LSL050I26-MP-V2 5.0 inch TFT-LCD Module 720x1280 16.7M Colors IPS
Product Keywords: 5.0″ LCD Module, COG+FPC+B/L+LENS, 720(RGB)×1280 Resolution, 16.7M Colors, IPS (Free Viewing), FL7703NI Driver IC, MIPI Interface, 500 cd/m² Brightness, 14-CHIP WHITE LED Backlight (40mA), -20°C to +70°C Operation.
1. Executive Summary & Product Positioning
The LSL050I26-MP-V2 is a 5.0-inch transmissive type a-Si TFT-LCD (amorphous silicon thin film transistor liquid crystal display) module developed by 立信(万安)智显科技有限公司 (Lesson Smart Display Technology Co., Ltd). It is composed of a TFT-LCD panel, a driver circuit, and a backlight unit. The panel size is 5.0 inch and the resolution is 720(RGB)*1280, the panel can display up to 16.7M colors.
Product Positioning: This module features a 5.0-inch IPS (In-Plane Switching) panel, offering superior viewing angles (Free) and high color performance. With a MIPI DSI interface, it is well-suited for a wide range of applications such as industrial HMI, smart home devices, portable instruments, and other embedded display systems requiring wide viewing angles and high color accuracy.
2. Detailed Product Overview & Architecture
The module's architecture is designed for robust performance and easy integration. The primary components include:
- TFT-LCD Panel: 5.0-inch diagonal, a-Si TFT active matrix, transmissive, IPS mode. Resolution is 720(RGB) × 1280 pixels.
- Driver IC: The module uses the FL7703NI driver IC, communicating via a MIPI DSI Interface.
- Backlight Unit (B/L): A white LED backlight with 14 CHIP WHITE LED configuration. The typical driving condition is IF=40mA, Vf=22.4V (TYP). The typical surface luminance is 500 cd/m².
- Mechanical Construction: COG (Chip-on-Glass) + FPC + B/L + LENS. The module outline dimensions are 65.3 (H) × 79.46 (V) × 2.49 (D) mm (LCM only).
- Interface: The module communicates via a 26-pin FPC connector. The display interface is MIPI DSI.
- Display Mode: Active matrix TFT, Transmissive type, IPS.
- Viewing Direction (Grayscale Inversion): Free (IPS).
3. Exhaustive Technical Specifications
3.1 General & Mechanical Specifications
| Item | Specification |
| Display Size (Diagonal) | 5.0 inches |
| Resolution (Dots) | 720(RGB) × 1280 |
| Display Technology | Active Matrix TFT, Transmissive, a-Si, IPS |
| Module Construction | COG+FPC+B/L+LENS |
| Color Depth | 16.7M Colors |
| Viewing Direction (Grayscale Inversion) | Free (IPS) |
| Input Data Interface | MIPI DSI |
| Driver IC | FL7703NI |
| LCM+LENS Module Size (H×V×D) | 65.5 × 80.0 × 2.49 mm |
| Active Area (AA, H×V) | 62.1 × 110.4 mm |
| Pixel Arrangement | RGB Dot-matrix (720(RGB)×1280) |
| Display Mode | Active matrix TFT, Transmissive type |
| Backlight Configuration | 14-CHIP WHITE LED |
| Operating Temperature | -20°C to +70°C |
| Storage Temperature | -30°C to +80°C |
3.2 Absolute Maximum Ratings
Stress beyond those listed may cause permanent damage.
| Item | Symbol | Min | Max | Unit |
|---|---|---|---|---|
| Supply voltage (IOVCC) | IOVCC | -0.3 | 5.5 | V |
| Supply voltage (VCC) | VCC | -0.3 | 6.6 | V |
| Operating temperature | TOPR | -20 | 70 | °C |
| Storage temperature | TSTR | -30 | 80 | °C |
3.3 Electrical Characteristics
3.3.1 Recommended Operating Conditions
| Item | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Supply voltage | VCC | 2.5 | 2.8 | 3.3 | V |
| I/O supply voltage | IOVCC | 1.65 | 1.8 | 3.3 | V |
| Input voltage "H" level | VIH | 0.7*IOVCC | --- | IOVCC | V |
| Input voltage "L" level | VIL | 0 | --- | 0.3*IOVCC | V |
3.3.2 Backlight LED Characteristics
The backlight drive condition is IF=40mA, Vf=22.4V (TYP).
