design-In Support

The LSC030I06-MP-V1 from Lesson Smart Display Technology is a 2.96-inch IPS TFT-LCD module with an integrated Capacitive Touch Panel. It is a compact, touch-enabled, high-color-performance display solution suitable for a wide variety of embedded display applications such as smart home devices and portable instruments.

For successful design-in, engineers should:

  • Obtain and review the complete, official Product Specification (Revision 1.0) for the full mechanical drawing and the ST7701SN driver IC datasheet for detailed command initialization.
  • Design a clean 2.8V/1.8V power supply, a 3.3V supply for the touch controller, and a backlight constant current driver circuit capable of delivering 20mA at 19.6V.
  • Configure the host processor's MIPI DSI interface to match the timing specifications detailed in this datasheet.
  • Contact the manufacturer for evaluation modules, sample requests, and further technical support during the design-in phase.

This module is designed to provide a reliable and vibrant display solution for a wide array of applications.

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Eddie Chen
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