Product Main Title:
LSL050I26-MP-V2: 5.0-Inch IPS TFT LCD Module, 720x1280 Resolution, 16.7M Colors, MIPI DSI Interface
Product Subtitle / Keywords:
5.0 Inch Display, HD 720x1280 Resolution, Transmissive a-Si IPS TFT, MIPI DSI Interface, COG+FPC+B/L, 16.7 Million Colors, 500 cd/m² Luminance, Wide Viewing Angle, FL7703NI Driver
Comprehensive Technical Specification & Application Guide
1. Executive Summary & Product Positioning
The LSL050I26-MP-V2, developed by LESSON (Wan'an) Zhixian Technology Co., Ltd., is a high-performance 5.0-inch transmissive amorphous Silicon TFT-LCD module featuring IPS (In-Plane Switching) technology. This product specification book is the definitive technical document, meticulously detailing its structural composition (COG+FPC+B/L), mechanical dimensions, absolute maximum ratings, detailed electrical characteristics, precise MIPI DSI (Display Serial Interface) high-speed and low-power mode timing, and comprehensive electro-optical performance. It delivers an HD resolution of 720(RGB)×1280 with true 16.7M-color (RGB888) display capability and a high typical brightness of 500 cd/m². The document provides a complete foundation for integration into advanced display systems. The unequivocal recommendation for engineers is to strictly adhere to the mechanical tolerances, dual power supply limits, detailed DSI timing parameters, and optical specifications described herein to ensure reliable high-speed data transmission and optimal display quality.
2. Detailed Product Overview & Architecture
- Core Technology: Transmissive-type a-Si TFT-LCD with IPS technology.
- Display Characteristics: Capable of displaying up to 16.7 million colors.
- Module Construction: COG (Chip-On-Glass) + FPC (Flexible Printed Circuit) + B/L (Backlight Unit). Composed of a TFT-LCD panel, a driver circuit (FL7703NI), and a backlight unit.
- Interface: MIPI DSI (Display Serial Interface) – a high-speed differential serial interface.
- Input Data: Standard MIPI signal input.
- Viewing Direction: IPS (wide viewing angle).
- Version: V2 (Updated revision).
3. Exhaustive Technical Specifications
3.1 Mechanical & Physical Specifications
| Item | Specification | Unit |
|---|---|---|
| LCM+LENS Module size (H×V×D) | 70.6 × 125.8 × 3.09 (含背胶) | mm |
| Active area (H×V) | 62.1 × 110.4 | mm |
| Number of dots / Resolution | 720(RGB) × 1280 | pixel |
| Panel Size (Diagonal) | 5.0 | inch |
3.2 Electrical & Interface Specifications
3.2.1 Absolute Maximum Ratings
| Item | Symbol | Min | Max | Unit | Remark |
|---|---|---|---|---|---|
| Supply voltage (Analog) | VCC | -0.3 | 6.6 | V | |
| I/O Supply voltage | IOVCC | -0.3 | 5.5 | V | |
| Operating temperature | TOPR | -20 | 70 | °C | |
| Storage temperature | TSTR | -30 | 80 | °C |
3.2.2 Electrical Characteristics (DC)
| Item | Symbol | Min | Typ | Max | Unit | Remark |
|---|---|---|---|---|---|---|
| Supply voltage (Analog) | VCC | 2.5 | 2.8 | 3.3 | V | Note1 |
| I/O Supply voltage | IOVCC | 1.65 | 1.8 | 2.0 | V | Note1 |
| Input Voltage (Low level) | VIL | 0 | -- | 0.3 * IOVCC | V | Note1 |
| Input Voltage (High level) | VIH | 0.7 * IOVCC | -- | IOVCC | V | Note1 |
Note1: Typical operating condition.
3.2.3 Pin Description (25-pin FPC)
| PIN NO. | Symbol | I/O | Description |
|---|---|---|---|
| 1, 4, 7, 10, 13, 16, 17 | GND | P | Ground. |
| 2 | D0P | I/O | High-speed interface data differential signal (Lane 0, positive). |
| 3 | D0N | I/O | High-speed interface data differential signal (Lane 0, negative). |
| 5 | D1P | I | High-speed interface data differential signal (Lane 1, positive). |
| 6 | D1N | I | High-speed interface data differential signal (Lane 1, negative). |
| 8 | CLKP | I | High-speed interface clock differential signal (positive). |
| 9 | CLKN | I | High-speed interface clock differential signal (negative). |
| 11 | D2P | I | High-speed interface data differential signal (Lane 2, positive). |
| 12 | D2N | I | High-speed interface data differential signal (Lane 2, negative). |
| 14 | D3P | I | High-speed interface data differential signal (Lane 3, positive). |
| 15 | D3N | I | High-speed interface data differential signal (Lane 3, negative). |
| 18, 19 | IOVCC | P | I/O Logic Power supply. |
| 20, 22, 23 | NC | Not Connected. | |
| 21 | ID | O | ID pin. |
| 24 | RESET | I | Reset pin. |
| 25 | TE | O | Tearing Effect output pin. |
3.2.4 MIPI DSI Interface Timing Characteristics
A. High-Speed (HS) Mode Characteristics:
Conditions: V=0V, IOVCC=1.65V to 3.3V, VCI=2.5V to 3.3V, TA = -30 to 70°C.