| Parameter | Symbol | Typ | Unit |
|---|---|---|---|
| Forward Voltage | Vf | 22.4 | V |
| Forward Current | If | 40 | mA |
| Surface Luminance | L | 500 | cd/m² |
3.4 Interface Pin Assignment (26-Pin FPC, MIPI DSI)
Interface: MIPI DSI.
| PIN NO. | Symbol | I/O | Description |
|---|---|---|---|
| 1 | GND | P | Ground |
| 2 | D0P | I/O | High speed interface data differential signal input/output pins |
| 3 | D0N | I/O | High speed interface data differential signal input/output pins |
| 4 | GND | P | ground |
| 5 | D1P | I | High speed interface data differential signal input pins. |
| 6 | D1N | I | High speed interface data differential signal input pins. |
| 7 | GND | P | ground |
| 8 | CLKP | I | High speed interface clock differential signal input pins |
| 9 | CLKN | I | High speed interface clock differential signal input pins |
| 10 | GND | P | ground |
| 11 | D2P | I | High speed interface data differential signal input pins. |
| 12 | D2N | I | High speed interface data differential signal input pins. |
| 13 | GND | P | ground |
| 14 | D3P | I | High speed interface data differential signal input pins. |
| 15 | D3N | I | High speed interface data differential signal input pins. |
| 16-17 | GND | P | Ground |
| 18-19 | IOVCC | P | Power supply (I/O) |
| 20,22,23,26 | NC | -- | Not Connect |
| 21 | ID | O | ID |
| 24 | RESET | I | Reset pin |
| 25 | TE | O | Serves TE (Tearing Effect) output pin |
3.5 Timing Characteristics
3.5.1 MIPI DSI High Speed Mode Characteristics
Test conditions: A=0V, IOVCC=1.65V to 3.3V, VCI=2.5V to 3.3V, TA = -30 to 70°C.
| Signal | Item | Symbol | Min. | Max. | Unit |
|---|---|---|---|---|---|
| DSI_CP/DSI_CN | Double UI instantaneous (4 Lanes) | 2xUINST | 3.30 | 25 | ns |
| DSI_CP/DSI_CN | UI instantaneous (4 Lanes) | UINST | 1.67 | 12.5 | ns |
| DP/DN | Data to clock setup time | TDS | 0.15xUI | - | ps |
| DP/DN | Data to clock hold time | TDH | 0.15xUI | - | ps |
| DSI_CP/DSI_CN | Differential rise time for clock | TDRTCLK | 150 | 0.3UI | ps |
| DSI_CP/DSI_CN | Differential fall time for clock | TDFTCLK | 150 | 0.3UI | ps |
| DP/DN | Differential rise time for data | TDRTDATA | 150 | 0.3UI | ps |
| DP/DN | Differential fall time for data | TDFTDATA | 150 | 0.3UI | ps |
3.5.2 MIPI DSI Low Power Mode Characteristics
Test conditions: A=0V, IOVCC=1.65V to 3.3V, VCI=2.3V to 3.3V, TA = -30 to 70°C.
| Signal | Item | Symbol | Min. | Max. | Unit |
|---|---|---|---|---|---|
| DSI_D0P/DSI_D0N | Length of LP-00/LP01/LP10/LP11 (Host → Module) | TLPXM | 50 | - | ns |
| DSI_D0P/DSI_D0N | Length of LP-00/LP01/LP10/LP11 (Module → Host) | TLPXD | 50 | - | ns |
| DSI_D0P/DSI_D0N | Time-out before MPU start driver | TTA-SURE | TLPXD | 2xTLPXD | ns |
| DSI_D0P/DSI_D0N | Time to drive LP-00 by module | TTA-GET | 5xTLPXD | - | ns |
| DSI_D0P/DSI_D0N | Time to drive LP-00 after turnaround request | TTAGO | 4xTLPXD | - | ns |
3.5.3 Reset Input Timing
Test conditions: A=0V, IOVCC=1.65V to 3.3V, VCI=2.5V to 3.3V, TA = -30 to 70°C.
