LS0395I15-MP-V2: 3.95-Inch IPS TFT LCD Module, 720x720 Resolution, 16.7M Colors, MIPI DSI Interface, High Brightness

Product Main Title:
LS0395I15-MP-V2: 3.95-Inch IPS TFT LCD Module, 720x720 Resolution, 16.7M Colors, MIPI DSI Interface, High Brightness

Product Subtitle / Keywords:
3.95 Inch Square Display, 720x720 High Resolution, Transmissive a-Si IPS TFT, MIPI DSI Interface, COG+FPC+B/L, 16.7 Million Colors, 500 cd/m² Luminance, Wide Viewing Angle, Detailed DSI Timing

Comprehensive Technical Specification & Application Guide

1. Executive Summary & Product Positioning

The LS0395I15-MP-V2, developed by LESSON (Wan'an) Zhixian Technology Co., Ltd., is a high-performance 3.95-inch transmissive amorphous Silicon TFT-LCD module featuring IPS (In-Plane Switching) technology for wide viewing angles. This product specification book is the definitive technical document, meticulously detailing its structural composition (COG+FPC+B/L), mechanical dimensions, absolute maximum ratings, detailed electrical characteristics, precise MIPI DSI (Display Serial Interface) high-speed and low-power mode timing, and comprehensive electro-optical performance. It delivers a high square resolution of 720(RGB)×720 with true 16.7M-color (RGB888) display capability and a high typical brightness of 500 cd/m². The document provides a complete foundation for integration into advanced display systems. The unequivocal recommendation for engineers is to strictly adhere to the mechanical tolerances, dual power supply limits, detailed DSI timing parameters, and optical specifications described herein to ensure reliable high-speed data transmission and optimal display quality.

2. Detailed Product Overview & Architecture

  • Core Technology: Transmissive-type a-Si TFT-LCD with IPS technology.
  • Display Characteristics: Capable of displaying up to 16.7 million colors.
  • Module Construction: COG (Chip-On-Glass) + FPC (Flexible Printed Circuit) + B/L (Backlight Unit). Composed of a TFT-LCD panel, a driver circuit, and a backlight unit.
  • Interface: MIPI DSI (Display Serial Interface) – a high-speed differential serial interface.
  • Viewing Direction: IPS (wide viewing angle).
  • Version: V2 (Revision/update of LS0395I15-MP-V1).

3. Exhaustive Technical Specifications

3.1 Mechanical & Physical Specifications

Item Specification Unit
LCM+LENS Module size (H×V×D) 74.83 × 78.98 × 2.07 mm
Active area (H×V) 71.93 × 71.93 mm
Number of dots / Resolution 720(RGB) × 720 pixel
Panel Size (Diagonal) 3.95 inch

3.2 Electrical & Interface Specifications

3.2.1 Absolute Maximum Ratings

Item Symbol Min Max Unit Remark
Supply voltage (I/O) IOVCC -0.3 5.5 V  
Supply voltage (Analog) VCI -0.3 6.6 V  
Operating temperature TOPR -20 70 °C  
Storage temperature TSTR -30 80 °C  

3.2.2 Recommended Operating Conditions (DC)

Item Symbol Min Typ Max Unit Condition
I/O Supply voltage IOVCC 1.65 -- 3.3 V  
Analog Supply voltage VCI 2.3 -- 3.3 V  
Ambient Temperature TA -30 -- 70 °C  

3.2.3 Pin Description (Partial, from 24-pin FPC)

PIN NO. Symbol I/O Description
11 D2N I High-speed interface data differential signal input (lane 2, negative).
12 D2P I High-speed interface data differential signal input (lane 2, positive).
13 GND P Ground.
14 D3N I High-speed interface data differential signal input (lane 3, negative).
15 D3P I High-speed interface data differential signal input (lane 3, positive).
16, 17, 18, 24 GND P Ground.
19, 20 LEDK P Power for LED backlight cathode.
21, 22 LEDA P Power for LED backlight anode.
23 NC   Not Connected.

(Note: Pins 1-10 for Clock Lane and Data Lane 0/1 are not shown in the excerpt but are standard for a multi-lane DSI interface.)