| Signal | Item | Symbol | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| DSI_CP/CN | Double UI instantaneous | 2xUINST | 3.30 (4LANE) | - | 25 | ns |
| DSI_CP/CN | UI instantaneous | UINSTA/B | 1.67 (4LANE) | - | 12.5 | ns |
| DP/DN | Data to clock setup time | TDS | 0.15xUI | - | - | ps |
| DP/DN | Data to clock hold time | TDH | 0.15xUI | - | - | ps |
| DSI_CP/CN | Differential rise/fall time (clock) | TDRTCLK/TDFTCLK | 150 | - | 0.3UI | ps |
| DP/DN | Differential rise/fall time (data) | TDRTDATA/TDFTDATA | 150 | - | 0.3UI | ps |
B. Low Power (LP) Mode Characteristics:
Conditions: V=0V, IOVCC=1.65V to 3.3V, VCI=2.3V to 3.3V, TA = -30 to 70°C.
| Signal | Item | Symbol | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| DSI_DxP/N | Length of LP states (Host→Module) | T_LPXM | 50 | - | - | ns |
| DSI_DxP/N | Length of LP states (Module→Host) | T_LPXD | 50 | - | - | ns |
| DSI_DxP/N | Time-out before MPU starts driver | T_TA-SURE | T_LPXD | - | 2xT_LPXD | ns |
| DSI_DxP/N | Time for module to drive LP-00 | T_TA-GET | 5xT_LPXD | - | - | ns |
| DSI_DxP/N | Time to drive LP-00 after host request | T_TAGO | 4xT_LPXD | - | - | ns |
(UI = Unit Interval, the period of one HS clock bit)
3.2.5 Backlight Unit
- Configuration: LED backlight.
- Drive Condition (Optical Spec): Forward Current (I_F) = 40 mA (Typical).
- Voltage: 22.4V (implied from content fragment).
3.3 Optical & Electro-Optical Characteristics (Ta=25°C, I_F=40mA)
| Item | Symbol | Condition | Min. | Typ. | Max. | Unit | Remark |
|---|---|---|---|---|---|---|---|
| LCM Luminance | L | θx=θy=0 | - | 500 | - | cd/m² | Note4 |
| Contrast Ratio | CR | θx=θy=0 | 900 | 1200 | - | - | Note2 |
| Response Time | Tr+Tf | θx=θy=0 | - | 25 | 35 | ms | Note1 |
| Transmittance | T% | θx=θy=0 | 4.3 | 4.8 | - | % | |
| Color Chromaticity (White) | W x | θx=θy=0 | - | 0.309 | - | - | CIE1931 |
| Color Chromaticity (White) | W y | θx=θy=0 | - | 0.338 | - | - | CIE1931 |
| Viewing Angle (CR>10) | θT, θB, θL, θR | - | 70 | 80 | - | Deg. | Note3 |
Notes (Interpreted):
- Response time measured between 10% and 90% levels.
- Contrast ratio measured with a standard pattern.
- Viewing angles (Top, Bottom, Left, Right) defined where contrast ratio exceeds 10.
- Luminance measured at center point with specified LED current.
4. Application Guidelines & Critical Notes
- Intended Use: Advanced HMIs, portable medical devices, industrial control panels, automotive displays, high-end consumer electronics—applications demanding high resolution, excellent color, wide viewing angles, and bright output.
- Critical Design Considerations:
- MIPI DSI Host Required: This module necessitates a host processor or bridge chip with a MIPI DSI transmitter. The interface is not compatible with simple MCU parallel or SPI buses.
- Dual Power Supplies: Provide clean, stable power for VCC (2.5-3.3V, analog) and IOVCC (1.65-2.0V, digital I/O). Note the IOVCC max is specified as 2.0V in the recommended operating conditions, differing from the absolute max of 5.5V.
- DSI Timing Compliance: The host DSI controller must strictly adhere to the detailed LP and HS mode timing parameters (T_LPXM, T_TA-SURE, TDS, TDH, etc.). Incorrect timing can cause communication failures.
- Impedance Control & Layout: The DSI differential pairs (CLKP/N, DxP/N) require controlled impedance (typically 100Ω differential), strict length matching, and proper routing away from noise sources on the PCB. Multiple ground pins are provided for shielding.
- High Voltage Backlight: The backlight may require a boost converter to generate the ~22.4V drive voltage at 40mA. Design an appropriate constant-current driver.
- Mechanical Integration: The module size includes adhesive tape (背胶). Total thickness is 3.09mm. Ensure the housing design accommodates this and avoids pressure on the active area.
- Temperature Range: Operate within -20°C to +70°C.
- Handling & Compliance: The module is assumed to be ROHS compliant. Observe stringent ESD precautions on the exposed FPC contacts.
5. Conclusion & Design-In Support
The LSL050I26-MP-V2 specification details a modern, high-performance 5.0-inch HD IPS display module with a MIPI DSI interface. Its key strengths are the HD 720x1280 resolution, true 16.7M color depth, good 80-degree viewing angles, and high 500 cd/m² brightness. The exceptionally detailed DSI timing specifications for both HS and LP modes are crucial for establishing a reliable high-speed link. The main design challenges involve implementing a MIPI DSI host interface, managing controlled-impedance differential signaling, and designing a suitable high-voltage LED driver. For engineers with a compatible host processor, this module offers a premium display solution capable of delivering sharp, vibrant, and wide-angle visuals for demanding embedded graphical applications.