| Parameter | Symbol | Min. | Max. | Unit | Note |
|---|---|---|---|---|---|
| Reset low pulse width | tRESW | 10 | - | μs | (1) |
| Reset complete time (SLPIN mode) | tREST | - | 15 | ms | (2) |
| Reset complete time (SLPOUT mode) | - | 120 | ms | (2) |
3.6 Electro-Optical Characteristics
| Item | Symbol | Condition | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| Response time | Tr+Tf | θx=θy=0 | --- | 25 | 35 | ms |
| Contrast Ratio | CR | θx=θy=0 | 900 | 1200 | --- | --- |
| Transmittance | T% | θx=θy=0 | 4.3 | 4.8 | --- | % |
| White Color Chromaticity (CIE1931) | Wx | θx=θy=0 | --- | 0.309 | --- | --- |
| Wy | θx=θy=0 | --- | 0.338 | --- | --- | |
| Viewing angle (CR > 10) | θT (Top) | --- | 70 | 80 | --- | Deg. |
| θB (Bottom) | --- | 70 | 80 | --- | Deg. | |
| θL (Left) | --- | 70 | 80 | --- | Deg. | |
| θR (Right) | --- | 70 | 80 | --- | Deg. | |
| LCM Luminance | L | IF=40mA | --- | 500 | --- | cd/m² |
3.7 Records of Version
| Version | Revise Date | Page | Content |
|---|---|---|---|
| V1 | 2025-12-3 | ALL | New released |
| V2 | 2026-2-4 | 5 | 修改了1.3mm泡棉胶 (Modified 1.3mm foam tape) |
3.8 Design Notes from Documentation
- B/L Driver: The backlight driving condition is IF=40mA, Vf=22.4V (TYP) for the 14-Chip White LED configuration.
- Mechanical: Tolerance of segments to edge of glass: ±0.2mm. Steel plate reinforcement (钢片补强 T=0.2) is included. The FPC includes PI reinforcement with a total thickness of 0.3mm (FPC+PI补强). Yellow insulating tape is used for protection. Conductive double-sided tape (T=0.05mm) is used. New in V2: 1.3mm double-sided foam tape (1.3mm双面泡棉胶).
- Housing: It is recommended that the housing visual area be at least 0.3mm smaller than the VA (Viewing Area) on each side. The housing foam window should be at least 0.6mm larger than the VA on each side. TP edge should not contact metal conductors to avoid ESD or short circuit risks.
- RoHS: RoHS compliance is expected.
4. Application Guidelines & Critical Notes
- Power Supply: The module requires a 2.8V (Typ.) power supply for VCC and 1.8V (Typ.) for IOVCC. Ensure the power supply ripple is minimized.
- Interface: This module uses a standard 4-Lane MIPI DSI protocol. The host processor must be configured for this protocol.
- Backlight Driver (External): An external constant current driver is required to supply a typical current of 40mA at a forward voltage of 22.4V.
- Reset: A hardware reset pin (RESET, Pin 24) is provided. A low pulse of at least 10µs is required for a valid reset. It is necessary to wait 15msec after releasing NRESET before sending commands.
- Handling Precautions: Handle the module with care to avoid damage to the glass or FPC. Ground yourself to prevent electrostatic discharge (ESD).
5. Conclusion & Design-In Support
The LSL050I26-MP-V2 from Lesson Smart Display Technology is a 5.0-inch IPS TFT-LCD module. It is a high-resolution, high-brightness, wide-viewing-angle display solution suitable for a wide variety of embedded display applications such as industrial HMI, smart home devices, and portable instruments.
For successful design-in, engineers should:
- Obtain and review the complete, official Product Specification (Revision 1.0) for the full mechanical drawing and the FL7703NI driver IC datasheet for detailed command initialization.
- Design a clean 2.8V/1.8V power supply and a backlight constant current driver circuit capable of delivering 40mA at 22.4V.
- Configure the host processor's MIPI DSI interface to match the timing specifications detailed in this datasheet.
- Contact the manufacturer for evaluation modules, sample requests, and further technical support during the design-in phase.
This module is designed to provide a reliable and vibrant display solution for a wide array of applications.