3.2.4 MIPI DSI Interface Timing Characteristics

A. Low Power (LP) Mode Characteristics:

Signal Item Symbol Min Typ Max Unit
DSI_DxP/N Length of LP states (Host → Module) TLPXM 50 - - ns
DSI_DxP/N Length of LP states (Module → Host) TLPXD 50 - - ns
DSI_DxP/N Time-out before MPU starts driver TTA-SURE TLPXD - 2xTLPXD ns
DSI_DxP/N Time for module to drive LP-00 TTA-GET 5xTLPXD - - ns
DSI_DxP/N Time to drive LP-00 after host turnaround request TTAGO 4xTLPXD - - ns

B. High-Speed (HS) Mode Transition Timing:

Signal Item Symbol Min Typ Max Unit
DSI_DxP/N Time to prepare for HS transmission THS-PREPARE 40+4UI - 85+6UI ns
DSI_DxP/N Time to enable data line termination THS-TERM-EN - - 35+4UI ns

(UI = Unit Interval, which is the period of one HS clock bit)

3.2.5 Reset Timing

Symbol Parameter Related Pins Min Typ Max Note Unit
tRESW Reset low pulse width NRESET 10 - - - µs
tREST Reset completion time - 15 - - When reset in SLPIN mode ms
tREST Reset completion time - 120 - - When reset in SLPOUT mode ms

3.2.6 Backlight Unit

  • Configuration: LED backlight (implied by LEDA/LEDK pins).
  • Drive Condition (Optical Spec): Forward Current (I_F) = 40 mA (Typical).

3.3 Optical & Electro-Optical Characteristics (Ta=25°C, I_F=40mA)

Item Symbol Condition Min. Typ. Max. Unit Remark
LCM Luminance L θx=θy=0 - 500 - cd/m² Note4
Contrast Ratio CR θx=θy=0 900 1200 - - Note2
Response Time Tr+Tf θx=θy=0 - 30 40 ms Note1
Transmittance T% θx=θy=0 4.2 4.8 - %  
Color Chromaticity (White) W x θx=θy=0 - 0.294 - - CIE1931
Color Chromaticity (White) W y θx=θy=0 - 0.323 - - CIE1931
Viewing Angle (CR>10) θT, θB, θL, θR - 80 85 - Deg. Note3

Notes (Interpreted):

  1. Response time measured between 10% and 90% levels.
  2. Contrast ratio measured with a standard checkerboard pattern.
  3. Viewing angles (Top, Bottom, Left, Right) defined where contrast ratio exceeds 10.
  4. Luminance measured at center point with specified LED current.

4. Application Guidelines & Critical Notes

  • Intended Use: Advanced HMIs, portable medical devices, high-end consumer electronics (e.g., action cameras, drones), industrial control panels—applications demanding high resolution, excellent color, wide viewing angles, and a compact square form factor.
  • Critical Design Considerations:
    1. MIPI DSI Host Required: This module necessitates a host processor or bridge chip with a MIPI DSI transmitter. The interface is not compatible with simple MCU parallel or SPI buses.
    2. Dual Power Supplies: Provide clean, stable power for VCI (2.3-3.3V, analog) and IOVCC (1.65-3.3V, digital I/O). Note their different absolute maximum ratings (6.6V for VCI, 5.5V for IOVCC).
    3. DSI Timing Compliance: The host DSI controller must strictly adhere to the LP and HS mode timing parameters (TLPXM, THS-PREPARE, etc.). Incorrect timing can cause communication failures or image corruption.
    4. Impedance Control & Layout: The DSI differential pairs (CLKP/N, DxP/N) require controlled impedance (typically 100Ω differential), length matching, and proper routing away from noise sources on the PCB.
    5. Multiple Ground Pins: Connect all GND pins (e.g., 13, 16, 17, 18, 24) to a solid ground plane for optimal signal integrity and noise immunity.
    6. High Brightness Backlight: The 500 cd/m² typical luminance enables good visibility in bright environments. Design an appropriate constant-current driver for the LED backlight (40mA typical).
    7. Reset Timing: Respect the minimum 10µs reset pulse width (tRESW). Be aware of the longer reset completion time (120ms) if reset is asserted while the display is in SLPOUT (normal operation) mode.
    8. Mechanical Integration: Follow the outline dimensions. The module thickness is 2.07mm. Ensure the housing design avoids pressure on the active area.
  • Handling & Compliance: The module is assumed to be ROHS compliant. Observe stringent ESD precautions, especially on the exposed FPC contacts.

5. Conclusion & Design-In Support

The LS0395I15-MP-V2 specification details a modern, high-performance 3.95-inch square IPS display module with a MIPI DSI interface. Its key strengths are the high 720x720 resolution, true 16.7M color depth, excellent 85-degree viewing angles, and high 500 cd/m² brightness. The detailed DSI timing specifications are crucial for establishing a reliable high-speed link. The main design challenges involve implementing a MIPI DSI host interface and managing the controlled-impedance differential signaling. For engineers equipped with a compatible host processor, this module offers a premium display solution capable of delivering sharp, vibrant, and wide-angle visuals for demanding embedded graphical applications.